Abstract: A method of forming an I/C chip mounting module, and for mounting an I/C chip thereon, is disclosed. A rigid cap and substrate are provided. A bottomed cavity is routed in the cap, and the substrate has circuitry formed thereon. The cap and substrate are laminated together with bond pads, which connect to the circuitry being disposed in the cavity. After circuitization of the exposed surface of the cap and drilling and plating of vias, the material of the cap overlying the cavity is removed to expose the bond pads. Thereafter, an I/C chip is connect to the pads.

Abstract: A media basket mill for dispersing a selected constituent into a liquid vehicle to produce a mixture of the constituent and the liquid vehicle within a mixing vessel includes a basket extending in an axial direction between a upper end and a lower end, a media bed in the basket, and an impeller, the basket having a wall for retaining the media bed within the basket and openings in the wall for permitting passage of the mixture through the wall in response to operation of the impeller when the basket is immersed in the mixture in the vessel, the wall including a bottom wall portion at the lower end and an axially extending side wall portion having an overall diametral dimension, the openings being located at least in the side wall portion, the impeller including a rotor mounted for rotation about the axial direction, and impeller blades on the rotor, the impeller blades having at least blade portions located radially outwardly beyond the diametral dimension of the side wall portion of the wall of the basket fo