Abstract: An active element added-optical fiber includes a core, having a radius d and including a first region and a second region, and a cladding that surrounds an outer peripheral surface of the core without a gap and propagates light in a few mode. The first region is a region from a central axis of the core to a radius ra and contains ytterbium as an active element. The second region is a region to the radius d that surrounds the first region without a gap and contains a plurality of dopants, one of which is germanium. The active element is not added to a region within the second region from a radius rc to the radius d. The germanium is not added to a region within the first region from the central axis to a radius rb, and a concentration of the germanium is highest among the plurality of dopants.

Abstract: A control system for frequency control of a laser module, comprising at least one laser module for generating laser radiation, at least one control device coupled or configured to couple to the laser module, and at least one optical resonator coupled or configured to couple to the control device, wherein the control device comprises a semiconductor substrate, a first Pound-Drever-Hall system arranged on the semiconductor substrate and at least one second Pound-Drever-Hall system arranged on the semiconductor substrate, wherein the laser module is coupled to the first Pound-Drever-Hall system of the control device and is configured to couple to the at least second Pound-Drever-Hall system of the control device, wherein the first Pound-Drever-Hall system is coupled to the optical resonator and wherein the second Pound-Drever-Hall system is configured to couple to the optical resonator, and wherein the number of Pound-Drever-Hall systems is greater than the number of laser modules or optical resonators.

Abstract: An array substrate, a method of manufacturing the same, and a display panel are provided. The array substrate includes a substrate, a conductive thin film layer, a first light-shielding layer, a second light-shielding layer, a third light-shielding layer, and an array device layer, wherein orthographic projection areas of the first light-shielding layer and second light-shielding layer on the substrate are positioned in an orthographic projection area of the conductive thin film layer on the substrate, wherein a pixel unit of the array device layer includes a first thin film transistor, a second thin film transistor, and a third thin film transistor. The first light-shielding layer is positioned between the substrate and the first thin film transistor, the second light-shielding layer is positioned between the substrate and the second thin film transistor, and the third light-shielding layer is positioned between the substrate and the third thin film transistor.

Abstract: A quantum cascade laser element includes: a semiconductor substrate; a semiconductor laminate having a first end surface and a second end surface; a first electrode; a second electrode; and an anti-reflection film formed on the first end surface. The semiconductor laminate is configured to oscillate laser light having a center wavelength of 7.5 ?m or more. The anti-reflection film includes an insulating film being a CeO2 film formed on the first end surface, a first refractive index film being a YF3 film or a CeF3 film disposed on a side opposite the first end surface with respect to the insulating film, and a second refractive index film formed on the first refractive index film on a side opposite the first end surface with respect to the first refractive index film and having a refractive index of larger than 1.8.

Abstract: A laser device is provided. The laser device includes a bottom plate, a frame body, a heat sink and a light-emitting chip. The light-emitting chip is located on a surface of the heat sink away from the bottom plate. The light-emitting chip includes a plurality of first protrusions and/or a plurality of first depressions, the plurality of first protrusions and/or the plurality of first depressions are located on a first surface of the light-emitting chip; the heat sink includes a plurality of second depressions and/or a plurality of second protrusions, the plurality of second depressions and/or the plurality of second protrusions are located on a second surface of the heat sink; the plurality of first protrusions are located in the plurality of second depressions, and the plurality of second protrusions are located in the plurality of first depressions.

Abstract: A light-emitting component includes a substrate, plural light-emitting elements that are disposed on the substrate and emit light in a direction intersecting with a surface of the substrate, and a gate electrode that is electrically connected to each of the plural light-emitting elements and that performs control so that the plural light-emitting elements are switched ON/OFF together. A distance between each of the plural light-emitting elements and the gate electrode is smaller than a largest distance between two light-emitting elements among the plural light-emitting elements.

Abstract: The present disclosure relates to a flexible display device, and according to an aspect of the present disclosure, a flexible display device includes a display panel including a folding area and a non-folding area; a back plate which is disposed below the display panel and supports the display panel; and a bottom plate which is disposed below the back plate and includes a plurality of grooves so as to correspond to the folding area, and a plurality of nano helix structures disposed so as to correspond to the plurality of grooves. Therefore, the flexible display device forms a groove pattern in the bottom plate, and includes a nano helix structure in each of the plurality of grooves, to effectively relieve the folding stress and reduce the visibility of the pattern, finally an appearance quality may be improved.

Abstract: An electronic system and associated methods are disclosed. In one example, the electronic system includes a processor package including at least one processor integrated circuit (IC); an interposer including electrically conductive interposer interconnect; a first liquid metal well array including multiple liquid metal wells arranged between the processor package and the interposer, wherein the first liquid metal well array is attached to a surface of the processor package and attached to a first surface of the interposer and the interposer interconnect; a printed circuit board (PCB) attached to a second surface of the interposer and the interposer interconnect; a second liquid metal well array including a first surface attached to the first surface of the interposer and the interposer interconnect; and a first companion component package attached to a second surface of the second liquid metal well array.

Abstract: A light emitting device includes a substrate, and a first columnar structure group having first columnar structures at a light emitting section and first intermediate columnar structures, a second columnar structure group having second columnar structures at a region other than the light emitting section and second intermediate columnar structures, an inter-layer insulating layer covering the first and second columnar structure groups, a conductive layer coupled to the first columnar structure group via a contact hole provided in the inter-layer insulating layer, and a first electrode terminal electrically coupled to the conductive layer. Each of the first intermediate columnar structures includes a light propagation layer and a mask layer. Each of the second intermediate columnar structures includes an insulating layer and the mask layer. The conductive layer and the first electrode terminal partially overlap the second columnar structure group in a plan view.

Abstract: A multi-wavelength laser system includes a first fiber laser having a first cavity mirror and a first output coupler, a first optical coupler configured to receive light from the first output coupler, a second fiber laser having a second cavity mirror and a second output coupler, and a second optical coupler configured to receive light from the second output coupler. The multi-wavelength laser system also includes a spectral beam combiner configured to receive first output light from the first optical coupler, receive second output light from the second optical coupler, combine the first output light and the second output light, and form a multi-wavelength output beam.

Abstract: A transient voltage suppressor with adjustable trigger and holding voltages is provided, including a heavily doped substrate of a first conductivity type connected to a first node, a lightly doped epitaxial layer of a second conductivity type on the substrate, a first and third well region of the first conductivity type, a second well region of the second conductivity type, a first and third heavily doped region of the second conductivity type and a second heavily doped region of the first conductivity type. The heavily doped regions are commonly electrically connected to a second node, and individually disposed in the well regions. Trenches are disposed opposite in the substrate for electrical isolation. A floating base bipolar junction transistor and silicon controlled rectifier can be respectively formed under a positive and negative surged mode. Accordingly, the invention is advantageous of superior electrical performances, high layout flexibility and low area consumption.

Abstract: A display device includes: a display panel including: a substrate; a light-emitting layer on a first surface of the substrate; and wire pads on the first surface of the substrate, and adjacent to a side of the substrate; and a support member on a second surface of the substrate opposite to the first surface of the substrate. The substrate includes stepped portions protruding from the second surface in a thickness direction of the substrate, and the stepped portions overlap with the wire pads.

Abstract: An electronic device includes a substrate, a circuit layer disposed on the substrate and including a plurality of insulating layers, a plurality of conductive layers, and at least one semiconductor layer, a light emitting element layer disposed on the circuit layer and including a light emitting element, an encapsulation layer disposed on the light emitting element layer, and a sensor layer disposed on the encapsulation layer and including a plurality of sensor conductive layers. A first layer of the conductive layers, the at least one semiconductor layer, and the sensor conductive layers includes a first sensor, a second layer different from the first layer of the conductive layers, the at least one semiconductor layer, and the sensor conductive layers includes a second sensor, and the first sensor and the second sensor overlap a second area.