Patents Examined by Albert Hilton
-
Patent number: 8065974Abstract: Apparatus for coating an item with a dry particulate material. An electrically operated sifter in a dry coating assembly generates a shower of the dry particulate material which coats the items held in an open mesh basket. A collector recovers residual material which can then be returned to the sifter. Extraneous clumps formed from the dry particulate material and any liquid coating can be readily removed from the sifter. An optional wet coating assembly allows an operator to coat the items with a batter before the application of the dry particulate material.Type: GrantFiled: August 17, 2006Date of Patent: November 29, 2011Inventor: Howard M. Rome
-
Patent number: 8061297Abstract: According to the present disclosure, a printer apparatus may include a chuck configured to support a substrate thereon, a rail spaced apart from the chuck, a printhead carriage frame coupled to the rail, and a printhead carriage coupled to the printhead carriage frame. The printhead carriage may include a printhead and an actuation mechanism. The actuation assembly may be coupled to the printhead carriage and may be selectively engagable with the printhead for selective displacement of the printhead relative to the printhead carriage.Type: GrantFiled: April 25, 2006Date of Patent: November 22, 2011Assignee: Ulvac, Inc.Inventors: David Albertalli, Paul A. Parks, Scott D. Slade, Roy M. Patterson
-
Patent number: 8051799Abstract: An apparatus includes a housing defining a chamber in which an electric field is generated, and an internal member provided in the chamber. At least one part of the internal member is formed of a dielectric material. A process is executed in the chamber so that a dielectric deposit is formed on the at least one part of the internal member. An m1(d?1/dm1) value of the dielectric material and an m2(d?2/dm2) value of the dielectric deposit are set so that production of particles from the deposit is properly controlled. The term m1 is a mass density of the dielectric material, ?1 is a permittivity of the dielectric material, m2 is a mass density of the dielectric deposit, and ?2 is a permittivity of the dielectric deposit.Type: GrantFiled: June 28, 2007Date of Patent: November 8, 2011Assignee: Renesas Electronics CorporationInventors: Yousuke Itagaki, Natsuko Ito, Fumihiko Uesugi
-
Patent number: 8047156Abstract: The present disclosure is drawn to dice with polymer ribs. In one example, a die structure can comprise a die having a plurality of die slots, the die having polymer ribs attached to one side thereof, wherein the polymer ribs are attached using a polymer film on one side of the die, said polymer film having portions removed along the die slots to form the polymer ribs which bridge the die slots, thereby forming a plurality of polymer bridged die slots.Type: GrantFiled: July 2, 2007Date of Patent: November 1, 2011Assignee: Hewlett-Packard Development Company, L.P.Inventors: Manish Giri, Arun K. Agarwal, Bradley D. Chung, Jeremy Harlan Donaldson
-
Patent number: 8037842Abstract: An ink mixed with spacer members is ejected onto one or both of a TFT substrate and a CF substrate while an ink jet head having a plurality of ink jet nozzles is moved. The excursions of a predetermined number of ink jet nozzles from an end of the ink jet head overlap those of a next excursion of the ink jet head without causing overlapping of ejected ink within the overlapping area. An abrupt stepwise change in the amount of ejected ink is suppressed whereby an uneven gap is suppressed.Type: GrantFiled: March 31, 2008Date of Patent: October 18, 2011Assignee: NEC LCD Technologies, LtdInventor: Hisashi Kuwata
-
Patent number: 8025023Abstract: Wafers A1 to A10 of a first lot A and wafers B1 to B10 of a second lot B are processed by a second heating unit at different temperatures, respectively. A wafer W is carried in a processing block included in coating and developing system along a route passing a temperature control unit CPL2, a coating unit BCT, a heating unit LHP2, a temperature control unit CPL3, a coating unit COT, a heating unit LHP3, and a cooling unit COL in that order. The process temperature of the heating unit LHP3 is changed after the last wafer A10 of the first lot A has been processed by the heating unit LHP3.Type: GrantFiled: July 16, 2007Date of Patent: September 27, 2011Assignee: Tokyo Electron LimitedInventors: Yasushi Hayashida, Yoshitaka Hara
-
Patent number: 8020512Abstract: A pattern formation device includes a conveyance table, a pair of guide rails, a carriage, a plurality of droplet discharge heads, an inspection camera, a camera base, a linear motor, a motor housing case, a moving cable, and a cable housing case. The motor housing case is disposed along the guide rails to accommodate the linear motor and has a guide opening configured and arranged to guide the camera base. The cable housing case is disposed along the motor housing case to accommodate the moving cable and has a window section through which a distal end of the moving cable follows a reciprocal operation of the inspection camera. The cable housing case or one of the guide rails has an exhaust vent to discharge air around the carriage by suction through the window section of the cable housing case or the guide opening of the motor housing case.Type: GrantFiled: August 25, 2008Date of Patent: September 20, 2011Assignee: Seiko Epson CorporationInventor: Eijiro Fujimori
-
Patent number: 8015938Abstract: Coating zones having guide elevated rails for coating and/or handling robots are disclosed. The coating zones may include walk-in control areas positioned one above the other on the outside of the side walls. In the upper control area, in which control and supply devices for robots on elevated guide rails may be provided, the side wall may generally slant inward. Load-bearing structures for the elevated guide rails may be braced by supporting members extending generally perpendicular to the line of conveyance of the application objects on or under the floor level or at the ceiling.Type: GrantFiled: October 20, 2006Date of Patent: September 13, 2011Assignee: Duerr Systems Inc.Inventors: Frank Herre, Jürgen Haas, Michael Baumann, Bekim Maxharraj, Nedime Maxharraj, legal representative, Marcus Frey, Hans Vetters, Jan Grigoleit
-
Patent number: 8011315Abstract: A thin film forming apparatus such that a substrate can be easily fixed/removed to/from the outer circumferential surface of a drum type substrate holder through a simple arrangement. The drum type substrate holder (5) is supported in a horizontal posture rotatably about a horizontal rotational shaft in a film deposition chamber A jig (13) holding a substrate (12) fixedly is transferred by an arm horizontally onto the outer circumferential surface of the drum type substrate holder (5), and an end part (13b) of the substrate fixing jig (13) can be secured by a securing device (14) provided at the corner part (5a) of the outer circumferential surface of the drum type substrate holder (5).Type: GrantFiled: February 10, 2005Date of Patent: September 6, 2011Assignee: ULVAC, Inc.Inventors: Takafumi Matsumoto, Shun Mikami, Kouichi Hanzawa, Mineharu Moriya, Hideyuki Odagi, Tetsuya Shimada, Masashi Kubo, Susumu Ikeda
-
Patent number: 8001921Abstract: A liquid application device capable of applying liquid to different size medium includes a transfer device for transferring the medium, a regulating member for regulating a transferring position of the transferred medium, and a liquid applicator including an application member for applying liquid to the medium transferred by the transfer means and a retention member for retaining the liquid in a liquid retention space which is formed by causing the retention member to abut on the application member. In addition, a storage device stores the liquid, a supply channel supplies the liquid in the storage device to the liquid retention space, a collection channel collects the liquid in the liquid retention space into the storage device, and a supply port is formed in the retention member and is connected to the supply channel. Also, a collection port is formed in the retention member and is connected to the collection channel, and a pump generates a flow of liquid in a liquid channel.Type: GrantFiled: October 3, 2006Date of Patent: August 23, 2011Assignee: Canon Kabushiki KaishaInventors: Naomi Oshio, Osamu Iwasaki, Yoshinori Nakagawa, Atsuhiko Masuyama, Naoji Otsuka
-
Patent number: 7989023Abstract: Method for performing a thermal spray process. Method includes heating and/or accelerating a gas to form an effluent gas stream, feeding a particulate-bearing carrier stream through an axial injection port into the effluent gas stream to form a mixed stream, in which the axial injection port includes a plurality of chevrons located at a distal end of said axial injection port, and impacting the mixed stream on a substrate to form a coating.Type: GrantFiled: November 2, 2010Date of Patent: August 2, 2011Assignee: Sulzer Metco (US), Inc.Inventors: Felix Muggli, Marc Heggemann, Ronald J. Molz
-
Patent number: 7980197Abstract: A dispenser for dispensing a volume of viscous material on a substrate includes a frame, a gantry system coupled to the frame, and a dispenser unit coupled to the gantry system. The dispenser unit includes a housing having a chamber and a piston disposed in the chamber. The piston is configured to move between a pre-dispense position and a dispense position within the chamber. The dispenser unit further includes a dispensing bore configured to receive the piston therein and a nozzle coupled to the housing. A controller is coupled to the piston to control the operation of the piston. The dispenser is constructed such that a volume of viscous material dispensed from the dispensing bore is substantially equal to the volume of the piston entering the dispensing bore when moving the piston to the dispense position. Other embodiments and methods of dispensing viscous material are further disclosed.Type: GrantFiled: February 16, 2007Date of Patent: July 19, 2011Assignee: Illinois Tool Works, Inc.Inventors: Thomas C. Prentice, Kenneth C. Crouch
-
Patent number: 7966966Abstract: The present invention proposes a vacuum/high pressure filling apparatus which can improve the filling rate and shorten the impregnating time period in immersing a porous workpiece into a filling liquid. The vacuum/high pressure filling apparatus includes: an openable and closable hermetic partition chamber unit constituted by two upper and lower split partition wall unit portions, a partition chamber unit opening and closing mechanism to open and close the partition chamber unit, a vacuum suction opening and a pressurizing opening provided for the partition chamber unit, a liquid vessel arranged in the partition chamber unit to receive a filling liquid, a holder arranged, in the partition chamber unit, for the porous workpiece, an elevator unit to move the filling liquid in the liquid vessel and the porous workpiece relative to each other inside the partition chamber unit so as to immerse the porous workpiece into the filling liquid in the liquid vessel and pull up the workpiece from the filling liquid.Type: GrantFiled: May 24, 2006Date of Patent: June 28, 2011Assignee: Mikado Technos Co., Ltd.Inventor: Hidetoshi Ito
-
Patent number: 7954446Abstract: A hopper for cleaning a coating machine in which a rotary atomizing head extends through an opening in the upper surface of a hopper housing, a thinner for cleaning the rotary atomizing coating machine and a residual coating material are sprayed on the inside, an airstream control member for preventing flow from ascending from the inside of the housing to the outside of the housing through a gap between the coating machine and the opening by the rotation of the rotary atomizing head corresponding to the gap between the coating machine and the opening, and the control member is formed with an air vent hole for supplying air to a negative pressure zone formed just below the rotary atomizing head.Type: GrantFiled: December 15, 2005Date of Patent: June 7, 2011Assignee: Trinity Industrial CorporationInventors: Shinichi Nakane, Takao Ueno, Koji Sakuraba
-
Patent number: 7926439Abstract: A coating device includes a box-shaped processing chamber. Slits are respectively provided on four side surfaces of the processing chamber. A box-shaped housing is provided so as to surround the processing chamber. A space is formed between the processing chamber and the housing. A fan filter unit for forming downflow in the space is provided on the top of the housing. Air supplied to the fan filter unit is cleaned by the fan filter unit, and is supplied to the space. The air supplied to the space is supplied to the processing chamber through each of the slits in the processing chamber. This causes a twister-shaped air current to be generated within the processing chamber.Type: GrantFiled: July 26, 2007Date of Patent: April 19, 2011Assignee: Dainippon Screen Mfg Co., Ltd.Inventors: Masakazu Sanada, Osamu Tamada
-
Patent number: 7926441Abstract: In the coating treatment apparatus, in a first treatment chamber, the front and rear surfaces of the substrate held by a transfer arm are inverted by a turning mechanism, and a coating solution is applied from a coating nozzle to the rear surface of the substrate. The substrate is transferred into a second treatment chamber, in which the coating solution on the rear surface is heated by a heating unit to cure, thereby forming a coating film on the rear surface of the substrate. The formation of the coating film by the coating treatment apparatus is performed before exposure processing, whereby the rear surface of the substrate can be flat for the exposure processing.Type: GrantFiled: January 18, 2008Date of Patent: April 19, 2011Assignee: Tokyo Electron LimitedInventors: Kenji Tsutsumi, Junichi Kitano, Osamu Miyahara, Hideharu Kyouda
-
Patent number: 7921803Abstract: The present invention generally provides method and apparatus for non-contact temperature measurement in a semiconductor processing chamber. Particularly, the present invention provides methods and apparatus for non-contact temperature measurement for temperature below 500° C. One embodiment of the present invention provides an apparatus for processing semiconductor substrates. The apparatus comprises a target component comprises a material with higher emissivity than the one or more substrates.Type: GrantFiled: September 21, 2007Date of Patent: April 12, 2011Assignee: Applied Materials, Inc.Inventors: Joseph Yudovsky, Brendan McDougall, Ravi Jallepally, Yi-Chiau Huang, Maitreyee Mahajani, Kevin Griffin, Andrew C. Sherman
-
Patent number: 7908997Abstract: A new and improved hybrid hot melt adhesive or other thermoplastic material dispensing system wherein two or more different hot melt adhesive or other thermoplastic material depositions, comprising, for example, two or more different types of patterns, two or more different types of application techniques or processes, or two or more different types of cyclical operations, can effectively be simultaneously achieved at substantially two or more different locations relative to an underlying substrate. The hybrid system comprises a metering station upon which is mounted a metering head comprising a plurality of metering head dispensing modules, and a pair or remote applicator heads comprising a pair of applicator head dispensing modules.Type: GrantFiled: June 4, 2007Date of Patent: March 22, 2011Assignee: Illinois Tool Works Inc.Inventors: Mel Steven Lessley, Daniel D. Bourget
-
Patent number: 7908993Abstract: A film forming apparatus including a film forming chamber which forms a film, a jetting mechanism which jets aerosol containing material particles onto a substrate in the film forming chamber, a measuring chamber communicating with the film forming chamber, a measuring mechanism which measures a thickness of the film in the measuring chamber, a pressure adjusting mechanism which controls an internal pressure of the film forming chamber and the measuring chamber, a conveyor which transports the substrate between the film forming chamber and the measuring chamber, and a blocking section which blocks a communication between the film forming chamber and the measuring chamber. Accordingly, inside of the measuring chamber is maintained clean without being polluted with the aerosol, and the measurement precision can be maintained. In the film forming process, the film thickness can be easily and precisely measured, and fed back to the film forming condition.Type: GrantFiled: August 23, 2006Date of Patent: March 22, 2011Assignees: Brother Kogyo Kabushiki Kaisha, National Institute of Advanced Science and TechnologyInventors: Motohiro Yasui, Jun Akedo
-
Patent number: 7905194Abstract: An apparatus for applying a fluid to a convolutely wound roll of web substrate is disclosed. The apparatus provides for a fluid applicator having a manifold and a first surface. The fluid is fluidly displaceable from the manifold to the first surface through at least one opening disposed therein. The convolutely wound roll of web substrate is disposable upon the first surface. The fluid is fluidly displaced from the first surface to the convolutely wound roll of web substrate.Type: GrantFiled: June 23, 2006Date of Patent: March 15, 2011Assignee: The Procter & Gamble CompanyInventors: Thomas Timothy Byrne, Thomas Edward Franklin