Abstract: A bonding pad for use in attaching a semiconductor chip to a printed circuit board, includes: a copper layer; an organic layer disposed over the copper layer in a pattern such that part of the copper layer is exposed; and a gold layer disposed over the organic layer and in contact with the exposed part of the copper layer.
Type:
Grant
Filed:
June 20, 2014
Date of Patent:
November 17, 2015
Assignee:
Avago Technologies General IP (Singapore) Pte. Ltd.
Inventors:
Jin Jeong, Chris Chung, Deog Soon Choi, Young Ho Lee, Yong-Ik Choi
Abstract: Disclosed is a component built-in wiring board including: a first insulating layer on a second one having laminated at least two insulating layers; a semiconductor chip buried in the second insulating layer, having a terminal pad; a wiring pattern between the first and the second insulating layers, including a mounting land and having a roughened surface facing the second insulating layer; a conductive bump between the terminal pad and the mounting land; a resin between the semiconductor chip and both the first insulating layer and the wiring pattern; a second wiring pattern between the at least two insulating layers; and an interlayer connector between surfaces of the wiring pattern and the second wiring pattern to penetrate partly through the second insulating layer in a layered direction, made of a conductive composition, and having a shape with an axis along the layered direction and a diameter varying in an axial direction.
Abstract: A cochlear implant system includes: an electrode array implanted within a cochlea; an internal processor in communication with the electrode array; an implanted antenna which is electrically coupled to the internal processor; and a modular external headpiece which is removably positioned over the implanted antenna, the modular external headpiece including a core containing a sound processor for processing sound and providing a corresponding signal to the implanted antenna; and a modular component configured to releasably engage the core and supply electrical power to the core.
Type:
Grant
Filed:
March 4, 2009
Date of Patent:
September 18, 2012
Assignee:
Advanced Bionics, LLC
Inventors:
Scott A. Crawford, Douglas P. Lynch, Carla Mann Woods
Abstract: A solid-state imaging device includes a light-receiving portion, which serves as a pixel, and a waveguide, which is disposed at a location in accordance with the light-receiving portion and which includes a clad layer and a core layer embedded having a refractive index distribution in the wave-guiding direction.
Type:
Grant
Filed:
September 25, 2009
Date of Patent:
August 7, 2012
Assignee:
Sony Corporation
Inventors:
Hiromi Wano, Takamasa Tanikuni, Shinichi Yoshida