Patents Examined by Albert Kang Wong
  • Headphone assembly with interchangeable earpiece module
    Patent number: 10015580
    Abstract: The present invention is a headphone assembly comprising a headband for fitting around the head of the user, a first earpiece module detachably connected to the first end of the headband, and a second earpiece module detachably connected to the second end of the headband.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: July 3, 2018
    Inventor: Joseph R. Bruno