Abstract: A method for producing a surface acoustic wave device, includes the steps of preparing a piezoelectric substrate, forming a thin film electrode on the piezoelectric substrate, etching the thin film electrode for forming an IDT, trimming at least one of the piezoelectric substrate and the IDT to adjust an operation frequency of the surface acoustic wave device, and rapidly altering the surface of the IDT for stabilizing the surface of the IDT.

Abstract: A method is provided for depositing a spatially fine pattern of magnets on a substrate. The substrate can be fabricated from any number of materials, such as plastics, metals or ceramics. When sufficiently magnetized, the magnets will provide a magnetic field that can be sensed by a magnetic proximity sensor, to determine the position of the magnets. The magnets can be arranged in a plurality of patterns, including radial or linear arrangements. The ability to arrange these magnets in varying patterns provides a wide capability of magnetic sensing applications.

Abstract: A low temperature co-fired ceramic assembly (LTCC) with a constraining core to minimize shrinkage of outer ceramic layers during firing. The outer ceramic layers have high density circuit features. A ceramic core includes several ceramic layers. Several via holes are located in the first and second ceramic layers. Several low density circuit features are located on the ceramic layers that make up the core. Outer ceramic layers are placed top and bottom of the ceramic core. The outer ceramic layers have via holes and high density circuit features. The circuit features patterned on the ceramic layers include resistors, capacitors, circuit lines, vias, inductors, or bond pads. The ceramic core is fired first in a furnace. The outer layers are then laminated to the ceramic core and fired. The ceramic core controls the shrinkage rate of the outer ceramic layers during firing allowing higher density circuit features on the outer layers.

Abstract: A method of designing and manufacturing a piezoelectric component which includes a case, a piezoelectric resonator in the case, a terminal including an external connecting portion extending from an opening of the case, and a spring member to contact the piezoelectric resonator and the terminal in the thickness direction, includes the step of designing the spring member such that the piezoelectric resonator and the terminal are held by a holding pressure in range not larger than Fmax when a spring height is Smax, where a thickness range of the piezoelectric resonator, the terminal and the spring member is not smaller than the minimum value of Tmin and not larger than the maximum value of Tmax, a dimension, range of the case interior is not smaller than the minimum value of Wmin and not larger the maximum value of Wmax.

Abstract: Ultra-miniature electrical contacts are provided with the strength and resilience necessary to give stable low resistance connection, to minute areas of a device, such as a thousand or so closely spaced surface pads of an integrated circuit. Each contact is initially formed on a substrate as a thin, narrow elongated flat body comprised of selectively deposited layers of metal. Depending on the final configuration desired for the contact, the metal of one metal layer has a coefficient of thermal expansion such as chromium (Cr), and the metal of another layer has a coefficient of thermal expansion such as copper (Cu). Each contact is permanently formed (by differential expansion of the metal layers when heated) into a three-dimensional structure and is then made “robust” by a covering of a specialized stiffening metal plating which adds substantial strength to the contact.

Abstract: The present invention relates to a transfer type circuit board fabricating system including a conveyor device for transferring circuit boards in a predetermined transfer direction through a component placing device for placing electronic components on the circuit boards. The conveyor device includes a pair of conveying surfaces for conveying the circuit boards and a pair of board supports for supporting one of the circuit boards. Each board support extends between and is supported by the pair of conveying surfaces. A table having a surface is situated below both the pair of conveying surfaces and the pair of board supports. A pair of deflection shields extend from and at an acute angle with respect to the surface of the table to terminate at an edge. Each edge is flush with and adjacent to one of the conveying surfaces and is also beneath the pair of board supports.

Abstract: A method of manufacturing piezoelectric resonant components includes laminating two encapsulating substrates having a piezoelectric substrate disposed therebetween. The piezoelectric substrate includes adhesive layers on the surfaces of the piezoelectric substrate for bonding the two encapsulating substrates to the piezoelectric substrate. The adhesive layers include pass-through openings at a periphery of the piezoelectric substrate such that the adhesive layers are thicker at areas around the pass-through openings. As a result, gaps are prevented from being formed at sections where the adhesive layer is thin, thereby preventing the outer electrodes from short-circuiting.