Patents Examined by Alexander Oslor Williams
  • Plastic-encapsulated semiconductor device equipped with LOC package structure
    Patent number: 6054753
    Abstract: A plastic-encapsulated semiconductor device is provided, which makes it possible to reinforce the power/ground line by a bus-bar without using the over-lead bonding technique.
    Type: Grant
    Filed: December 7, 1998
    Date of Patent: April 25, 2000
    Assignee: NEC Corporation
    Inventor: Takehito Inaba