Patents Examined by A. Y. Ortiz
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Patent number: 5783134Abstract: In a method of resin-sealing a semiconductor device having a circuit board with an IC thereon, a metal mold formed of upper and lower metal molds is prepared. The upper metal mold has a pressing member, and the lower metal mold has a cavity for mounting the circuit board therein, a pinpoint gate formed at a lower portion of the cavity and a runner section formed below the cavity and communicating with the pinpoint gate. The circuit board is positioned in the cavity of the lower metal mold, and is set such that the IC faces downward. A rear surface of the circuit board where the IC is not mounted is pressed by the pressing member, and a resin is filled in the cavity through the runner section and the pinpoint gate to thereby seal the IC mounted on the circuit board by the resin.Type: GrantFiled: September 7, 1995Date of Patent: July 21, 1998Assignee: Citizen Watch Co., Ltd.Inventors: Isao Yabe, Masahiko Yoneyama, Teruo Nayuki, Hiroaki Shimizu, Katsuhiko Ikai, Kazuhiko Asaumi
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Patent number: 5783133Abstract: A multilayer molded article made of a first member having a first core layer and a first skin material laminated on the first core layer, and a second member having a second core layer and a second skin material layer laminated on the second core layer, in which the first member is insert laminated in a part of the surface of the second skin material, and which is beautifully finished at a boundary between the first and second skin materials.Type: GrantFiled: March 11, 1994Date of Patent: July 21, 1998Assignees: Sumitomo Chemical Company, Limited, Nissen Chemitec CorporationInventors: Takahisa Hara, Masahito Matsumoto, Tadayuki Oda, Hiromu Fujita, Yuji Kamiji, Hiromasa Nakatsuka
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Patent number: 5779958Abstract: An electronic device packaging apparatus using molding techniques is provided. This packaging apparatus includes an upper die, a lower die, and a resin injection mechanism. The lower die is designed to mate with the upper die, and includes a cavity block which has an upper block surface and a lower block surface. The upper block surface has formed therein a mold cavity for packaging an electronic device placed between the upper and lower dies with a resin material. The lower block surface has formed therein a groove communicating with the mold cavity. The resin injection mechanism is operable to inject a melted resin material into the mold cavity of the cavity block through the groove formed in the lower block surface of the cavity block.Type: GrantFiled: January 14, 1997Date of Patent: July 14, 1998Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Syoujirou Nishihara, Teruaki Nishinaka
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Patent number: 5779964Abstract: A male urinary catheter and method of making same. The catheter employs a condom like sheath of silicone rubber which sealingly engages the penis of the patient. A catheter stem at the distal end of the sheath couples to a urine collection system. The sheath is sealed to the penis by an adhesive which is applied to the outer surface of the sheath at the time of manufacture. A surface preparation layer is applied over the adhesive. The sheath is rolled up from the proximal end. The sheath is unrolled to apply it to the patient. During the unrolling process, the adhesive layer is removed from the outer surface and deposited on the inner surface of the sheath.Type: GrantFiled: September 17, 1993Date of Patent: July 14, 1998Assignee: Mentor CorporationInventors: Daniel P. Welch, Thomas D. Ryan, Erik M. Knutson
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Patent number: 5770133Abstract: A method for fabricating a vibration isolating housing for a data storage system is disclosed. The base of a data storage system housing includes a primary base having a first aperture, and a secondary base configured to fit within the first aperture of the primary base. The primary base and secondary base are placed in a mold of an injection molding apparatus so that a first gap is defined between the primary base and secondary base. Polymeric material is flowed into the first gap to form an integral, substantially rigid housing base upon curing of the polymeric material. The primary base may further include a second aperture for accommodating the configuration of a tertiary base, with a second gap being provided between the primary base and the tertiary base for receiving polymeric material to form an integral housing base comprising the primary, secondary, and tertiary bases.Type: GrantFiled: June 7, 1995Date of Patent: June 23, 1998Assignee: International Business Machines CorporationInventor: Zine-Eddine Boutaghou
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Patent number: 5770128Abstract: Insert-parts are set onto a lower die (10), and resin tablets are supplied into pots (10a) for resin mold. A press mechanism A molds the insert-parts, a mold is opened, then the lower die (10) is slid to a first position, which is located side of a molding position. At the first position, an unloading mechanism (C) and a parts-loading mechanism (D) execute to clean parting faces of the mold, and to set resin tablets and insert-parts. The lower die (10) returns to the molding position for next molding. By sliding the lower die (10), works of taking out molded products, setting insert-parts, etc. can be easier, and the molding cycle time can be shortened.Type: GrantFiled: December 8, 1993Date of Patent: June 23, 1998Assignee: Apic Yamada CorporationInventors: Kazuhiko Kobayashi, Ryoichi Arai, Yasuhiko Miyashita, Kazumi Sawazaki
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Patent number: 5762853Abstract: A flexible sensor, such as a membrane switch, is molded into a plastic automotive panel by a low temperature, low pressure, method which avoids damage to the switch while insuring its placement at a desired depth below the surface of the panel. This is achieved by a process which includes a first step of spraying a mold with a rapid gelling liquid plastic to a preselected thickness. After the plastic has firmed, the sensor is placed thereon and is encapsulated by spraying with a second layer of the plastic. The resulting shell with the embedded sensor may then be provided with a backing, such as a plastic foam.Type: GrantFiled: April 1, 1996Date of Patent: June 9, 1998Assignee: Morton International, Inc.Inventors: Bradley D. Harris, Gregory J. Lang, W. Gary Wirt
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Patent number: 5756025Abstract: A seal for movable structural components, like piston rods or shafts, includes a carrier body made of thermoplastic material and a sealing member locked to said carrier body and made of polytetrafluoroethylene (PTFE) material. A form-lock connection is achieved by an undercut which is formed permanently in the sealing member and filled with plastic material of the carrier body.Type: GrantFiled: November 17, 1995Date of Patent: May 26, 1998Assignee: Dichtungstechnik G. Bruss GmbH & Co.KGInventors: Steffen Heine, Michael Kinzel, Heiko Schumacher
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Patent number: 5756029Abstract: A molding process includes forming a primary molded product having interlocking projections and holes in a primary mold. The product is transferred into a secondary mold having interlocking grooves and pins, and secured therein by the engagement of the projections and holes of the product with the grooves and pins, respectively, of the secondary mold. A secondary molded product containing the primary molded product as an insert is formed without having any undesirable displacement of the insert caused by the injection of a molding material at a high pressure. An appropriate molding apparatus is also disclosed.Type: GrantFiled: July 17, 1995Date of Patent: May 26, 1998Assignee: Kabushiki Kaisha BandaiInventors: Kousaku Nakamichi, Kazunori Miura, Keiji Ohira
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Patent number: 5750059Abstract: A method of and an apparatus for molding resin to seal electronic parts are adapted to use molding units to seal with molded resin materials electronic parts that are mounted on lead frames. Additional molding units are detachably mounted with respect to an already provided first molding unit in the molding apparatus, so that the number of the molding units can be arbitrarily adjusted. In this manner, the method and apparatus can be easily reconfigured or rearranged to be adapted to mass production or small production runs of the same or different types of molded parts. By simultaneously carrying out various process steps, the overall process time is reduced.Type: GrantFiled: June 29, 1994Date of Patent: May 12, 1998Assignee: Towa CorporationInventor: Kazuhiko Bandoh
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Patent number: 5746955Abstract: A composite hockey stick shaft adapted for receiving a replacement blade. The composite shaft includes a shaft body formed of a resin material and embodying a spirally wound plurality of filaments embedded in the resin material. The present invention also relates to a process for making such a composite hockey stick shaft.Type: GrantFiled: June 7, 1995Date of Patent: May 5, 1998Assignee: Christian Brothers, Inc.Inventors: David E. Calapp, Michael T. Bennett
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Patent number: 5744084Abstract: Substrates having a wide range of thickness, and intended to be overmolded with a plastic package body, are accommodated in a common mold. The top surface of the substrate is provided with a dam structure, which may be formed as an additional layer on the substrate, and which is preferably in the form of a square ring. A groove (channel) is machined (e.g., by routing) into the surface of the dam structure. The top mold half, having a cavity for forming the package body, is provided with a sealing structure at the periphery of the cavity. The sealing structure has a ridge fitting into the channel of the dam structure. The depth of the groove in the dam structure is readily adjusted to ensure uniform clamping pressure of the top mold half on the substrate, so that liquid molding compound is contained within the cavity and so that undue pressure is not exerted on the substrate.Type: GrantFiled: July 24, 1995Date of Patent: April 28, 1998Assignee: LSI Logic CorporationInventors: Chok J. Chia, Seng-Sooi Lim, Maniam Alagaratnam
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Patent number: 5744083Abstract: The invention is to a transfer mold design utilized with conventional transfer encapsulation. The design utilizes a varying runner cross section with an intermediate varying depth well or reservoir from which a constant gate depth and gate entry angled to the mold cavities is employed. The method and apparatus of the invention is applicable to single and multi-plunger molding utilizing thermoset and thermoplastic encapsulants for semiconductors.Type: GrantFiled: November 6, 1996Date of Patent: April 28, 1998Assignee: Texas Instruments IncorporatedInventors: George A. Bednarz, Teong Yu Lim
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Patent number: 5738812Abstract: For the manufacture of breast prostheses from a shell-shaped body made from an addition-vulcanising two-component silicone rubber mass, which body is enclosed in a plastic sheet sheathing said body, a filler of fairly low density composed of hollow spheres or microspheres is added to the two-component silicone rubber mass. The mixture is filled into a sheath of plastic sheet and is cured in a mould under the effect of heat. To obtain the most uniform distribution possible of the filler in the prosthetic body, the mould filled and degassed in the customary way is turned continuously through one or two axes before and during the curing of the two-component silicone rubber mass until the silicone rubber is vulcanised to such an extent that any rising of the filler materials is prevented.Type: GrantFiled: January 21, 1997Date of Patent: April 14, 1998Assignee: Amoena Medizin-Orthopadie-Technik GmbHInventor: Helmut Wild
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Patent number: 5733428Abstract: A method and apparatus for making a golf ball of selected instruction having an encapsulated core or a non-treated core and a polyurethane cover of selected composition in which equipment is employed for aligning, centering and locating the core in relationship with the molding of the cover thereon.Type: GrantFiled: May 2, 1995Date of Patent: March 31, 1998Assignee: Acushnet CompanyInventors: John Calabria, Dean A. Snell, Shenshen Wu
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Patent number: 5733493Abstract: A rubber-like molded product with a support frame includes a support frame having a predetermined shape; a connecting member constituted by a thin film or connecting ribs and engaged with the support frame separably therefrom; and a rubber-like molded product formed integrally in a region of the connecting member in such a manner as to be capable of being cut off from the connecting member. In this rubber-like molded product with a support frame, the support frame, the connecting member, and the rubber-like molded product are formed integrally by press molding or injection molding. Only the rubber-like molded product is cut off from the support frame and the connecting member of the integrated rubber-like molded product with a support frame by means of a pushing jig, and is fitted in a groove formed in a predetermined portion of a fitted member.Type: GrantFiled: April 19, 1995Date of Patent: March 31, 1998Assignee: Three Bond Co., Ltd.Inventors: Nobuhiro Katsuno, Ikuzo Usami, Noriko Mizutani
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Patent number: 5733398Abstract: An exchanger includes an outer casing having an inlet port and an outlet port for a first fluid, and an inlet port and an outlet port for a second fluid, and a bundle of hollow fibers located within the outer casing and being in flow communication with the inlet and outlet port for the second fluid. A central core is located in the outer casing and the bundle of fibers is arranged around the central core. The central core includes an inlet manifold connected to the first fluid inlet port, and an outlet manifold connected to the first fluid outlet port.Type: GrantFiled: May 17, 1996Date of Patent: March 31, 1998Assignee: COBE Laboratories, Inc.Inventors: Gary A. Carson, Robert E. Doty, Michael R. Hoglund, James D. Isaacson
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Patent number: 5728342Abstract: An invisible cover door for an inflatable passive passenger restraint is provided in an interior trim structure of an automotive vehicle for deployment of an airbag therethrough. The low pressure insert injection molding of the cover door into the interior trim structure, such as an instrument panel or dashboard or door panel structure, produces an invisible cover door with tear propagation lines that are undetectable to a vehicle occupant and that do not "show" or mar or otherwise affect the aesthetic appearance of the outer trim surface of the instrument panel or dashboard. Such invisible doors which require only two tear propagation lines can be provided.Type: GrantFiled: February 27, 1996Date of Patent: March 17, 1998Assignee: Morton International, Inc.Inventors: W. Gary Wirt, Patrick G. Jarboe
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Patent number: 5725824Abstract: A branched hose construction, hose unit therefor and methods of making the same are provided, the branched hose construction comprising a first tubular hose unit having opposite ends and having a tubular branch extending outwardly therefrom intermediate the opposite ends and having a free end, a second tubular hose unit having a free end telescoped with the free end of the tubular branch, and fastening structure interconnecting the telescoped free ends together, the fastening structure comprising a quick connect/disconnect structure, the second tubular hose unit comprising an end of a flexible hose and part of the quick connect/disconnect structure molded onto the flared end of the flexible hose and extending outwardly therefrom.Type: GrantFiled: July 9, 1996Date of Patent: March 10, 1998Assignee: Dayco Products, Inc.Inventor: Randall E. Sellers
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Patent number: 5726386Abstract: A process for potting electrical circuits with asphalt based potting compounds by providing uniform strips of solid potting compound, of controlled shape and melt characteristics, which are placed in a container in a certain sequence with the circuit board. The strips, or the uppermost strip is then reflow melted by the application of Infrared Radiant heat from directly above. The melted strip flows into the can, filing all void spaces, potting the circuit.Type: GrantFiled: October 23, 1995Date of Patent: March 10, 1998Assignee: Calhoun Pitch Company, Inc.Inventor: Prentiss Calhoun