Abstract: Intercalation pastes for use with semiconductor devices are disclosed. The pastes contain precious metal particles, intercalating particles, and an organic vehicle and can be used to improve the material properties of metal particle layers. Specific formulations have been developed to be screen-printed directly onto a dried metal particle layer and fired to make a fired multilayer stack. The fired multilayer stack can be tailored to create a solderable surface, high mechanical strength, and low contact resistance. In some embodiments, the fired multilayer stack can etch through a dielectric layer to improve adhesion to a substrate. Such pastes can be used to increase the efficiency of silicon solar cells, specifically multi- and mono-crystalline silicon back-surface field (BSF), and passivated emitter and rear contact (PERC) photovoltaic cells. Other applications include integrated circuits and more broadly, electronic devices.

Abstract: The invention provides a hot dip galvanized steel sheet which has: a hot dip galvanizing layer having a flat part on a surface thereof; and a film formed on the flat part. The film is composed of a compound containing Zn, Fe, and O, having an average film thickness A in a range from 10 to 100 nm determined by an element analysis of the film, and has {[Fe]/([Zn]+[Fe])} in the film in a range from 0.002 to 0.25, where [Zn] and [Fe] designate the content (% by atom) of Zn and Fe in the film, respectively. Since the hot dip galvanized steel sheet of the invention has excellent press-formability, bondability, and phosphatability, it is suitable for automobiles and electrical appliances.

Abstract: Superlyophobic Surface Structure, including a substrate having a surface; a plurality of nanoscale raised features on the substrate surface, each nanoscale raised feature having a length measured in a direction approximately perpendicular to the substrate surface, each nanoscale raised feature having a raised feature diameter along the length and measured in a direction approximately parallel to the substrate surface; a nanoscale top feature on each of a plurality of the nanoscale raised features, each nanoscale top feature having a top feature diameter measured in a direction approximately parallel to the substrate surface; in which an average top feature diameter is greater than an average raised feature diameter. Method of fabricating a Superlyophobic Surface Structure.

Abstract: A wafer-dicing adhesive tape, containing two or more removable adhesive layers, on a base film, that have resin compositions containing a radiation-polymerizable compound, in which a content of the radiation-polymerizable compound in the resin composition constituting an outermost removable adhesive layer is different from that of an inner removable adhesive layer and a stress applied to the base film is sufficiently introduced to the outermost removable adhesive layer irradiated with radiation, so that said layer can be easily peeled off from chips cut; and a method of producing chips using the same.

Abstract: A superplastically formed structural assembly is provided, as is an associated preform and method for forming such an assembly. The assembly includes a skin member and a support member that are joined to define a space between the members and between the joints. The assembly can be produced by joining the members in a flat configuration, and then forming the resulting preform to a predetermined shape of the structural assembly. The support member defines at least one aperture in communication with the space between the members. Thus, the skin member can be formed by delivering a pressurized fluid through the support member to the skin member, e.g., to superplastically form the skin member against a die that defines a contour surface corresponding in shape to the predetermined configuration of the assembly. The support member can extend in a substantially direct configuration between opposing portions of the skin member.

Abstract: An exemplary embodiment providing one or more improvements includes a composite structure of materials that are formed together in a way which gives the composite structure improved yield strength and thermal conduction capabilities.

Abstract: A plated structure is disclosed that includes a base formed of a copper-based material containing copper as a major component, a plating film formed of a tin-based material containing tin as a major component and provided over the base, and a tin-copper compound barrier film located at the boundary between the base and the plating film. The density of the tin-copper compound barrier film is greater than that of copper.

Abstract: A laminated structure is formed by stacking a first block member, an intermediate member, and a second block member together in this order, and then mutually joining each of the members. Further, by setting the elastic constant of the intermediate member to be greater than the elastic constants of the first block member and the second block member, deformation of grooves, which are formed in the first block member, is minimized.

Abstract: A sliding device 1 is constituted of a swash plate 3 including a first sliding surface 3A and a semispherical shoe 4 sliding with the swash plate 3. The swash plate 3 is constituted of a base material 3B of high strength brass containing Mn and Si, and very small granular Mn—Si compounds 6 are exposed on an inside of the base material 3B and on the first sliding surface 3A (surface of the base material 3B). The above described swash plate 3 increases in exposure amount of the Mn—Si compounds 6 exposed on the first sliding surface 3A by applying etching to the base material 3B after cutting the base material 3B. The sliding device 1 is favorable in seizure resistance and has a low manufacturing cost as compared with conventional sliding devices.

Abstract: A crystalline chromium deposit having a lattice parameter of 2.8895+/?0.0025 ?, and an article including the crystalline chromium deposit. An article including a crystalline chromium deposit, wherein the crystalline chromium deposit has a {111} preferred orientation. A process for electrodepositing a crystalline chromium deposit on a substrate, including providing an electroplating bath comprising trivalent chromium and a source of divalent sulfur, and substantially free of hexavalent chromium; immersing a substrate in the electroplating bath; and applying an electrical current to deposit a crystalline chromium deposit on the substrate, wherein the chromium deposit is crystalline as deposited.

Abstract: An object of the invention is to provide an iodine-containing hot melt pressure sensitive adhesive that can be melted and coated at a temperature not higher than 100° C., and that can retain stability of the iodine in the adhesive through all stages of making, storage and use thereof, without utilizing any harmful organic solvent, while utilizing the antimicrobial efficacy of iodine.

Abstract: An improved structure for the construction of perpendicular recording media is disclosed. The structure includes a perpendicular recording layer with at least two oxide sublayers or a lower sublayer of a non-oxide. One structure includes an upper sublayer comprised of a Silicon-oxide, while a lower sublayer is comprised of a Tantalum-oxide. The structures provide for increased coercivity and corrosion resistance.

Abstract: A coated substrate and a process for forming the coated substrate, including a first lubricious coating layer overlying the substrate, the first lubricious coating layer including a first lubricant providing to the first lubricious coating layer a first coefficient of friction; and a second lubricious coating layer overlying the first lubricious coating layer, the second lubricious coating layer including a second lubricant providing to the second lubricious coating layer a second coefficient of friction, in which the second coefficient of friction is greater than the first coefficient of friction.

Abstract: A sliding bearing element is characterized in that a bearing material that is bonded to the backing is disposed at least at the edges of the backing in form of wires in the circumferential direction and that a soft material is located at least in a space between said wires. At least one intermediate wire can be disposed between the two edge wires generally running in the circumferential direction. The method comprises the following processing steps: providing a strip of steel or any other material having the required degree of strength which forms the backing of the bearing to be produced, bonding at least one wire at each of the two edges of the backing strip, whereat disposing the wires in such a manner that said wires run in circumferential direction generally, and filling out the spaces between the wires with soft material.

Abstract: A device simulating a blooming flower includes a piston slidably disposed within an elongated tube simulating a flower stem. A chamber within the stem is configured to hold a dissolvable solid material. The piston is biased upwardly, but held in place by the dissolvable solid material placed in the chamber above the piston. A simulated flower is attached to the end of the stem or piston and has a plurality of simulated petals configured to open as the stem is placed in a liquid, the solid material dissolves, and the piston moves upwardly within the stem.

Abstract: A heat shield is disclosed comprising a formed sheet having a thickness, an exterior shielding surface, and an interior shielded surface, wherein the exterior shielding surface comprises a multiplicity of protruding perforations. The protruding perforations comprise protrusions increasing surface area and generating turbulent flow, and small openings through the shield to allow convection air flow to pass through.

Abstract: A multi metal base thermal resistance alloy and a mold with the multi metal base thermal resistance alloy layer are provided. The weight percent of each element in this alloy is less than 45%. The structure of the alloy is an amorphous structure and the phonon thermal conductivity of the amorphous structure is intrinsically low. Therefore, the alloy is a metal material with low thermal conductivity coefficient and high thermal stability, which can increase the heat retaining property of the die casting mold, enhance the forming yield and stability of a metal sheet with a low fusion point, and is suitable to be used as a thermal-resistance coating material on die casting molds.

Abstract: The present invention includes a translucent, heat-activated, water-based adhesive composition that contains water and an ethylene vinyl acetate copolymer for use with polymeric films like ionic films. The present invention further includes a method of preparing an adhesive film composition that includes the translucent, heat-activated water-based adhesive composition coated onto the polymeric film, and a method of bonding the adhesive film composition to a bonding surface.

Abstract: A composite copper foil having three layers of a supporting metal layer, an exfoliating layer and a thin copper layer, wherein one surface of the exfoliating layer comprises, as a main component, an alloy of tungsten or an alloy of molybdenum and the other surface thereof comprises, as a main component, a metal oxide containing tungsten or a metal oxide containing molybdenum. The composite copper foil is free from undesired swelling, separation or falling of the supporting metal layer during heating and working at a high temperature, and the supporting metal layer can be exfoliated from the thin copper layer with case, after the heating and the working.

Abstract: A material for forming a conductive structure for a MEMS device is described, which is an alloy containing about 0.01% manganese and the remainder nickel. Data shows that the alloy possesses advantageous mechanical and electrical properties. In particular, the sheet resistance of the alloy is actually lower than the sheet resistance of the pure metal. In addition, the alloy may have superior creep and higher recrystallization temperature than the pure metal. It is hypothesized that these advantageous material properties are a result of the larger grain structure existing in the NiMn alloy film compared to the pure nickel metal film. These properties may make the alloy appropriate for applications such as MEMS thermal electrical switches for telecommunications applications.