Abstract: Systems and methods for a variable delay line using variable capacitors in a time delay filter are provided. In at least one embodiment, a delay line is configured to apply an adjustable time delay to an electromagnetic signal travelling through the delay line. The delay line comprises a filter that includes a first variable capacitor. Further, a capacitance of the first variable capacitor is configured to adjust the delay applied to the electromagnetic signal travelling through the delay line when varied.

Abstract: System and method for calibrating a step attenuator. N attenuation measurements of a step attenuator may be received, where the step attenuator includes M series-connected attenuation sections. Each attenuation section may be configured to switchably provide a respective level of attenuation, where N is greater than M, and where the step attenuator may be modeled via M+1 coefficients, including a coefficient for a no-attenuation state and respective coefficients for the attenuation sections. Values of the coefficients may be determined via least squares estimation using the N attenuation measurements, thereby calibrating the step attenuator.

Abstract: A signal line conductor extends in a direction in which a signal propagates, and a dielectric, surrounding the signal line conductor, also extends in the direction in which the signal propagates. Conductive films that define and function as a ground conductor extend on a side surface of the dielectric in the direction in which the signal propagates. Furthermore, conductive films that define and function as a bridge conductor extend on a side surface of the dielectric in a direction across the direction in which the signal propagates, and thus connect the conductive films to each other.

Abstract: A transformer filter arrangement (30) for passing signals at a fundamental frequency and suppressing signals at one or more interfering frequencies is disclosed. It comprises a transformer (100) having a first winding (110) and a second winding (120), wherein the first winding (110) has a first end (112a) and a second end (122b) and the second winding (120) has a first end (122a) and a second end (122b). It further comprises one or more capacitors (130a-e).

Abstract: Embodiments of a low-complexity and potentially physically small wideband impedance transformer that can be used in a combining network of a wideband Doherty amplifier are disclosed. In one embodiment, a wideband Doherty amplifier includes Doherty amplifier circuitry and a wideband combining network. The wideband combining network includes a wideband quarter-wave impedance transformer that includes a quarter-wave impedance transformer and compensation circuitry connected in parallel with the quarter-wave impedance transformer at a low-impedance end of the quarter-wave impedance transformer. The compensation circuitry is configured to reduce a total quality factor of the wideband quarter-wave impedance transformer as compared to a quality factor of the quarter-wave impedance transformer, which in turn increases a bandwidth of the wideband quarter-wave impedance transformer, and thus a bandwidth of the wideband Doherty amplifier.

Abstract: An integrated circuit, comprising a single-ended pin for transmitting and/or receiving an RF signal. A first matching network is configured to match an impedance of the RF signal. A second matching network is configured to match an impedance of an on-chip differential circuit. A third matching network is configured to match an impedance of an on-chip single-ended circuit, wherein the third matching network is connectable to the first matching network. A transformer is connected or connectable to the second matching network and to the first matching network. Switches control an operating mode of the integrated circuit The second matching network is connected with the first matching network via the transformer, or the third matching network is connected with the first matching network.

Abstract: A board connection structure includes an opening, which is formed at a perimeter of a waveguide in a first board, and an opening, which is formed at a perimeter of a waveguide in a second board. The openings are connected to each other. The first board and the second board are connected with an insulation film disposed therebetween. The insulation film has a thickness of 60% or less of a waveguide width that determines a propagation mode in at least one of the waveguide in the first board and the waveguide in the second board.

Abstract: A tunable resonator includes at least one tunable capacitor coupled with at least one tunable inductor. The tunable resonator includes a mechanical tuning mechanism coupled with a connecting bridge and with first and second electrodes of the tunable inductor. The mechanical tuning mechanism also moves the first and second electrodes of the tunable inductor relative to an electrode of the tunable capacitor, and providing a force down onto or to pull up a connecting bridge to tune the tunable inductor.

Abstract: A transformer filter arrangement including a transformer having a first winding and a second winding is provided. Both of the first and the second windings are located between an outer border and an inner border, which is inside the outer border. The transformer filter arrangement further includes at least one reactive sub circuit, each including at least one inductor. The first winding of the transformer is divided into a plurality of winding segments. At least a first one of the at least one reactive sub circuit being connected in series with the winding segments of the first winding between two such winding segments, and having at least one of the at least one inductor located inside said inner border.

Abstract: A radio frequency transmission arrangement comprises a ground plate (8) having first and second opposite sides and a boss protruding from said second side of the ground plate (8), a first transmission line comprising a first elongate conductor (1) passing from the first side of the ground plate through an aperture (3) in the ground plate and the boss, and a second transmission line comprising a second elongate conductor (2) and a ground plane (6), the first elongate conductor (1) passing through the ground plane (6) to connect to the second elongate conductor. The boss has an end surface (4) disposed in a substantially parallel relationship with the ground plane (6) of the second transmission line, and there is a gap between the end surface of the boss and the ground plane.

Abstract: A tunable chirped delay line arrangement (0) configured to operatively propagate a signal and includes a at least one chirped delay line (1) arranged along a reference direction (z) on a dielectric layer (2) arranged on a ground plane (3). The chirped delay line (1) is configured with a smoothly varying width along the reference direction (z), and the arrangement (0) further comprising at least one electronically tunable impedance (5) interconnecting the at least one delay line (1) and the ground plane (3) at at least one location along the reference direction (z) such that the at least one delay line (1) is loaded by the tunable impedance (5).

Abstract: Provided are radio frequency electromagnetic energy switches and processes of regulating the transmission of RF energy, that for the first time successfully employ a ChG PCM as a RF switching material.

Abstract: The apparatus includes a base having a hole in a top surface, a fastener having a longitudinal section with the longitudinal section extending into the hole, and a shell. The shell has a connecting section connecting a first lateral surface section and a second lateral surface section. At least a portion of the first lateral surface section extends into the hole. The second lateral surface section extends away from the top surface of the base. The connecting section is disposed between the top surface of the base and a portion of the fastener. The connecting section has a first section and a second section, and the first section has a non-linear cross-section. The apparatus further includes a washer disposed between the portion of the fastener and the connecting section, and a portion of the washer engages the first section of the connecting section.

Abstract: A high frequency module wiring board includes a wiring section for high frequency transmission, and a solder resist layer formed upon the wiring section. The solder resist layer covers the wiring section so as to have an opening section at a part of the wiring section in a region extending within a predetermined distance from an input/output terminal of a chip component.

Abstract: A connector for data transmission at an interface between two apparatuses for food production, such as meat and sausage production, having a first connecting element connected to the first apparatus and being at least one first data transmission part, a second connecting element connected to the second apparatus and being at least one second data transmission part, the first data transmission part being galvanically isolated from the second data transmission part such that data transmission from the first connecting element to the second connecting element is effected in a galvanically isolated manner.

Abstract: A switchable band-pass filter is described that includes a first capacitor, a first switch circuit, and a second switching circuit arranged in parallel between a first node and a second node. The first switching circuit includes a third node and a first switch. The first switch is coupled between the third node and the second node. The second switching circuit includes a fourth node and a second switch. The second switch is coupled between the fourth node and the second node. A linking circuit is coupled between the third node. Methods for operating the switchable band-pass filter are also described.

Abstract: Among other things, one or more techniques and systems for selectively filtering RF signals within one or more RF frequency band are provided. In particular, an RF choke, such as a 3D RF choke or a semi-lumped RF choke, configured to selectively filter such RF signals is provided. The RF choke comprises a metal connection line configured as an inductive element for the RF choke. In an example, one or more metal lines, such as a metal open stub, are formed as capacitive elements for the RF choke. In another example, one or more through vias are formed as capacitive elements for the RF choke. In this way, the RF choke allows DC power signals to pass through the metal connection line, while impeding RF signals within the one or more RF frequency bands from passing through the metal connection line.

Abstract: A frequency band splitter is disclosed. The frequency band splitter includes a first, a second, and a third waveguides. A first narrow rectangular waveguide is utilized to connect the first waveguide to second waveguide. The first narrow rectangular waveguide has a first width to allow signals of a frequency band centered around a first frequency to be transmitted from the first waveguide to the second waveguide. A second narrow rectangular waveguide is utilized to connect the first waveguide to the third waveguide. The second narrow rectangular waveguide has a second width, which is different from the first width, to allow signals of a frequency band centered around a second frequency to be transmitted from the first waveguide to the third waveguide.

Abstract: A noise filter device includes a ground connection terminal (21) for grounding, a coil (31) formed by winding a conductive wire (33), a pair of capacitors (41) constituting a ?-type filter circuit C together with the coil (31) and to be electrically connected to the ground connection terminal (21), and a housing (11) capable of housing the coil (31) and the pair of capacitors (41). The capacitors are both arranged on one surface side of a virtual plane dividing the coil into two in an axial direction, and a conductive shielding plate (24B) to be grounded to the ground connection terminal (21) is interposed between the capacitors (41).

Abstract: A high frequency module includes a multilayer substrate, a power amplifier, thermal vias, and a bandpass filter. The power amplifier is mounted on the multilayer substrate. The thermal vias are provided in the multilayer substrate directly below the power amplifier and configured to dissipate heat of the power amplifier. The bandpass filter is provided in the multilayer substrate and connected to the power amplifier. The thermal via defines an inductor included in the bandpass filter. The bandpass filter overlaps the power amplifier when viewed in a lamination direction of the multilayer substrate.