Abstract: Provided is a combined fabricating method for gradient nanostructure in the surface layer of a metal workpiece. A plastic deformation layer in great depth is induced by laser shock peening, then the surface of the metal workpiece is nanocrystallized by surface mechanical attrition treatment, and finally a gradient nanostructure is obtained in the surface layer of the metal workpiece with desirable layer thickness and optimized micro-structure distribution.

Abstract: A wafer processing method is disclosed to divide a wafer of glass substrate into individual chips along division lines. In the shield tunnel forming step, a pulsed laser beam of a wavelength, which transmits through the wafer, is irradiated with its focal point positioned at a region corresponding to each division line so that a plurality of shield tunnels which are each formed of perforations and affected regions surrounding the perforations are formed along the division lines, respectively. In the modified layer forming step, another pulsed laser beam of a wavelength, which transmits through the wafer, is irradiated with its focal point positioned at the region corresponding to each division line so that modified layers are formed in addition to the shield tunnels along the division lines, respectively. In the dividing step, an external force is applied to the wafer to divide the wafer into individual chips.