Abstract: A pickling process designed for pickling a metal strip such as a stainless steel strip reduces the amount of HF and/or HNO3. The strip is immersed in at least one first pickling tub that contains a mixture of an acid such as H2SO4, an excess of at least one oxidizing agent, and includes electrodes that may apply a current to the strip that runs through the mixture.

Abstract: Material lining the inside surface of a section of pipe is removed by a hydrodemolition nozzle assembly mounted on a working end of an elongated boom. The opposed end of the boom is supported outside the pipe on a movable support for inserting and retracting the boom from the inside of the pipe. The nozzles remove the liner while the working end of the boom is supported by a wheel resting on the liner that has not yet been removed and that rolls along the inside liner as the pipe is made to revolve around the boom. The nozzles are oriented to eject the liner and water downstream and away from the boom.

Abstract: The disclosure relates to the cleaning of oilfield tools made of metal, particularly to the method of reclamation oilfield tools, already used in the mechanical deep-pumping extraction of oil, as well as to the product made with the help of the mentioned method. The method of remanufacturing of standard length rods includes cleaning the rod with at least one cryogen to eliminate environmental contamination and to assist in workplace safety.

Abstract: A substrate treatment method is provided, which includes a liquid film retaining step of retaining a liquid film of a treatment liquid on a major surface of a substrate, and a heater heating step of locating a heater in opposed relation to the major surface of the substrate to heat the treatment liquid film by the heater in the liquid film retaining step, wherein an output of the heater is changed from a previous output level in the heater heating step.

Abstract: A method of treating a sensor array including a plurality of sensors and an isolation structure, where a sensor of the plurality of sensors has a sensor pad exposed at a surface of the sensor array and the isolation structure is disposed between the sensor pad and sensor pads of other sensors of the plurality of sensors, comprises exposing the sensor pad and the isolation structure to a non-aqueous organo-silicon solution including an organo-silicon compound and a first non-aqueous carrier; applying an acid solution including an organic acid and a second non-aqueous carrier to the sensor pad; and rinsing the acid solution from the sensor pad and the isolation structure.

Abstract: According to one embodiment, a method for cleaning and requalifying a component of an exhaust aftertreatment system includes inspecting the component using an x-ray processing technique. The method further includes associating the plurality of cleaning techniques with a plurality of compositions of material, and cleaning the component according to at least one of the plurality of cleaning techniques associated with the composition of material.

Abstract: The present invention relates, in part, to cleaning methods and solvent cleaning compositions including at least one hydrofluoro-olefin or hydrochlorofluoro-olefin solvent for use in connection with cleaning of metal parts, and in certain preferred embodiments cleaning metal parts to be used in an aircraft.

Abstract: A system and a method for cleaning a printing cylinder or other printing equipment such as printing plates, ink pans or floors of printing units, the method comprising applying a detergent to the surface to be cleaned, after a period to allow action of the detergent, removing the detergent by rinsing, using a vapor and high velocity air stream, i.e. atomized water fog; or steam; or a combination of steam and air, which allows dislodging particles encrusted within cells of the surface of the piece of equipment to be cleaned.

Abstract: A substrate treatment method is provided, which includes a rinsing step of supplying a rinse liquid to a front surface of a rotating substrate after a chemical liquid step. The rinsing step includes a higher-speed rinsing step and a deceleration rinsing step to be performed after the higher-speed rinsing step. The deceleration rinsing step includes a liquid puddling step of reducing the rotation speed of the substrate within a rotation speed range lower than a rotation speed employed in the higher-speed rinsing step and supplying the rinse liquid to the front surface of the substrate at a flow rate higher than a maximum supply flow rate employed in the higher-speed rinsing step, whereby a puddle-like rinse liquid film is formed on the front surface of the substrate.

Abstract: In one aspect, the present invention relates to a method for displacing fluid from a pipe. The method includes engaging a fluid-displacement system with the pipe. A displacement agent is pumped into the pipe via the fluid-displacement system. Fluid present within the pipe is displaced by the displacement agent. The pipe is manipulated in a desired manner.

Abstract: A cleaning method using vaporized solvent is provided. A solvent-containing vapor is generated, wherein the solvent-containing vapor comprises a solvent. The solvent-containing vapor is conducted to a substrate having debris or contaminants to clean the substrate, wherein the solvent-containing vapor condenses to form a liquid on a surface of the substrate. The liquid phase of the solvent-containing vapor is changed to a solid phase. The solid phase of the solvent-containing vapor is changed back to a liquid phase. The substrate is spun dried to remove the solvent-containing vapor in liquid phase and any debris or contaminants.

Abstract: Implementations described herein generally relate to methods and apparatus for in-situ removal of unwanted deposition buildup from one or more interior surfaces of a semiconductor substrate processing chamber. In one implementation, a method for removing cobalt or cobalt containing deposits from one or more interior surfaces of a substrate processing chamber after processing a substrate disposed in the substrate processing chamber is provided. The method comprises forming a reactive species from the fluorine containing cleaning gas mixture, permitting the reactive species to react with the cobalt and/or the cobalt containing deposits to form cobalt fluoride in a gaseous state and purging the cobalt fluoride in gaseous state out of the substrate processing chamber.

Abstract: In a method of manufacturing an integrated circuit (IC) device, a photomask is wet-processed using a cleaning composition comprising an organic acid, an oxidizing agent, and deionized water (DIW).

Abstract: A device for removing impurities from shredded plastic has a first and second cleaning disk with first and second cleaning surfaces, the cleaning surfaces are opposite each other and delimit a cleaning gap. A drive device rotates the cleaning disks, and shredded plastic is fed between the cleaning disks. The cleaning surfaces have a plurality of cleaning ribs extending between an inner and outer edge of the cleaning surfaces, wherein at least one flank of the cleaning ribs is angled or curved relative to the axial direction of the respective cleaning disk, and a plurality of cleaning bars running transversally to the direction of extension of the cleaning ribs are arranged between at least some cleaning ribs neighboring each other.

Abstract: The invention relates to a method for washing a motor vehicle wind shield (10) using a washing device (1) comprising reservoirs (2, 3) of first and second fluids, a channel (5) connecting the reservoirs (2, 3) to orifices (15) for ejecting the fluids onto the wind shield, at least one pump (20) intended to circulate the fluids in the channel (5), and at least one wiper blade (30), characterized in that, when the channel contains the first fluid, the method comprises the following steps: a) activating the pump system (20) so as to cause the second fluid to circulate in the channel system (5) so as to purge the channel of the first fluid, and b) deactivating the pump system (20) when the second fluid reaches the orifices (15).

Abstract: This disclosure relates post chemical mechanical planarization cleaning composition of semiconductor substrate for advanced electronics fabrication and packaging. It provides novel corrosion inhibition and quality upmost Cu-low K surfaces to the demanding reliability of nano device and Cu interconnection. Its efficacious cleaning without changing of ultra-low K dielectric and interfering with ultimate electronics performance also offers a cleaning solution to the Cu-low K structure of post reactive ion etching as well as resist ashing in semiconductor fabrication process flow.

Abstract: Methods of acidic warewashing are disclosed. The compositions can include other materials including surfactants and chelating agents, and are preferably phosphorous free. Methods of using the acidic compositions in combination with alkaline compositions are also disclosed. Exemplary methods include using the acidic compositions together with other compositions, including alkaline compositions and rinse aids employed in an alternating alkaline/acid/alkaline manner. The methods also include acidic compositions that serve multiple roles.

Abstract: Methods for processing a substrate are provided herein. In some embodiments, method of processing a substrate includes: heating a substrate disposed within a processing volume of a substrate processing chamber to a temperature of up to about 400 degrees Celsius, wherein the substrate comprises a first surface, an opposing second surface, and an opening formed in the first surface and extending towards the opposing second surface, and wherein the second surface comprises a conductive material disposed in the second surface and aligned with the opening; and exposing the substrate to a process gas comprising about 80 to about 100 wt % of an alcohol to reduce a contaminated surface of the conductive material.

Abstract: A composition for treating a water system to remove scale, microorganisms and biofilm, and corrosion by-products. The composition comprises chelating agents and a surfactant. Depending on the water system being treated, the composition may be a solid dissolved by water in the system being treated or may be a pre-mixed foam or aerosol. A treatment system particularly suitable for flowing water systems comprises a container for holding such a treatment composition and mixing it with a portion of water from the water system, a filter for removing solids dislodged during treatment, and a corrosion monitor. A method for using such a treatment composition comprises draining substantially all existing water in the water system, filling or rinsing the system with fresh water, contacting the treatment composition with substantially all parts of the water system, and draining the treatment composition from the system before resuming normal operations.

Abstract: The present invention discloses an improved cleaning composition for cleaning metal surfaces such as aluminum and aluminum-containing alloys. The cleaning composition of the present invention comprises water and an ethoxylate of an alcohol having Formula R1—OH wherein R1 is a saturated or unsaturated, straight-chain or branched aliphatic having from 12 to 80 carbon atoms; an inorganic pH adjusting component; and at least one surfactant that is different than the ethoxylate set forth above. The cleaning composition of the present invention also has an average water-break-free percent reduction of less than 50% after 7 days aging of a working composition prepared from the cleaning composition. The present invention also provides a method of cleaning a metal surface with the cleaning composition of the invention.