Abstract: The invention relates to a process for producing multi-layer bodies which carry at least one metal layer. The invention further relates to multi-layer products having at least three layers, comprising a substrate layer made of a substrate and containing special copolycarbonates, a metal layer and at least one additional layer.

Abstract: A system that incorporates teachings of the subject disclosure may include, for example, a method in which a selection is made for a first major constituent, a second major constituent and a minor constituent for forming a desired material. The method can include mixing the first major constituent, the second major constituent and the minor constituent in a single mixing step to provide a mixture of constituents. The method can include drying the mixture of constituents to provide a dried mixture of constituents and calcining the dried mixture of constituents to provide a calcinated mixture of constituents. The method can include processing the calcinated mixture of constituents to provide a powder of constituents. Other embodiments are disclosed.

Abstract: A method for inducing chemical reactions using X-ray radiation comprises generating an irradiation volume within the interior of a reaction vessel by introducing X-ray radiation into the volume, in which two or more reactants are introduced. With respect to the two or more reactants and any subsequently created intermediate reactant or reactants, the aggregate extent to which the foregoing reactants are to be ionized to any degree is selectively controlled, and the average degree of ionization in the irradiation volume, from partial to total, of that portion of the foregoing reactants which is to be ionized is selectively controlled, through control of the fluence and energy of the X-ray radiation, to thereby induce selective reactions of reactants to occur in the irradiation volume. One or more reactants may be delivered through a double-walled pipe containing X-ray shielding to prevent their premature irradiation before being injected into the irradiation volume.

Abstract: In some embodiments, substrate processing apparatus may include a chamber body; a lid disposed atop the chamber body; a target assembly coupled to the lid, the target assembly including a target of material to be deposited on a substrate; an annular dark space shield having an inner wall disposed about an outer edge of the target; a seal ring disposed adjacent to an outer edge of the dark space shield; and a support member coupled to the lid proximate an outer end of the support member and extending radially inward such that the support member supports the seal ring and the annular dark space shield, wherein the support member provides sufficient compression when coupled to the lid such that a seal is formed between the support member and the seal ring and the seal ring and the target assembly.

Abstract: An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.

Abstract: A guided wave applicator comprising two electrically conductive waveguide walls and a waveguide dielectric. The volume of the waveguide dielectric is composed of non-gaseous dielectric material and is positioned between the two waveguide walls. The waveguide dielectric includes first and second longitudinal ends and includes first, second, third and fourth sides extending longitudinally between the two longitudinal ends. The first waveguide wall is positioned so that it covers the first side of the waveguide dielectric, and the second waveguide wall is positioned so that it covers the second side of the waveguide dielectric. In operation, electrical power can be supplied to one or both longitudinal ends of the waveguide dielectric, whereby the power can be coupled to a plasma through the exposed sides of the waveguide dielectric.

Abstract: Materials such as biomass (e.g., plant biomass, animal biomass, and municipal waste biomass) and hydrocarbon-containing materials are processed to produce useful products, such as fuels. For example, systems are described that can use feedstock materials, such as cellulosic and/or lignocellulosic materials and/or starchy materials, or oil sands, oil shale, tar sands, bitumen, and coal to produce altered materials such as fuels (e.g., ethanol and/or butanol). The processing includes exposing the materials to an ion beam.

Abstract: An apparatus for coating a substrate is provided that includes a racetrack-shaped plasma source having two straight portions and at least one terminal turnaround portion connecting said straight portions. A tubular target formed of a target material that forms a component of the coating has an end. The target is in proximity to the plasma source for sputtering of the target material. The target is secured to a tubular backing cathode, with both being rotatable about a central axis. A set of magnets are arranged inside the cathode to move an erosion zone aligned with the terminal turnaround toward the end of the target as the target is utilized to deposit the coating on the substrate. Target utilization of up to 87 weight percent the initial target weight is achieved.

Abstract: An electrochemical liquid-liquid-solid (LLS) process that produces unlimited amounts of crystalline semiconductor, such as Ge or Si, from aqueous or polar solutions with tunable nanostructured shapes without any physical or chemical templating agent is presented. Dissolution into, saturation within, and precipitation of the semiconductor from a liquid electrode (e.g., Hg pool) or near an electrode comprising metallic nanoparticles (e.g., In nanoparticles) yields a polycrystalline semiconductor material, as deposited. Such a process can be conducted at conditions, in a single step, and under electrochemical control, while affording control over formation of a variety of material morphologies. Materials formed by such processes are also provided.

Abstract: An electrodialysis unit comprises a plurality of cathodes, a plurality of anodes and a plurality of membranes; the cathodes and anodes being arranged alternately in an electrode stack, with membranes in between each cathode and anode, anode flow paths formed between the membranes and anodes and cathode flow paths formed between the membranes and cathodes; the electrodialysis unit further comprising: an inlet manifold for distributing water to the anode flow paths or to the cathode flow paths, wherein the inlet manifold comprises a first tube provided with holes along its length, the holes being connected to the flow paths, and a second tube located within and enclosed by the first tube, the second tube having an inlet at one end and being closed at its second end and the second tube being provided with holes along its length that open into the first tube.

Abstract: A method of forming targets for cathodic arc deposition of alloy bond coats for turbine engines components consists of melting a base alloy containing aluminum and other metals, adding grain boundary strengthening alloy additions, and casting the melt to form a cylindrical billet that is subsequently sectioned into puck shaped targets. The grain boundary strengthening additions minimize intergranular fracture of the targets during high current operation of the arc coating process.

Abstract: A packaging substrate includes a supporting sheet, a copper foil, a number of connecting pads, a number of solder balls, a resin layer, a wiring layer and a solder mask layer. The copper foil is attached on a surface of the supporting sheet through an adhesive sheet. The connecting pads are formed on the copper foil. The solder balls are formed on the connecting pads. The resin layer infills the gaps between the solder balls. The wiring layer is formed on the resin layer and the solder balls. Terminal portions of the solder balls facing away from the connecting pads are electrically connected to the wiring layer. The solder mask layer is formed on the wiring layer. The solder mask layer defines a number of openings exposing portions of the wiring layer. The portions of the wiring layer exposed through the openings serve as contact pads.

Abstract: An ion etch assisted deposition apparatus deposits a thin film upon a substrate having a three dimensional feature, using an ion etching source and deposition source arranged at similar angles relative to the substrate and at an angle ? relative to each other. The angle ? is selected to be substantially equal the supplement of the angle ?? formed between the three dimensional feature on the substrate and the substrate surface. In this configuration the relative flux of energetic etch ions and deposition atoms is adjusted to prevent the growth of poor quality deposited material.

Abstract: An electrodialysis unit 8 comprises a cathode 68, an anode 70, a membrane 71 between the cathode 68 and the anode 70, a cathode flow path 72 for water flow along the membrane 71 on the cathode side, an anode flow path 74 for water flow along the membrane 71 on the anode side, and a reaction zone formed between the membrane 71 and the cathode 68 where the cathode 68 faces the anode 70, wherein the cathode flow path 72 is arranged for laminar flow in the reaction zone and wherein the electrodialysis unit 8 comprises flow conditioning elements 64 arranged to promote laminar flow in the incoming water flow to the cathode flow path 72.

Abstract: A composite plastic member includes a first stacked body comprised of a plurality of chromium layers stacked on a plastic substrate; and a second stacked body comprised of a plurality of chromium nitride layers stacked on the first stacked body. Each of the first and second stacked bodies is formed such that a lower-hardness layer having a lower hardness than upper and lower layers which contact with and sandwich the lower-hardness layer therebetween and a higher-hardness layer having a higher hardness than upper and lower layers which contact with and sandwich the higher-hardness layer therebetween are alternately stacked in a stacking direction; and a thickness of a higher-hardness chromium nitride layer is not more than 40% of a thickness of a lower-hardness chromium nitride layer in the second stacked body. The composite plastic member has high wear resistance and satisfactory sliding performance, and the conductivity and excellent outer appearance.

Abstract: The present invention provides a film forming apparatus configured such that the occurrence of contamination is reduced between targets. The film forming apparatus includes: a plurality of target electrodes respectively having attachment surfaces to which targets can be attached; a substrate holder for holding a substrate at a position opposing the plurality of target electrodes; a first shutter member rotatably provided between the plurality of target electrodes and the substrate holder and having a plurality of openings that can oppose the attachment surfaces; and a shield member disposed adjacent to the first shutter member and having a number of openings equal to the number of the target electrodes, wherein a gap between the first shutter member and the shield member widens toward an outer perimeter from a portion where adjacent target electrodes are closest.

Abstract: Provided is a copper plating technique that enables the filling of high aspect-ratio via-holes and through-holes in semiconductor substrates such as silicon substrates, organic material substrates or ceramic substrates. The disclosed technique involves a tertiary amine compound, which is obtained by reacting a heterocyclic compound with the epoxy group of a glycidyl ether group of a compound that has three or more glycidyl ether groups, and a quaternary amine compound thereof, as well as a copper plating additive, a copper plating bath, and a copper plating method employing the compounds.

Abstract: A device and process are disclosed for the separate removal of oppositely charged ions from electrolyte solutions and recombining them to form new chemical compositions. The invention provides the ability to create multiple ion flow channels and then form new chemical compositions therefrom. The process is accomplished by selectively combining oppositely charged ions of choice from different electrolyte solutions via the capacitive behavior of high electrical capacitance electrodes confined in insulated containers.

Abstract: There is provided a method of production of chlorine.sodium hydroxide capable of being operated stably and economically by preventing calcium from being deposited in an ion exchange membrane. The liquid retention layer 3 having a liquid retention amount per unit volume of the liquid retention layer of 0.10 g-H2O/cm3 or more and 0.80 g-H2O/cm3 or less is put between the ion exchange membrane 12 and the gas diffusion electrode 16. Calcium ions transferred through the ion exchange membrane 12 easily diffuse, thereby making it possible to suppress increase in an electrolytic voltage and drop in current efficiency generated by deposition of the calcium ions inside the ion exchange membrane 12.

Abstract: A device and process are disclosed for the separate removal of oppositely charged ions from electrolyte solutions and recombining them to form new chemical compositions. The invention provides the ability to create multiple ion flow channels and then form new chemical compositions therefrom. The process is accomplished by selectively combining oppositely charged ions of choice from different electrolyte solutions via the capacitive behavior of high electrical capacitance electrodes confined in insulated containers.