Abstract: A method of using a finishing element having a fixed abrasive finishing surface including organic boundary lubricants for finishing semiconductor wafers is described. The organic lubricants form an organic lubricating boundary layer in the operative finishing interface in a preferred coefficient of friction range. The selected coefficient of friction helps improve finishing and reduces unwanted surface defects. Differential lubricating boundary layer methods are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing.

Abstract: A method of removing a coating from the surface of a hole in a metal-based substrate is described. The coating is scored on or near the surface of the hole. The substrate is then treated with a coating-removal solution under conditions suitable for removing the coating without damaging the substrate or any intervening bond layer. The coating is often a zirconia-based thermal barrier coating. In such a case, a caustic solution is used to remove the coating within an autoclave. The substrate can be a component of a turbine engine.

Abstract: A carrier head for a chemical mechanical polishing apparatus includes a retaining ring having a flexible lower portion and a rigid upper portion.