Abstract: In a method of reading a memory device, difference information is generated based on a distance difference between a position of a read word-line and a position of a boundary word-line. The read word-line corresponds to a read address. The boundary word-line corresponds to a last programmed word-line in a memory block included in a memory cell array. A read word-line voltage and an adjacent word-line voltage are determined based on the difference information. The read word-line voltage is applied to the read word-line. The adjacent word-line voltage is applied to an adjacent word-line that is adjacent to the read word-line. A read data corresponding to the read address is outputted based on the read word-line voltage and the adjacent word-line voltage.

Abstract: A trigger circuit for triggering corresponding memory cells of a column redundant circuit includes a determining circuit for generating a determining signal according to an accessed row address, and a plurality of comparing circuits jointly electrically connected to the column redundant circuit for receiving the determining signal, each of the comparing circuits selectively generating a trigger signal to the column redundant circuit according to the determining signal and an accessed column address.

Abstract: An electrically erasable and programmable memory in which control gate transistors have been suppressed includes memory cells each with an access transistor and a floating gate transistor. A word line decoder is connected to word lines of the memory cells by a selection line connected to the gate terminals of the access transistors of the word line, and by a control gate line connected to the control gates of the floating gate transistors of the word line. Thus the voltage applicable to the gate terminals of the floating gate transistors is no longer limited by the voltage susceptible of being obtained on the source terminal of the control gate transistors.

Abstract: A nitride trapping memory device includes a comparator, a bias unit, a memory cell, a cycling cell, a compensation cell and a control unit. The comparator has a reference voltage. The bias unit is for outputting a bias voltage to the comparator, and the comparator outputs a bit value according to comparison of the bias voltage and the reference voltage. The memory cell is connected to the bias unit via a first switch. The cycling cell is connected to the bias unit via a second switch. The compensation cell is connected to the bias unit via a third switch. The control unit is for controlling the cycling cell and the compensation cell according to the bit value.

Abstract: In one aspect, a NAND flash memory device is provided which includes a plurality of main blocks for storing main data, a security block for storing security data, and a plurality of redundancy blocks each for being substituted in place of a failed main block, wherein at least one of the redundancy blocks may selectively substituted in place of a failed main block and a failed security block. In an alternative aspect, the NAND flash memory device a security redundancy block for being substituted in place of the security block in the event the security block fails.

Abstract: A power-on-reset circuit determines when it is safe for a programmable device to access configuration data from an associated non-volatile memory following a reset operation. The power-on-reset circuit receives a bandgap reference voltage produced by the programmable device. A comparator circuit is used to trigger a self-clocking delay unit when the bandgap reference voltage reaches a threshold level. The self-clocking delay unit generates its own clock signal independent of the clock frequency of the programmable device. The self-clocking delay unit may use edge-dependent delay units in a feedback loop to generate the clock signal. Using its own clock signal, the self-clocking delay unit waits for a predetermined time period and the outputs a signal to be used to enable access to the associated non-volatile memory.

Abstract: Erasing is performed with respect to a nonvolatile memory cell without causing depletion halfway therethrough. A control circuit for reversibly and variably controlling the threshold voltage of the nonvolatile memory cell by electrical erasing and writing controls an erase process of performing erasing to the plurality of nonvolatile memory cells assigned to one unit in an erase operation, a first write process of performing writing to the nonvolatile memory cell exceeding a pre-write-back level before a depletion level, and a second write process of performing writing to the nonvolatile memory cell exceeding a write-back level after the first write process. Since the occurrence of depletion is suppressed by successively performing the first write process with respect to the nonvolatile memory cells which may exceed the depletion level in the erase process, erasing can be performed to the nonvolatile memory cell without causing depletion halfway therethrough.

Abstract: A memory circuit includes multiple word lines, multiple pairs of complementary bank bit lines, multiple block select lines, and multiple of block circuits. Each of the block circuits includes a local bit line; a first transistor having a control terminal connected to the local bit line, a first bias terminal connected to a first bank bit line of a given pair of bank bit lines, and a second bias terminal connecting to a first voltage source; a second transistor having a control terminal connected to a corresponding one of the block select lines, a first bias terminal connected to a second bank bit line of the given pair of bank bit lines, and a second bias terminal connected to the local bit line; and a plurality of memory cells connected to the local bit line and to respective word lines in the memory circuit.

Abstract: A magnetic memory cell having read conductor that is wholly clad with a high magnetic permeability soft magnetic material for a pinned-on-the-fly soft ferromagnetic reference layer is disclosed. The magnetic memory cell includes a ferromagnetic data layer, an intermediate layer formed on the ferromagnetic data layer, and a soft ferromagnetic reference layer formed on the intermediate layer. The soft ferromagnetic reference layer includes a read conductor and a ferromagnetic cladding that completely surrounds the read conductor to form a cladded read conductor. The soft ferromagnetic reference layer has a non-pinned orientation of magnetization. When an externally supplied read current flows through the read conductor, the read conductor generates a magnetic field that does not saturate the ferromagnetic cladding and is substantially contained within the ferromagnetic cladding and is operative to dynamically pin the orientation of magnetization in a desired direction.

Abstract: A method of indicating data availability is disclosed. According to the method a data read operation is commenced for retrieving data signals based on data stored within an SDRAM. The data is provided from the SDRAM device with a first propagation delay. The SDRAM device also provides a strobe signal having a propagation delay similar to the first propagation delay. Based on the strobe signal data is latched out of the SDRAM device, as it is available to be read.

Abstract: An apparatus for and method of memory operation having a memory, a cache containing a plurality of entries with a plurality of the entries to be written to memory, a detector for detecting in the cache the plurality of entries to be written to memory, and a processor for erasing a first portion of the memory to accommodate the plurality of entries to be written to memory and writing to the first portion of the memory the plurality of entries to be written to memory wherein an erase operation is followed by a plurality of sequential write operations.

Abstract: A fast-sensing amplifier for a flash memory including a plurality of floating-gate memory devices and having a column line selectively coupled to the devices is disclosed. The column line is quickly discharged to ground before a read-biasing and amplifying circuit quickly pulls up the line to the read-bias potential at a particular memory device. This potential is compared to a sense-reference potential by a differential amplifier within the fast-sensing amplifier. The binary state of the particular memory device is provided as the output of the fast-sensing amplifier.

Abstract: A semiconductor memory device has memory cells for storing data, sense amplifiers for amplifying the stored data, and cache cells in which the amplified data can be placed for quick recall. The cache cells can continue to hold data during memory-cell refresh cycles, permitting the cached data to be accessed quickly afterward. The cache cells may be coupled to column data lines that can be disconnected from the sense amplifiers, enabling memory cells to be refreshed while cache access is in progress. Write buffers may be provided so that when cache data are replaced, the old cache data can be copied back to the memory cells while the new cache data are being accessed.

Abstract: A memory circuit allowing data to be read when a source voltage decreases below the threshold of a selecting transistor comprises a selecting transistor and a series-connected memory transistor, a power source for supplying a source voltage, a voltage detecting circuit for detecting a voltage of the source voltage, a boosting circuit for boosting the source voltage when it has fallen to a value near or below the threshold voltage of the selecting transistor, and a boosted voltage detecting circuit for detecting the boosted voltage and controlling the boosting circuit to boost the source voltage to a value within a range having a lower limit greater than the threshold voltage of the selecting transistor. The boosting circuit generates a boosted voltage that is applied to a word line via high-voltage switch.

Abstract: A memory module is provided with switch groups (SD0a to SD7a) in corresponding relation to data lines (DQ0 to DQ63) connected to memory devices (MD0 to MD7). The switch groups (SD0a to SD7a) connect all of the data lines (DQ0 to DQ63) to a portion external to the memory module (MMa) in a memory operation, and connect all of the data lines (DQ0 to DQ63) to inputs of an exclusive NOR circuit (EXa) after common 1-bit data is written into the memory devices (MD0 to MD7) in a testing operation. A malfunction of the memory devices (MD0 to MD7) is detected using an output signal (TMSa) from the exclusive NOR circuit (EXa). The memory module is accomplished which allows an inexpensive tester to conduct an electrical assembly check and a simple data write and read operation test upon the memory devices, which includes a small number of I/O pins for the check and test, and which does not deteriorate data input/output characteristics of the memory devices.

Abstract: The invention encompasses memory systems and/or memory modules which allow selectable clock termination between the clock/clock buffer and components of the memory modules. The invention provides a fully forward and backward compatible memory solution. The invention provides the memory modules themselves, the FET switches designed for use on the modules, and the systems that include enable/disable pins to use these modules. This invention will permit memory modules to be developed that can operate in existing (emerging) memory subsystems, as well as meet the low power/low pin count needs of future memory subsystems with no required changes to the existing/emerging systems. For 184 Pin Registered DIMMs, the power savings will equate to greater than 200 mw/DIMM, and systems will be permitted to connect DIMM clocks in serial, similar to address/control lines, thereby increasing the address/control window as well as the system read loop-back timings.

Abstract: A semiconductor memory device has memory cells for storing data, sense amplifiers for amplifying the stored data, and cache cells in which the amplified data can be placed for quick recall. The cache cells can continue to hold data during memory-cell refresh cycles, permitting the cached data to be accessed quickly afterward. The cache cells may be coupled to column data lines that can be disconnected from the sense amplifiers, enabling memory cells to be refreshed while cache access is in progress. Write buffers may be provided so that when cache data are replaced, the old cache data can be copied back to the memory cells while the new cache data are being accessed.

Abstract: A semiconductor memory device having a plurality of cell blocks includes: a fuse box group, coupled to the cell blocks, for generating a repair signal in response to a row address signal; a repair signal summation unit for generating a repair summation signal for controlling a repair operation in response to the repair signal; a block selection signal generation unit for generating a block selection signal for selecting a cell block to be repaired in response to the repair summation signal and a block selection address signal; and a repair row decoding unit for driving a redundant word line in response to the repair signal and a block selection signal.

Abstract: The data processing circuit contains a non-volatile memory. Error correction is provided for computing individual correction data for correcting an error in an individual data unit in the non-volatile memory. The individual correction data is computed from a combination of a plurality of data units read from the non-volatile memory. A correction data store stores the individual correction data. Memory access is signaled to the correction data store, which outputs data corrected according to the correction data when said individual data unit is read. The circuit comprises error correction trigger means for triggering the error correction computing means to perform said computing independent of reading of the individual data from the non-volatile memory.

Abstract: The semiconductor memory receives an external clock signal and has the memory cell array access operation controlled based on the clock signal. In the application of this semiconductor memory to a dynamic RAM, for example, a row address and column address are introduced in synchronism with the clock signal. The read, write and refresh operations are controlled based on the clock signal.