Abstract: A molding die device is provided for bringing a resin sheet into close contact with a pair of dies by vacuum suction from a cavity surface to perform molding. An outer frame portion is formed integrally with an outer peripheral portion of the respective dies arranged to face each other. Moreover, one of the dies has a recessed portion formed at the position of the one of the dies facing the outer frame portion of the other die and configured so that the outer frame portion of the one of the dies can be housed in the recessed portion. The outer frame portion is formed to protrude most in each die. Upon molding, the dies are clamped together after vacuum suction has been performed with the resin sheet being arranged in contact with the outer frame portions.
Abstract: A printing module and a three-dimensional printing apparatus using the same are provided. The three-dimensional apparatus includes a rack with a printing region and a standby region and a control module. The printing module includes a carriage assembly disposed at the rack and is electrically connected to the control module, a first supporting stand disposed at the carriage assembly to be driven thereby, at least one second supporting stand disposed at the standby region, at least one printing head assembly electrically connected to the control module and having a first buckling portion, and a quick release driving assembly disposed at the first supporting stand and electrically connected to the control module. The control module drives the quick release driving assembly to pick and place the printing head assembly between the first supporting stand and the second supporting stand.
Type:
Grant
Filed:
January 14, 2018
Date of Patent:
May 5, 2020
Assignees:
XYZprinting, Inc., Kinpo Electronics, Inc.
Abstract: A method for fabricating flexible microfluidic chips with plastic membranes. In particular, the present invention provides a single-step method for microchannel fabrication of microfluidic chips in a fast and cost-efficient manner.
Type:
Grant
Filed:
February 14, 2018
Date of Patent:
April 28, 2020
Assignees:
Hong Kong Baptist University, THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
Abstract: A method for inflating a chamber in an article composed at least partially of polymer layers, such as thermoplastic layers, is provided. The methods can allow for forming an aperture in a polymer layer, inflating a chamber or volume in fluid communication with the aperture, and then sealing the chamber so that the inflation fluid is substantially retained in the chamber and/or does not escape via the aperture. The formation of the aperture, inflation of the chamber, and sealing of the chamber or aperture may be performed by a single tool and/or based on a single registration of the thermoplastic article with a tool. In some aspects, formation of the aperture is enabled in part by using a punch with a cupped surface that allows the top layer of a thermoplastic article to be breached without forming a hole in at least one lower layer.
Abstract: A method for producing a smooth aerodynamic surface of an aircraft component is depicted and described. The method includes: provision of an aircraft component with an aerodynamic surface, which has an uneven section, introduction of a liquid or viscous, uncured sealing compound into the uneven section, introduction of a solid, precured sealing body into the uneven section in such a way that the sealing body presses into the sealing compound until the sealing compound at least partially surrounds the sealing body, curing of the sealing compound.
Type:
Grant
Filed:
November 16, 2017
Date of Patent:
April 7, 2020
Assignee:
Airbus Operations GmbH
Inventors:
Thomas Hoffmeister, Joachim Piepenbrock, Alexander Engels
Abstract: A method of manufacturing a substrate integrated gasket that includes applying an adhesive agent onto a surface of the substrate in a pattern that corresponds to a configuration of the substrate integrated gasket, wherein the pattern of the adhesive agent includes a first section having dimensions that correspond to a length and width of substrate integrated gasket, a plurality of second sections that extend away from the first section, and third sections that do not include the adhesive agent. The third sections that do not include the adhesive agent define a passageway between a mold cavity to an exterior of the mold that is configured to expel a gas from the mold cavity during injection of a molding material into the mold cavity.