Patents Examined by Alex Efta
  • Patent number: 8980027
    Abstract: The method comprises the steps of: forming a porous fiber-reinforcing structure; introducing into the pores of the fiber structure powders containing elements for constituting the composite material matrix; and forming at least a main fraction of the matrix from said powders by causing a reaction to take place between said powders or between at least a portion of said powders and at least one delivered additional element; the powders introduced into the fiber structure and the delivered additional element(s) comprising elements that form at least one healing discontinuous matrix phase including a boron compound and at least one discontinuous matrix phase including a crack-deflecting compound of lamellar structure. At least a main fraction of the matrix is formed by chemical reaction between the powders introduced into the fiber structure and at least one delivered additional element, or by sintering the powders.
    Type: Grant
    Filed: October 16, 2007
    Date of Patent: March 17, 2015
    Assignee: Herakles
    Inventors: René Pailler, Nicolas Eberling-Fux, Eric Philippe, Sébastien Bertrand
  • Patent number: 8961719
    Abstract: A method for making a treated super-hard structure, the method including providing a super-hard structure comprising super-hard material selected from polycrystalline cubic boron nitride (PCBN) material or thermally stable polycrystalline diamond (PCD) material; subjecting the super-hard structure to heat treatment at a treatment temperature of greater than 700 degrees centigrade at a treatment pressure at which the super-hard material is not thermodynamically stable, for a treatment period of at least about 5 minutes to produce the treated super-hard structure.
    Type: Grant
    Filed: May 25, 2012
    Date of Patent: February 24, 2015
    Assignee: Element Six Limited
    Inventors: Stig Åke Andersin, Bernd Heinrich Ries, Frank Friedrich Lachmann, Lars-Ivar Nilsson
  • Patent number: 8956480
    Abstract: The carbon-carbon composite material is obtained by densification with a pyrolytic carbon matrix originating from a precursor in gaseous state at least in a main external phase of the matrix, and, at the end of the densification, final heat treatment is performed at a temperature lying in the range 1400° C. to 1800° C.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: February 17, 2015
    Assignee: Messier-Bugatti-Dowty
    Inventors: Jean-Marie Jouin, Eric Lherm, Philippe Turgis
  • Patent number: 8956490
    Abstract: In a method of forming an identification card, a card substrate having a surface is provided. A film laminate comprising a backing layer and one or more dried transferable layers attached to the backing layer is provided. One of the transferable layers comprises a coating comprising an inorganic ceramic-like material and a water insoluble polymer binder. The film laminate is laminated to the surface of the card substrate such that an exposed surface of the one or more transferable layers adheres to the surface of the card substrate. The backing layer is then removed from at least a portion of the one or more transferable layers that remain adhered to the surface of the card substrate. Additional embodiments are generally directed to a method of protecting a surface of an identification card and identification card manufacturing devices for performing the methods.
    Type: Grant
    Filed: June 11, 2008
    Date of Patent: February 17, 2015
    Assignee: Assa Abloy AB
    Inventor: Karl A. Karst
  • Patent number: 8956483
    Abstract: A method for manufacturing a casing of a heat pipe includes steps: providing a hollow mold; injecting a feedstock of powder and molten binder into the mold under pressure, thus forming a desired body of a first shell and a desired body of a second shell; separating the binder from the body of the first shell and the body of the second; sintering the body of the first shell and the body of the second shell, thereby forming the first shell and the second shell; and mounting the second shell on the first shell and sintering the first shell and the second shell together, thereby forming the casing of the heat pipe.
    Type: Grant
    Filed: October 25, 2012
    Date of Patent: February 17, 2015
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Ming-Hsiu Chung, Nien-Tien Cheng
  • Patent number: 8956479
    Abstract: A composite material having utility for removing sulfur from a feedstock comprises a ceramic matrix having a relatively low melting point metal such as tin, zinc, lead or bismuth nanodispersed therein. The material may be prepared from a mixture of particles of a precursor of the ceramic matrix and precursor of the metal. The precursors are selected such that the melting point of the precursor of the ceramic is less than the melting point of the precursor of the metal. The mixture of precursor materials is heated to a temperature sufficient to melt the precursor of the ceramic material so as to coat it onto the precursor of the metal. The ceramic precursor is then reacted so as to convert it to a ceramic. Thereafter, the precursor of the metal is converted to a free metal which is retained within the ceramic matrix so as to prevent agglomeration.
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: February 17, 2015
    Assignee: A123 Systems LLC
    Inventors: Hanwei Lei, Maha Hammoud, Adam Rand, Liya Wang
  • Patent number: 8955572
    Abstract: A trigger-operated adhesive dispenser includes a rack, a handle affixed to the rack, a swing frame pivotally mounted at the rack, a cutter blade fixedly mounted at the rack, a stopper member pivotally mounted at the rack, and a trigger mounted at the handle. When the trigger is not pressed, the swing frame is stopped by the stopper member and prohibited from being biased, allowing the adhesive tape to be pulled out and adhered to the object to be packed. When pressing the trigger, the trigger will push the stopper member to release the swing frame, enabling the swing frame to be biased, and thus the cutter blade can forced to cut off the applied adhesive tape.
    Type: Grant
    Filed: June 5, 2013
    Date of Patent: February 17, 2015
    Inventor: Harrison Huang
  • Patent number: 8956481
    Abstract: The present invention relates to a method of assembling carbon parts using a braze based on silicon carbide. The invention also relates to the parts assembled using such a method.
    Type: Grant
    Filed: September 3, 2009
    Date of Patent: February 17, 2015
    Assignees: Commissariat a l'Energie Atomique et aux Energies Alternatives, Institut National Polytechnique de Grenoble
    Inventors: Jean-Paul Garandet, Denis Camel, Beatrice Drevet, Nicolas Eustathopoulos, Rana Israel
  • Patent number: 8956486
    Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: February 17, 2015
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Togo Matsui, Minoru Dooka, Hiroyoshi Takashima, Kenichi Okajima
  • Patent number: 8956482
    Abstract: A ceramics composite member includes a structure in which a first ceramic member and a second ceramic member are integrated with a joint portion. The joint portion has a texture in which a silicon phase having an average diameter of 0.05 ?m or more and 10 ?m or less is continuously provided in a network form in interstices of silicon carbide particles having an average particle diameter of 0.1 ?m or more and 0.1 mm or less.
    Type: Grant
    Filed: March 19, 2012
    Date of Patent: February 17, 2015
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Shoko Suyama, Yoshiyasu Ito, Shigeki Maruyama, Norihiko Handa
  • Patent number: 8955573
    Abstract: The present invention resides in an apparatus for use with a plaster taping device, the apparatus comprising a base for removably attaching the apparatus to the plaster taping device and a frame having a first end coupled to the base and a second end for supporting a wheel member rotatably connected thereto, wherein the wheel member facilitates application of a tape material along an internal corner joint.
    Type: Grant
    Filed: February 4, 2011
    Date of Patent: February 17, 2015
    Inventors: Eamonn Oliver Owens, Daniel Luke Owens
  • Patent number: 8956478
    Abstract: A process for joining, by spark plasma sintering, at least two refractory ceramic parts, each of the parts having at least one surface to be joined by spark plasma sintering, in which surfaces to be joined are brought into contact without addition of any sort between the surfaces. Then, a joining pressure of 1 to 200 MPa is applied to the ceramic parts. A pulsed electric current having an intensity of 500 A to 8000 A is applied to the ceramic parts so as to raise the temperature of the parts to a joining temperature of at least 1300° C. Then, the electric current is terminated simultaneously with the pressure, and the parts are cooled, and the joined parts are recovered.
    Type: Grant
    Filed: September 27, 2007
    Date of Patent: February 17, 2015
    Assignee: Commissariat a l'Energie Atomique
    Inventors: Alexandre Allemand, Fabienne Audubert
  • Patent number: 8956485
    Abstract: A method of producing an electrical component includes forming a stack of ceramic green films, where the stack has a hole that is accessible from external to the stack, inserting a cover into the hole, and sintering the stack together with the cover. The method may also include boring the hole through the stack of ceramic green films.
    Type: Grant
    Filed: April 13, 2010
    Date of Patent: February 17, 2015
    Assignee: EPCOS AG
    Inventors: Heinz Florian, Wolfgang Vogl, Igor Kartashev
  • Patent number: 8956484
    Abstract: Disclosed herein are methods for bonding refractory substrates, such as zircon substrates, without the use of a bonding agent. Exemplary methods include (a) providing a plurality of refractory components, each component having at least one surface to be bonded, (b) polishing each surface to be bonded to a surface roughness (Ra) of 200 nm or finer, (c) contacting the surfaces to be bonded to form an unbonded refractory substrate, (d) firing the unbonded refractory substrate, and (e) subjecting the surfaces to be bonded to a compressive force during firing. Methods for making refractory forming bodies are also disclosed herein.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: February 17, 2015
    Assignee: Corning Incorporated
    Inventors: William Peter Addiego, Michael John Bennett, Michael Patrick Carson, Jeffrey Scott Davis, Martin Herbert Goller, Benjamin Zain Hanson, Tracey Lynn Timmons
  • Patent number: 8940112
    Abstract: A method of making a solid oxide fuel cell (SOFC) includes forming a first sublayer of a first electrode on a first side of a planar solid oxide electrolyte and drying the first sublayer of the first electrode. The method also includes forming a second sublayer of the first electrode on the dried first sublayer of the first electrode prior to firing the first sublayer of the first electrode, firing the first and second sublayers of the first electrode during the same first firing step, and forming a second electrode on a second side of the solid oxide electrolyte.
    Type: Grant
    Filed: April 24, 2013
    Date of Patent: January 27, 2015
    Assignee: Bloom Energy Corporation
    Inventors: Emad El Batawi, Patrick Munoz, Dien Nguyen
  • Patent number: 8864925
    Abstract: A method of manufacturing a laminated electronic part includes fabricating first and second laminated sheets by laminating an insulating function layer made of an unsintered ceramic material and a conductor layer, having a plurality of conductors two-dimensionally arranged in a vertical direction and in a horizontal direction to make up part of circuit components; cutting the first and second laminated sheets into sticks to create a plurality of first and second laminate sticks; fabricating a third laminated sheet by rotating the second laminate sticks by 90°, arranging the second laminate sticks to be each sandwiched between the first laminate sticks, and thermocompression bonding them for integration; singulating the third laminated sheet into chips and creating sintered bodies by sintering the unsintered chips to integrate the first laminate with the second laminate.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: October 21, 2014
    Assignee: TDK Corporation
    Inventors: Kazunari Kimura, Misaki Tabata, Shigemitsu Tomaki, Akira Nakamura, Isao Abe, Noriyuki Saito
  • Patent number: 8858745
    Abstract: Embodiments of the invention relate to component structures which are useful as apparatus in plasma processing chambers. Portions of the component structures are bonded together using oxyfluoride-comprising glazes, glass ceramics, and combinations thereof. The bonding material is resistant to halogen-containing plasmas and exhibits desirable mechanical properties.
    Type: Grant
    Filed: November 12, 2008
    Date of Patent: October 14, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Jennifer Y. Sun, Ren-Guan Duan, Kenneth S. Collins
  • Patent number: 8858746
    Abstract: A method of manufacturing a laminated body in a raw state for a laminated ceramic capacitor, which includes dielectric ceramic layers containing a dielectric ceramic raw material powder for and internal electrodes, in which a heat treatment is carried out in accordance with a temperature profile in which the average rate of temperature rise is 40° C./second or more from room temperature to a maximum temperature. The dielectric ceramic raw material powder contains a BaTiO3 system as its main constituent and contains Re (Re is at least one selected from Sc, Y, La, Ce, Pr, Nd, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, and Lu) as an accessory constituent, in which the content of Re is 0.3 to 3 parts by mol with respect to 100 parts by mol of the main constituent.
    Type: Grant
    Filed: February 14, 2012
    Date of Patent: October 14, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masayuki Ishihara, Yosuke Hirata, Hideaki Tsuji
  • Patent number: 8839838
    Abstract: This Dispenser having a cutter plate, which is flexibly mounted on a Tape roll, helps in peeling the Tape and is able to cut it by serration provided at the other end. There is an open space, in between the rod and cutter plate, so that Tape can be drawn over from both sides of the dispenser, to cut it by serrations present at the other end. On the cutter plate of the Dispenser, there is a notch and a hole is provided, so that, the cut end of the tape which sticks on the plate, can be easily removed for the next operation. This cutter plate assembly being flexibly attached on a Tape roll, by means of two 0 rings, can swivel like a hinge, so that Tape can be cut at any desired and from a suitable angle. A double cutter is provided to hold a firm grip on the tape, to cut it easily, besides, to protects from injury also.
    Type: Grant
    Filed: November 5, 2012
    Date of Patent: September 23, 2014
    Inventor: Dattatrya Purushottam Parkhe
  • Patent number: 8828186
    Abstract: A method of peeling an electronic component. The method includes a step of, when the electronic component is adhered onto a first main surface of a tape member, bringing a bellowphragm into contact with a second main surface, which is the other main surface of the tape member; and a step of, after the bellowphragm is brought into contact with the second main face, deforming the bellowphragm and the tape member by supplying a fluid to the bellowphragm to thereby peel the electronic component from the tape member.
    Type: Grant
    Filed: March 25, 2009
    Date of Patent: September 9, 2014
    Assignee: Fujitsu Semiconductor Limited
    Inventors: Yoshito Konno, Yutaka Yamada