Patents Examined by A. Ortiz
  • Patent number: 5417914
    Abstract: A method and apparatus for extracting a molded product wherein the molded product, specifically, a shutter molded of a synthetic resin with a very small thickness, from an injection molding die at a high speed without malfunction or deformation of the molded product. The apparatus includes as essential components an opposing pair of chucking members for supplementarily supporting a molded product in the clamped state while restrictively locating it at a predetermined position, and a suction pad located in alignment with the predetermined position of the molded product for grasping the latter by the action of suction. In an alternate embodiment, two chuck arms having respective suction pads at their ends are moved into contact with the shutter from opposite sides. With the invention the molded product can completely be extracted from an injection molding die in cooperation of the chucking members with the suction pad.
    Type: Grant
    Filed: November 10, 1992
    Date of Patent: May 23, 1995
    Assignee: Fuji Photo Film Co., Ltd.
    Inventors: Yoichi Hayashi, Iwao Komaki
  • Patent number: 5356576
    Abstract: A process for the manufacture of plastic moldings with decorative coatings by injection molding, on an injection molding machine with an injection screw, which introduces the plastic into a cavity located in a mold clamping device, and an apparatus for the performance of the process.
    Type: Grant
    Filed: March 23, 1992
    Date of Patent: October 18, 1994
    Assignee: Mannesmann Aktiengesellschaft
    Inventor: Gunther Fischbach
  • Patent number: 5223202
    Abstract: A method and apparatus for manufacturing a bidirectional, corrosion and abrasion resistant gate valve body. In one embodiment, the gate valve body, including flange seals and a liner, are produced in a single molding operation. A mold with appropriate coring either forms or aligns any desired mounting inserts. Coring is also provided to properly form a packing area, gate passage, fluid passages, and flange mounting seals. Once the mounting inserts have been positioned in the mold cavity, the mold sections are secured together, and a filler material, preferably a thermoplastic resin, is injected into the cavity. Upon hardening of the filler material, the inserts are secured into position. Further, the entire body and liner are a single solid unit comprising the packing cavity, the gate slot for sealing flow areas, the flow passages, and the flange rings for sealing connection of the valve to other mating surfaces.
    Type: Grant
    Filed: February 26, 1991
    Date of Patent: June 29, 1993
    Inventor: Charles E. Hall
  • Patent number: 5169570
    Abstract: A method of joining the ends of a papermakers fabric wherein machine direction yarns are fringed out at the fabric ends, yarn ends being laid across a pinned plate, and yarn ends being cut back so as partially to overlie the plate. Those yarns which extend across the plate are folded back to form loops beyond the edge of the plate and a thermoplastics matrix material is applied to the plate. The matrix material is made fluid by heating and, on subsequent cooling, forms an apertured end to the fabric which presents side-by-side, outwardly extending loops. The loops at the respective fabric ends may be interdigited to receive a pintle wire, thus to bring the fabric into endless form.
    Type: Grant
    Filed: May 9, 1990
    Date of Patent: December 8, 1992
    Assignee: Scapa Group PLC
    Inventors: Ian C. Sayers, Leonard R. Lefkowitz
  • Patent number: 5149483
    Abstract: A method of impregnating electric machinery (32) containing windings with a resin (46) in accordance with the invention includes providing a vessel (30) for containing the electric machinery and an impreganting resin with the vessel having an interior volume (40) in contact with an exterior surface (42) of the electric machinery to be contacted with resin to impregnate the windings; heating the vessel containing the electric machinery to a temperature sufficient to reduce viscosity of the resin upon contact with the machinery to promote flow of resin into contact with the windings; contacting the heated vessel and electric machinery with the resin with the heated electric machinery reducing the viscosity of the resin with the reduced viscosity resin flowing into contact with the windings to be impregnated; curing the resin within the vessel to cause the resin to be retained in contact with the windings and removing the electric machinery from the vessel.
    Type: Grant
    Filed: February 26, 1991
    Date of Patent: September 22, 1992
    Assignee: Sundstrand Corporation
    Inventors: David W. Okey, Owen M. Briles, Francis T. Carriglitto
  • Patent number: 5147591
    Abstract: A method for producing a lid device for a wide-mouthed container which comprises a lid body having an opening of a predetermined shape, and a closure member made of a soft synthetic resin for closing the opening of the lid body. According to the method, the lid body and a vapor impervious film are placed between a first mold body and a second mold body with the film located on the side of the second mold body. The first mold body has a closure forming cavity, whereas the second mold body has a tab forming cavity. A fluid synthetic resin is injected under pressure from the side of the first mold body to fill the closure forming cavity. The resin is caused to break through the film to fill the tab forming cavity, thereby forming a pull tab integral with the closure member.
    Type: Grant
    Filed: April 18, 1991
    Date of Patent: September 15, 1992
    Assignee: Tenryu Chemical Industry Co., Ltd.
    Inventor: Yoshiaki Yoshida
  • Patent number: 5133921
    Abstract: A method for manufacturing plastic encapsulated electronic semiconductor devices is disclosed in which a support pad is firmly fixed by slidable means and also by mold halves in molding operation. Slidable means is moved outward of a cavity when it is filled with the plastic encapsulating material to the half volume. Spaces, which are formed after movement of slidable means, are filled with the plastic encapsulating material directly poured through a gate. The encapsulated semiconductor devices indicate excellent thermal radiation and dielectric strength characteristics without formation of voids or unfilled portions in the plastic.
    Type: Grant
    Filed: November 19, 1990
    Date of Patent: July 28, 1992
    Assignee: Sanken Electric Co., Ltd.
    Inventor: Takaaki Yokoyama
  • Patent number: 5133923
    Abstract: A latex container, and associated former and method for producing, for use as a leg bag by urinary incontinent males. The latex leg bag is provided with strap holders that are integrally formed simultaneously with the leg bag structure to provide a more structurally reliable strap holder. The strap holder includes a nodal growth of latex, simultaneously grown during the a latex coagulation process, that bridges an interstice on the former to close the strap holder loop. The leg bag container is provided having a skewed entry neck for facilitating better dressing of the delivery tube during use, and a concave shape to better conform to the user's leg. The former is machined with corresponding structure to form the leg bag in a latex coagulation process.
    Type: Grant
    Filed: December 17, 1991
    Date of Patent: July 28, 1992
    Assignee: Sierra Laboratories, Inc.
    Inventor: K. Robert P. Klug