Patents Examined by A. A. Owens
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Patent number: 11948369Abstract: The described positional awareness techniques employing visual-inertial sensory data gathering and analysis hardware with reference to specific example implementations implement improvements in the use of sensors, techniques and hardware design that can enable specific embodiments to provide positional awareness to machines with improved speed and accuracy.Type: GrantFiled: July 25, 2022Date of Patent: April 2, 2024Assignee: Trifo, Inc.Inventors: Zhe Zhang, Grace Tsai, Shaoshan Liu
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Patent number: 11949863Abstract: In response to a current block being partitioned into a first partition and a second partition based on a geometric partition mode, a first prediction type for the first partition and a second prediction type for the second partition are determined based on a flag associated with one of intra prediction, inter prediction, and intra block copy (IBC). Each of the first and second prediction types is one of the intra prediction, the inter prediction, and the IBC. Based on the first prediction type, a first prediction mode for the first partition of the current block is determined. Based on the second prediction type, a second prediction mode for the second partition of the current block is determined. The first partition of the current block is reconstructed based on the first prediction mode and the second partition of the current block is reconstructed based on the second prediction mode.Type: GrantFiled: July 29, 2022Date of Patent: April 2, 2024Assignee: TENCENT AMERICA LLCInventors: Lien-Fei Chen, Xiang Li, Ling Li, Shan Liu
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Patent number: 11950513Abstract: A method for fabricating a semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a first metal interconnection and a second metal interconnection in the first IMD layer; forming a channel layer on the first metal interconnection and the second metal interconnection; forming a magnetic tunneling junction (MTJ) stack on the channel layer; and removing the MTJ stack to form a MTJ.Type: GrantFiled: July 5, 2022Date of Patent: April 2, 2024Assignee: UNITED MICROELECTRONICS CORP.Inventors: Hui-Lin Wang, Wei Chen, Po-Kai Hsu, Yu-Ping Wang, Hung-Yueh Chen
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Patent number: 11947107Abstract: A method for recovering an image passing through a display and taken by an image sensor disposed on a rear side of the display, the method includes acquiring the image taken by the image sensor, obtaining a plurality of point spread functions corresponding one-to-one to a plurality of dots arranged in a predetermined pattern on a calibration chart, and recovering the image by performing a de-convolution of the image based on the plurality of point spread functions.Type: GrantFiled: March 17, 2021Date of Patent: April 2, 2024Assignee: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.Inventor: Hirotake Cho
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Patent number: 11947251Abstract: An illumination system provides an illumination beam and includes a red light source, a green light source, a blue light source, a first supplementary light source, a first X-shaped light-splitting assembly, a first light-splitting element, and a light-uniforming element. The red light source provides a red beam. The green light source provides a green beam. The blue light source provides a blue beam. The first supplementary light source provides a first supplementary beam. The first X-shaped light-splitting assembly guides the first supplementary beam and the blue beam to the first light-splitting element. The first light-splitting element guides the red beam, the green beam, the blue beam, and the first supplementary beam to the light-uniforming element. The first supplementary beam is a red supplementary beam or a blue supplementary beam, and the illumination system includes at least five light-emitting elements. A projection apparatus including the above illumination system is also provided.Type: GrantFiled: March 23, 2022Date of Patent: April 2, 2024Assignee: Coretronic CorporationInventors: Chi-Fu Liu, Tsung-Hsin Liao, Chun-Li Chen, Hung-Yu Lin
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Patent number: 11948914Abstract: A package structure and a method of forming the same are provided. The package structure includes a package substrate, a semiconductor chip disposed over the package substrate, and an integrated device located below and bonded to the lower surface of the semiconductor chip. The semiconductor chip has a lower surface facing the package substrate and is electrically connected to the package substrate through conductive structures. The integrated device is laterally surrounded by the conductive structures, and the integrated device and the conductive structures are located within boundaries of the semiconductor chip when viewed in a direction perpendicular to the lower surface of the semiconductor chip.Type: GrantFiled: July 20, 2022Date of Patent: April 2, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Feng-Cheng Hsu, Shin-Puu Jeng, Shuo-Mao Chen
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Patent number: 11947109Abstract: It is an object of the present invention to provide a projection image-displaying member having excellent suitability for polarizing sunglasses, a windshield glass, and a head-up display system. The projection image-displaying member has a first polarization converting layer, at least one selectively reflecting layer, and a second polarization converting layer in this order. The first polarization converting layer and the second polarization converting layer are layers formed by fixing a helical alignment structure of a liquid crystal compound. The number of pitches in the helical alignment structure and a film thickness satisfy all relational expressions below. When the first polarization converting layer has a number of pitches x1 and a film thickness y1 (unit: ?m), 0.3?x1?2.0 and??(i) y1?1.86x1+0.13.??(ii) When the second polarization converting layer has a number of pitches x2 and a film thickness y2 (unit: ?m), 0.25?x2?2.0,??(iii) y2?1.37x2+5.5, and??(iv) y2?1.37x2+0.25.Type: GrantFiled: June 9, 2021Date of Patent: April 2, 2024Assignee: FUJIFILM CorporationInventors: Akihiro Anzai, Yujiro Yanai, Wataru Majima, Taketo Otani
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Patent number: 11943944Abstract: A novel light-emitting device is provided. Alternatively, a light-emitting device having a long driving lifetime at high temperature is provided. The light-emitting device includes an anode, a cathode, and an EL layer positioned between the anode and the cathode. The EL layer includes a first layer, a second layer, a third layer, and a light-emitting layer in this order from the anode side. The first layer includes a first organic compound and a second organic compound. The second layer includes a third organic compound. The third layer includes a fourth organic compound. The light-emitting layer includes a fifth organic compound and an emission center substance. The first organic compound exhibits an electron-accepting property with respect to the second organic compound. A difference between HOMO levels of the fourth organic compound and the fifth organic compound is less than or equal to 0.24 eV.Type: GrantFiled: January 16, 2020Date of Patent: March 26, 2024Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Yusuke Takita, Tsunenori Suzuki, Naoaki Hashimoto, Takumu Okuyama, Satoshi Seo
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Patent number: 11940721Abstract: A projection display device and a projection display equipment are provided. The projection display device includes a display screen body, a photosensitive device, and a control module. The control module is electrically connected to the display screen body, the photosensitive device outputs a photosensitive signal when sensing a projection light beam, and the control module is electrically connected to the photosensitive device to receive the photosensitive signal and to control a section on the display screen body corresponding to a projection position of the projection light beam to be converted from a transparent state to an opaque state according to the photosensitive signal.Type: GrantFiled: May 15, 2020Date of Patent: March 26, 2024Assignee: Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.Inventors: Lei Wen, Zhiqing Shi, Miao Jiang, Jiangbo Yao, Lixuan Chen, Xin Zhang
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Patent number: 11942406Abstract: A semiconductor package may include a semiconductor package first side, an embedded bridge interconnect, a first via, and a second via. The bridge interconnect may include a bridge interconnect first side with a conductive pad and a bridge interconnect second side. The distance between the bridge interconnect first side and the semiconductor package first side may be less than a distance between the bridge interconnect second side and the semiconductor package first side. The first and second vias may each include a first end that is narrower than s second end. The semiconductor package first side may be closer to the first end of the first via than the second end of the first via, and closer to the second end of the second via than the first end of the second via. The first side of the semiconductor package may be configured to electrically couple to a die.Type: GrantFiled: June 7, 2022Date of Patent: March 26, 2024Assignee: Intel CorporationInventors: Kyu Oh Lee, Dilan Seneviratne, Ravindranadh T Eluri
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Patent number: 11943469Abstract: A video decoding method and device for determining whether a prediction mode of a current block is an affine mode; splitting, when the prediction mode of the current block is the affine mode, a luma block of the current block into a plurality of sub luma blocks having a square shape based on a predefined sub block size; determining a mean luma motion vector for four neighboring sub luma blocks among the plurality of sub luma blocks, by using a motion vector of an upper-left sub luma block of the four sub luma blocks and a motion vector of a lower-right sub luma block of the four sub luma blocks; determining the mean luma motion vector to be a motion vector of a current sub chroma block corresponding to the four sub luma blocks; and performing prediction on the current sub chroma block by using the determined motion vector, in a video encoding and decoding process are suggested.Type: GrantFiled: July 8, 2022Date of Patent: March 26, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Anish Tamse, Minwoo Park, Gahyun Ryu, Minsoo Park, Seungsoo Jeong, Kiho Choi, Narae Choi, Woongil Choi, Yinji Piao
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Patent number: 11935905Abstract: An imaging device comprises pixels. The pixel includes first semiconductor regions of a first conductivity type provided in a surface part of a semiconductor substrate and a second semiconductor region of a second conductivity type provided in the surface part of the semiconductor substrate between the first semiconductor regions. The pixel includes: a light-receiving unit in which photodiodes each configured between the second semiconductor region and one of the first semiconductor regions; quenching circuits, each connected to a corresponding one of the first semiconductor regions; and a counter unit connected to each of connection nodes between the first semiconductor regions and the quenching circuits and counts a pulse generated in response to a photon being incident on the light-receiving unit. The second semiconductor region is provided across a deeper part of the semiconductor substrate than the first semiconductor regions.Type: GrantFiled: October 5, 2020Date of Patent: March 19, 2024Assignee: CANON KABUSHIKI KAISHAInventors: Hirokazu Kobayashi, Hisataka Hirose, Satoshi Kumaki, Yasuhiro Matsuo
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Patent number: 11936862Abstract: The present disclosure provides a method of coding implemented by a decoding device, the method comprising: obtaining a value of a splitting mode index for a current coding block; obtaining a value of an angle index for the current coding block according to the value of the splitting mode index value and a pre-stored table; setting a value of an index partIdx according to the value of the angle index; and storing motion information for the current coding block according to the value of the index partIdx.Type: GrantFiled: December 31, 2021Date of Patent: March 19, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Han Gao, Semih Esenlik, Elena Alexandrovna Alshina, Anand Meher Kotra, Biao Wang
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Patent number: 11935866Abstract: A semiconductor device includes a first substrate and a second substrate. The semiconductor device includes a plurality of conductive pillars between the first and second substrates. The plurality of conductive pillars includes a first conductive pillar having a first width, wherein the first width is substantially uniform along an entire first height of the first conductive pillar, a second conductive pillar having a second width, wherein the second width is substantially uniform along an entire second height of the second conductive pillar, the first width is different from the second width, and the entire first height is equal to the entire second height, and a third conductive pillar having a third width, wherein the third width is substantially uniform along an entire third height of the third conductive pillar, and the third conductive pillar is between the first conductive pillar and the second conductive pillar in the first direction.Type: GrantFiled: July 22, 2020Date of Patent: March 19, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Jing-Cheng Lin, Po-Hao Tsai
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Patent number: 11933984Abstract: An image light generation device generating image light, a semi-transmissive tilted mirror reflecting the image light from the image light generation device, and a concave semi-transmissive mirror reflecting, toward the semi-transmissive tilted mirror, the image light reflected by the semi-transmissive tilted mirror to form an exit pupil are provided, and the concave semi-transmissive mirror includes a partial reflective film having different reflectance according to wavelength, the semi-transmissive tilted mirror reflects the image light toward the partial reflective film.Type: GrantFiled: July 29, 2021Date of Patent: March 19, 2024Assignee: SEIKO EPSON CORPORATIONInventor: Daiki Matsumoto
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Patent number: 11935043Abstract: The present disclosure is directed to consolidated token routing. First data corresponding to a request to conduct a first transaction is analyzed. A first token is generated for the first transaction. Second data corresponding to a request to conduct a second transaction is analyzed. A second token is generated for the second transaction. In response to determining that at least a first component of the first data corresponds to a first component of the second data, a routing of the first token and a routing of the second token are consolidated. The consolidation of the token routing includes transmitting the first token and the second token to one or more devices in a single transmission.Type: GrantFiled: December 20, 2018Date of Patent: March 19, 2024Assignee: PAYPAL, INC.Inventor: Pankaj Sarin
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Patent number: 11936914Abstract: A video decoding method performed by a video decoding apparatus, according to the present document, comprises the steps of: acquiring general constraint information from a bitstream; parsing, from the bitstream, a flag indicating whether or not the general constraint information includes information about constraints to which output layer sets conform; parsing the information about the constraints in the general constraint information on the basis of the flag; and decoding a current picture on the basis of the information about the constraints, wherein the general constraint information includes number information and alignment information about the constraints, and, within the general constraint information, the alignment information may be present after the number information.Type: GrantFiled: December 2, 2022Date of Patent: March 19, 2024Assignee: LG Electronics Inc.Inventors: Hendry Hendry, Junghak Nam, Seunghwan Kim, Jaehyun Lim
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Patent number: 11936873Abstract: A method of video processing is provided to include determining, for a conversion between a video block of a video having a 4:2:2 color format and a bitstream of the video, a parameter of a cross-component linear model for the video block according to a rule and performing the conversion based on the determining, wherein a syntax element indicates whether chroma samples of the video are vertically shifted relative to luma samples of the video and wherein the rule specifies that the parameter is determined independent of a value of the syntax element.Type: GrantFiled: October 18, 2022Date of Patent: March 19, 2024Assignees: BEIJING BYTEDANCE NETWORK TECHNOLOGY CO., LTD., BYTEDANCE INC.Inventors: Yang Wang, Li Zhang, Kai Zhang, Hongbin Liu, Yue Wang
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Patent number: 11935852Abstract: A semiconductor package includes a substrate, a first insulation layer, a conductive pad, a second insulation layer and a conductive trace. The first insulation layer is formed on the substrate and having a first through hole. The conductive pad is formed on the substrate through the first through hole. The second insulation layer has a first surface and a second through hole, wherein the second through hole extends to the conductive pad from the first surface. The conductive trace has a second surface and is connected to the conductive pad through the second through hole. The entire of the first surface is in the same level, and the entire of the second surface is in the same level.Type: GrantFiled: January 21, 2022Date of Patent: March 19, 2024Assignee: MEDIATEK INC.Inventor: Yan-Liang Ji
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Patent number: 11930161Abstract: A method for decoding a video according to the present invention may comprise: deriving a spatial merge candidate for a current block from at least one of a first spatial neighboring block adjacent to the current block or a second spatial neighboring block adjacent to the first spatial neighboring block, generating a merge candidate list including the spatial merge candidate, and performing a motion compensation for the current block by using the merge candidate list.Type: GrantFiled: October 7, 2021Date of Patent: March 12, 2024Assignee: KT CORPORATIONInventor: Bae Keun Lee