Abstract: An improved method and structure is provided for constructing elastomeric pin arrays using a non-conductive medium and compression limiters. Pin to pin of the same elastomeric material, pin to pin of similar elastomeric material, or pin to metal cap structure interconnects are constructed using an elastomeric connection through a non-conductive medium. Compression limiting structures are mated to the non-conductive medium. This structure eliminates the need for PCB structures as the medium reducing manufacturing cost.
Type:
Grant
Filed:
December 14, 2018
Date of Patent:
January 5, 2021
Assignee:
R&D Sockets, Inc
Inventors:
Charles William Martin, Christopher Matthew Beers, James V. Russell
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