Patents Examined by Aexander Giman
  • Mixed electrical and optical LGA interposer for facilitating chip to board communications by dual signal types
    Patent number: 7613368
    Abstract: Integrated optoelectronic chips or collections of chips on a module that have both electrical as well as optical interconnects offer many advantages in speed, power consumption and heat generation. Mixed signal types, however, pose significant packaging challenges. This invention describes a land grid array (LGA) interposer which can simultaneously connect electrical and optical signals from a module to a printed circuit board.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: November 3, 2009
    Assignee: International Business Machines Corporation
    Inventors: Gareth G. Hougham, Russell A. Budd, Punit P. Chiniwalla, Paul W. Coteus, Alphonso P. Lanzetta, Frank R. Libsch