Abstract: A method for manufacturing an optical fiber splicing component includes preparing a plurality of optical fibers each including a glass fiber including a core and a cladding covering the core, and a resin coating covering the glass fiber, an end portion of the glass fiber being exposed from the resin coating, mounting the plurality of glass fibers on an optical fiber holding member so that the plurality of glass fibers exposed from the resin coating are arranged in a first direction and protrude outward from the optical fiber holding member, adjusting and fixing postures of the plurality of glass fibers around respective central axes, and collectively bonding two or more glass fibers among the plurality of glass fibers and the optical fiber holding member with an adhesive.

Abstract: A method of bonding semiconductor chips is described. The method includes the following steps. A semiconductor wafer is provided on a chuck table of a bonding apparatus. A bond head of the bonding apparatus is driven for picking up a first semiconductor chip from a support, wherein the first semiconductor chip has a first warpage amount. The bond head is driven for moving the first semiconductor chip to a position located over a first bonding region of the semiconductor wafer. A deforming process is performed using a deforming mechanism to deform the chuck table and the first bonding region of the semiconductor wafer by a first deform amount, wherein the first deform amount corresponds to the first warpage amount. The first semiconductor chip is bonded to the first bonding region of the semiconductor wafer while maintaining the first deform amount. The deforming mechanism is released from deforming the chuck table.

Abstract: A bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder disposed to face the first holder, and configured to hold the second substrate; two imaging units each including a first imaging device configured to image a first alignment mark formed on a bonding surface of the first substrate and a second imaging device configured to image a second alignment mark formed on a bonding surface of the second substrate; a first moving mechanism configured to move the two imaging units along a first direction in a planar region between the first holder and the second holder; a second moving mechanism configured to move the first imaging unit along a second direction orthogonal to the first direction; and a third moving mechanism configured to move the second imaging unit along the second direction.

Abstract: Aspects herein are directed to systems, methods, and articles for producing a patterned film and using the patterned film to form a pattern of discrete overlay film structures on a substrate material. A uniform thickness of a film material is deposited on to a first surface of a run of carrier sheets, where each carrier sheet includes one or more holes extending there through. A first carrier sheet is extracted from the run of carrier sheets, and a second surface of the carrier sheet is positioned on a substrate material. Heat and/or pressure is applied to the film material to cause the film material to transfer to the substrate material through the one or more holes in the carrier sheet forming a pattern of discrete overlay film structures on the substrate material. The carrier sheet along with remaining portions of the film material is removed from the substrate material.

Abstract: A substrate processing apparatus A1 includes: cup 1 for storing processing solution 92 to process substrate 91; stage 2 to be raised and lowered along lifting shaft 31 extending in vertical direction z in cup 1; mount 4 provided on stage 2 to mount substrate 91; and pivoting member 5 attached to mount 4 such that pivoting member 5 is pivotable about pivoting shaft 51 provided along circumferential direction ? centered at lifting shaft 31. Pivoting member 5 includes holding portion 52 located inward of pivoting shaft 51 in radial direction r, and abutting portion 53 located outward of pivoting shaft 51 in radial direction r. As stage 2 is lowered, abutting portion 53 abuts against cup 1 to cause pivoting of pivoting member 5, thereby reducing a distance between holding portion 52 and mount 4 with substrate 91 therebetween. These configurations reduce unintended effects in processing substrate 91.

Abstract: A film peeling apparatus includes a first driver connected to a frame, a second driver connected to the frame, a first gripper connected to the first driver, a second gripper connected to the second driver, and a grip support spaced apart from the first gripper and the second gripper. The grip support and the first gripper grip a release tape attached to an end of a protective film attached to a panel and extending to an outside of the panel. The grip support and the second gripper grip the end of the protective film to which the release tape is attached.

Abstract: Provided is a protective film including a first protective film configured to cover an upper surface of a display panel, the first protective film including a flat portion, inclined portions extending from the flat portion, and surrounding the flat portion in plan view, and boundary portions respectively between the inclined portions, and respectively corresponding to corners of the flat portion, wherein the inclined portions and the boundary portions become thinner in a direction away from the flat portion.

Abstract: A sheet processing device includes a rotator, a first nipper, a conveyor, a second nipper, a detector, a memory, and circuitry. The rotator winds a two-ply sheet around the rotator to generate a winding circumferential difference between two sheets of the two-ply sheet to separate the two sheets. The detector detects an abnormal condition, in which a gap greater than a given interval is not formed between the two sheets around the rotator. The memory stores a detection result as the abnormal condition. The circuitry is to increase a nipping force of the second nipper with the rotator, and increase the nipping force in a present sheet processing to be greater than a previous nipping force of the second nipper in a previous sheet processing, when the memory stores the detection of the abnormal condition in the previous sheet processing, to wind the two sheets around the rotator.

Abstract: A method and equipment for manufacturing a package structure are disclosed. The equipment includes a first space, a de-bonding apparatus, a second space and a fluid supply device. The de-bonding apparatus is disposed in the first space, and configured to perform a de-bonding process. The second space is disposed around the first space. The fluid supply device is configured to make a first humidity of an atmosphere in the first space greater than a second humidity of an atmosphere in the second space.

Abstract: Disclosed is a device for separating wafers sheet by sheet from ingot blocks having a plurality of sliced wafers bonded thereto. The wafer separation device includes a water tank configured to receive the ingot blocks and a liquid, a heating member configured to heat the liquid, a barrier rib provided in the water tank to isolate the ingot blocks from each other, an arm configured to separate the wafers sheet by sheet from the ingot blocks, and a sensor configured to sense the barrier rib.

Abstract: A tape feeder feeds a component supply tape including a cover tape adhered on a carrier tape accommodating multiple components to a predetermined supply position, and separates the cover tape from the carrier tape in front of the supply position to expose a component on the carrier tape. The tape feeder includes a pair of rotating members configured to separate the cover tape from the carrier tape by pinching and drawing the cover tape; a drum member configured to rotate and wind the cover tape drawn by the pair of rotating members; a driving motor; and a distribution mechanism configured to distribute a rotational driving force from the driving motor to one rotating member of the pair of rotating members and the drum member.

Abstract: A laminate debonding method includes producing a laminate by joining a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate which allows passage of infrared laser light, by the mediation of a first adhesive layer provided on the first substrate and a second adhesive layer provided on the second substrate, wherein the first adhesive layer is obtained by curing an adhesive (A) containing a component which is cured through hydrosilylation, and the second adhesive layer is obtained by use of an adhesive (B) formed of a polymer adhesive having an aromatic ring in at least one of a main chain and a side chain and which allows passage of infrared laser light; and irradiating the laminate with infrared laser light from a second substrate side for debonding the second substrate at the interface between the first and second adhesive layers.

Abstract: An endovascular system includes inner and outer catheters, a handle system operably coupled one end of the catheters, and a microvalve coupled to the other end of the catheters. The microvalve is constrained in a radially-collapsed closed configuration for advancement within a vessel to a treatment site. The handle system is operable to displace the inner and outer catheters portions relative to each other to move the microvalve between closed and open configurations. An indicator is provided to visually indicate the extent by which the microvalve is opened within the vessel.

Abstract: An apparatus for testing label-liner separation is provided. The apparatus comprises a roller, a plurality of replaceable printer peel bars, and a weight. Each peel bar associated with its own unique radius for its disengage edge. A label-liner web is fed under the roller and up to a given peel bar of a given radius over the corresponding disengage edge. A string is attached on one end to a liner portion of the web and the weight is attached to the other end of the string with the weight freely hanging unsupported under the liner portion. A label portion of the web is pulled over the disengage edge to determine whether the label portion separates from the liner portion of the web during the pulling. If no separation occurs a different peel bar with a different radius is selected and tried. This repeats until separation is achieved.

Abstract: The present invention provides a semiconductor chip delamination apparatus for peeling off a protective film attached to one surface of a semiconductor chip, the apparatus comprising: a stage unit (400) on which a ring frame, having the semiconductor chip to which the protective film is attached, arranged thereon is mounted; and a fluid delamination unit (1000) for discharging and spraying a delamination actuating fluid for peeling off, from the semiconductor chip, at least the protective film arranged on one surface of the semiconductor chip.

Abstract: Provided is a process for preparing a zipper pouch, wherein the process comprises: A) forming a first laminate by a process comprising i) bringing together a polyisocyanate component and a polyol component to form an adhesive composition, ii) applying a layer of the adhesive composition to a layer of polyethylene terephthalate, iii) then contacting the layer of the adhesive composition with a layer of polyethylene having thickness of 80 micrometer or more; B) contacting a polymeric zipper construction to the first laminate at temperature of 200 C or higher. Also provided is a zipper pouch made by that process.

Abstract: This invention relates to a novel of making a personal care product including the steps of providing a treatment sheet comprised of a first material and a first plurality of apertures and joining a support structure to the lower surface of the treatment sheet. The support structure includes a support material, a support sheet, a support ring, or any combination thereof. The support sheet includes a second plurality of apertures. The support sheet is disposed beneath the treatment sheet by aligning the first plurality of apertures and the second plurality of apertures. Fluid support material is solidified such that the treatment sheet and the support sheet are bonded together. The support ring is disposed on a housing (e.g., in a groove) below the support sheet or joined to the treatment sheet via the support material prior to solidifying.

Abstract: A method includes mounting a first wafer on a first wafer chuck and mounting a second wafer on a second wafer chuck. The second wafer is brought into physical contact with the first wafer. A relative distance between the first wafer and the second wafer is monitored using a distance sensor. A pressure of a vacuum zone on the second wafer chuck is controlled using feedback from the distance sensor. The bonded first wafer and second wafer are removed from the first wafer chuck.

Abstract: An eco-friendly aqueous acrylic emulsion OPP tape and a method for manufacturing the same and, more particularly, to a method for manufacturing an OPP tape using an aqueous acrylic emulsion adhesive that adopts an optimized drying process to significantly enhance the production efficiency, and an OPP tape using an aqueous acrylic emulsion adhesive that is produced by the manufacturing method and has non-toxicity, durability secured by stability, and excellent adhesiveness and retention.

Abstract: Disclosed is a manufacturing method of a composite panel, comprising: a providing step of providing a flexible sheet; an attaching step of forming a lamellar structure by attaching at least one lamellar board to cover the flexible sheet; and a cutting step of cutting a plurality of longitudinal grooves in the lamellar structure layer to form a plurality of lamellar strips, thereby obtaining the composite panel that is able to be bent laterally into a curved configuration.