Abstract: An in situ method for forming a bypass capacitor element internally within a PCB comprising the steps of arranging one or more uncured dielectric sheets with conductive foils on opposite sides thereof and laminating the conductive foils to the dielectric sheet simultaneously as the PCB is formed by a final lamination step, the conductive foils preferably being laminated to another layer of the PCB prior to their arrangement adjacent the dielectric sheet or sheets, the dielectric foils even more preferably being initially laminated to additional dielectric sheets in order to form multiple bypass capacitive elements as a compound subassembly within the PCB. A number of different dielectric materials and resins are disclosed for forming the capacitor element.

Abstract: A circuit component assembly and a method for forming the assembly as an annular body in a laminate, preferably between a trough-hole or via and a surrounding conductive layer in a PCB are disclosed, the circuit component assembly including one or more resistors/conductors, inductors and dielectrics/capacitors or combinations thereof, outer and inner peripheries of the circuit component preferably having substantially constant radii permitting simple determination of operative electrical characteristics for the circuit component from (a) the inner and outer radii, (b) an effective thickness for the circuit component and (c) its electrical characteristics determined by the material formed in the annular recess, the circuit component body preferably being formed from a liquid precursor forming conductive interconnections for the circuit component assembly at its outer and inner perimeters.

Abstract: A circuit component assembly and a method for forming the assembly as an annular body in a laminate, preferably between a trough-hole or via and a surrounding conductive layer in a PCB are disclosed, the circuit component assembly including one or more resistors/conductors, inductors and dielectrics/capacitors or combinations thereof, outer and inner peripheries of the circuit component preferably having substantially constant radii permitting simple determination of operative electrical characteristics for the circuit component from (a) the inner and outer radii, (b) an effective thickness for the circuit component and (c) its electrical characteristics determined by the material formed in the annular recess, the circuit component body preferably being formed from a liquid precursor forming conductive interconnections for the circuit component assembly at its outer and inner perimeters.

Abstract: A circuit board and method of forming a circuit board with signal and receptor pads arranged on layers spaced apart in a Z direction with a dielectric layer therebetween, parameters of a resulting AC signal transmitting circuit resulting wherein:capacitive reactance is defined by the equation (I) ##EQU1## where F is frequency and C is capacitance; inductive reactance is defined by the equation (II)X.sub.L =2.pi.FLwhere F is frequency and L is inductance;capacitance is defined by the equation (III) ##EQU2## where A is the effective mutual area of the signal and receptor pads, D is Faraday's constant, E is the dielectric constant, and .tau. is the thickness of the dielectric layer; andinductance is defined by the equation (IV)L=0.005 ln (4h/d).mu.H/in.where ln indicates the natural logarithm for the value 4h/d, where h is the distance above a ground plane, and d is the equivalent diameter of a conductor;wherein capacitance and inductance are established in equations I and II with X.sub.C and X.sub.

Abstract: A resistor and method of forming the resistor as an annular resistor body between a conductive pad surrounding a through-hole in the PCB and a surrounding conductive layer, the annular resistor body being formed from a conductive material having a selected resistivity, the outer and inner perimeters of the annular resistor body preferably being substantially constant radii whereby the operative resistance of the annular resistor body may be simply determined from the radii of its outer and inner perimeters, an effective thickness of the annular resistor body and its resistivity, the annular resistor body more preferably being formed from a liquid precursor facilitating formation of conductive interconnections at its outer and inner perimeters.

Abstract: An in situ method for forming a bypass capacitor element internally within a PCB comprising the steps of arranging one or more uncured dielectric sheets with conductive foils on opposite sides thereof and laminating the conductive foils to the dielectric sheet simultaneously as the PCB is formed by a final lamination step, the conductive foils preferably being laminated to another layer of the PCB prior to their arrangement adjacent the dielectric sheet or sheets, the dielectric foils even more preferably being initially laminated to additional dielectric sheets in order to form multiple bypass capacitive elements as a compound subassembly within the PCB.

Abstract: A capacitor laminate is described either as an intermediate product for use in a capacitive printed circuit board or as part of the assembled printed circuit board in order to provide a bypass capacitive function for large numbers of devices mounted or formed on the printed circuit board, the capacitor laminate being formed from sheets of conductive material and an intermediate sheet of dielectric material forming the laminated capacitor as a structurally rigid assembly and facilitating its inclusion within the PCB, components of the capacitor laminate having selected characteristics whereby each individual device is provided with capacitance by a proportional portion of the capacitor laminate and by borrowed capacitance from other portions of the capacitor laminate, the capacitive function of the capacitor laminate being dependent upon random firing or operation of the devices. Methods of manufacture for the capacitor laminate as well as the capacitive PCB are also described.

Abstract: A capacitor laminate is described either as an intermediate product for use in a capacitive printed circuit board or as part of the assembled printed circuit board in order to provide a bypass capacitive function for large numbers of devices mounted or formed on the printed circuit board, the capacitor laminate being formed from sheets of conductive material and an intermediate sheet of dielectric material forming the laminated capacitor as a structurally rigid assembly and facilitating its inclusion within the PCB, components of the capacitor laminate having selected characteristics whereby each individual device is provided with capacitance by a proportional portion of the capacitor laminate and by borrowed capacitance from other portions of the capacitor laminate, the capacitive function of the capacitor laminate being dependent upon random firing or operation of the devices. Methods of manufacture for the capacitor laminate as well as the capacitive PCB are also described.

Abstract: Rigid-flex printed circuit boards (PCBs) are fabricated by an improved and simplified process to form the PCBs from rigid-flex PCB subassemblies with both rigid and flex sections incorporating suitable insulator materials. The flex sections of the PCB subassemblies are protectively covered by insulating layers formed by deposition of a liquid precursor for the insulator material and curing of the liquid precursor to form the insulating layers.

Abstract: A capacitor laminate is described either as an intermediate product for use in a capacitive printed circuit board or as part of the assembled printed circuit board in order to provide a bypass capacitive function for large numbers of devices mounted or formed on the printed circuit board, the capacitor laminate being formed from sheets of conductive material and an intermediate sheet of dielectric material forming the laminated capacitor as a structurally rigid assembly and facilitating its inclusion within the PCB, components of the capacitor laminate having selected characteristics whereby each individual device is provided with capacitance by a proportional portion of the capacitor laminate and by borrowed capacitance from other portions of the capacitor laminate, the capacitive function of the capacitor laminate being dependent upon random firing or operation of the devices. Methods of manufacture for the capacitor laminate as well as the capacitive PCB are also described.

Abstract: A method of conditioning separator mold plates for repeated use in high temperature sequential molding of printed circuit board laminates comprises the step of integrally applying at least one thin, continuous coat, preferably on the order of about 1 microinch, of a silane-based mold release composition prior to each sequential molding operation for facilitating repeated use of the plates in sequential molding operations the silane-based mold release composition is preferably applied in a continuous automated process including a spray gun, preferably of an air atomized type and more preferably of a high transfer efficiency type, for applying the coating followed by an infrared heating step, the separator mold plates being carried by a conveyor through a tunnel including the spray gun and infrared heater.