Patents Examined by Alexander Ocar Williams
  • Multilayer printed circuit board including first and second signal traces and a first ground trace
    Patent number: 7061094
    Abstract: A multilayer printed circuit board (PCB) includes a substrate; a ground layer having edges which define a gap portion, the ground layer being provided on a bottom face of the substrate; and at least two signal traces and provided on a top face of the substrate so as to straddle the gap portion and so as to be substantially parallel to each other. The multilayer PCB also includes at least one ground trace provided between the at least two signal traces and on the top face of the substrate so as to straddle the gap portion.
    Type: Grant
    Filed: January 18, 2005
    Date of Patent: June 13, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Eiji Takahashi, Takeshi Nakayama