Abstract: An eco-friendly aqueous acrylic emulsion OPP tape and a method for manufacturing the same and, more particularly, to a method for manufacturing an OPP tape using an aqueous acrylic emulsion adhesive that adopts an optimized drying process to significantly enhance the production efficiency, and an OPP tape using an aqueous acrylic emulsion adhesive that is produced by the manufacturing method and has non-toxicity, durability secured by stability, and excellent adhesiveness and retention.

Abstract: Disclosed is a manufacturing method of a composite panel, comprising: a providing step of providing a flexible sheet; an attaching step of forming a lamellar structure by attaching at least one lamellar board to cover the flexible sheet; and a cutting step of cutting a plurality of longitudinal grooves in the lamellar structure layer to form a plurality of lamellar strips, thereby obtaining the composite panel that is able to be bent laterally into a curved configuration.

Abstract: A process for making a puzzle includes the step of cutting puzzle pieces from a sheet of material and subsequently printing an image on the cut pieces. The resulting puzzle is far more durable than a conventional jigsaw puzzle and because of the process used to make it also benefits from the ability to replace individual pieces if lost. The puzzle is packaged intact in a packaging sleeve assembly designed to durably and aesthetically package the puzzle.

Abstract: A diamond turning station having a drum able to be rotated about an axis C and a diamond tip. A piece to be machined P is installed on the drum as follows: the piece to be machined P is offset by a distance D from the rotation axis of the drum; the piece to be machined P is placed so that there is a mean angle Theta between the axis C and a cutting profile corresponding to the active surfaces, the angle Theta being as follows: Theta=arccos (D/Ry), where Ry is a radius of curvature required in the long direction of the microstructures. Next, the diamond tip is moved along the cutting profile of the microstructures, while actuating the rotation of the drum, so as to machine all the microstructures on the surface of the piece to be machined P.

Abstract: A method and a multilayer device is described which allows the use of known and present electronic, passive electronic devices on the market or other electronic devices, making them one-piece with textiles or polymers through the use of heat-sealing materials and creating a stable innovative device. The method includes unrolling and resizing of a first layer of a textile material, positioning and gluing of an electronic device on the first layer, closing the electronic device on the first layer with a second layer of textile, thermopressing the first and second layers in which the electronic device sandwiched therebetween.

Abstract: The instant invention concerns the use of polymers obtained by radical copolymerization of a mixture of (1) acrylic acid; (2) methacrylic acid; and (3) at least one allylcatechol selected from 4-allylbenzene-1,2-diol, 3-allylbenzene-1,2-diol; methylated forms thereof (eugenols); and mixtures thereof, for treating a metallic surface intended to be adhesive-bonded to another surface, in order to impart a resistance to the adhesive failure to the resulting bonding.

Abstract: The invention provides a method for delaminating a composite by immersing the composite into a delamination solution; wherein the composite comprises a metal substrate and a coating applied on one side or both sides of the metal substrate, wherein the coating comprises a polymeric binder; and wherein the polymeric binder comprises an aqueous copolymer. The use of delamination solution comprising an alkali metal silicate salt allows for complete delamination of the composite in a highly efficient and extremely fast manner. Furthermore, the delamination method disclosed herein circumvents complex separation processes, contamination and corrosion of the metal substrate and enables an excellent materials recovery. An application of the method for delaminating an electrode for a battery is disclosed herein.

Abstract: A hot foil stamping press with a pressing table (10) on which a sheet can be advanced, a pressing system (20) for pressing a foil (14) onto the sheet, a guiding system (18) for guiding the foil (14) over the sheet, the guiding system (18) defining a foil transportation path which extends across the path along which the sheet is being advanced, a holder (11) for receiving a supply (12) of foil, and a discarding system (22) for the used foil, the holder being arranged at an operator side of the press.

Abstract: An object is to provide a composite pre-bonding treatment method that stabilizes quality of a bonded part. The present disclosure provides a composite pre-bonding treatment method performed when bonding a composite material to a member. The method includes: (S2) attaching an absorber adapted to absorb a contaminant to a surface of a prepreg laminate that is a precursor of the composite material; (S3) covering the prepreg laminate with a packaging material from above the absorber; (S4) vacuuming the packaging material and heating the prepreg laminate at a temperature lower than a curing temperature of a prepreg; (S5) then removing the packaging material; (S6) peeling off the absorber; (S7) attaching, to a surface of the prepreg laminate with the absorber peeled off, a release member that does not transfer silicone or fluorine to a resin, and then (S9) curing the prepreg laminate to mold the composite material; and (S11) peeling off the release member from the composite material before bonding the member.

Abstract: A photovoltaic module includes a first protective element, a second protective element, photovoltaic cells that are located between the first protective element and the second protective element, an envelope in which the photovoltaic cells are encapsulated. The envelope links the first protective element to the second protective element and includes a first portion that is located between the photovoltaic cells and the first protective element, and a second portion that is located between the photovoltaic cells and the second protective element. The disassembly method includes separating the photovoltaic cells with respect to the first protective element and cutting the first portion of the envelope by an abrasive wire.

Abstract: Disclosed is a method of manufacturing a reflector. The method comprises polishing (520) at least the uppermost surface of the uppermost substantially flat substrate of a plurality of substantially flat substrates, deforming (530) each substantially flat substrate into the desired shape, and bonding (540) the deformed substrates together to form said reflector. In an embodiment, the deforming and bonding is performed together using a mold.

Abstract: A bonding apparatus includes a stage on which a substrate is seated, a gantry installed above the stage, a bonding unit for bonding a chip to the substrate while moving along the gantry, a first temperature sensor installed on the bonding unit and providing a first temperature value of the bonding unit, a second temperature sensor installed at a periphery of the bonding apparatus and providing a second temperature value of an atmospheric temperature at the periphery of the bonding apparatus, and a control part causing the bonding unit to be aligned with a bonding position on the substrate, controlling the bonding unit to allow the bonding unit to bond the chip at the bonding position, and determining a movement distance of the bonding unit based on a weighted sum of the first temperature value and the second temperature value.

Abstract: A substrate processing system includes a pre-alignment apparatus having a pre-alignment stage configured to hold a processing target substrate and a detector configured to detect a center position and a crystal orientation of the processing target substrate held by the pre-alignment stage; and a laser processing apparatus having a laser processing stage configured to hold the processing target substrate and a laser processing head configured to radiate and concentrate a laser beam for processing the processing target substrate to the processing target substrate held by the laser processing stage. The pre-alignment apparatus is disposed above the laser processing apparatus.

Abstract: A laminate debonding method includes producing a laminate by joining a first substrate formed of a semiconductor-forming substrate to a second substrate formed of a support substrate which allows passage of infrared laser light, by the mediation of a first adhesive layer provided on the first substrate and a second adhesive layer provided on the second substrate, wherein the first adhesive layer is obtained by curing an adhesive (A) containing a component which is cured through hydrosilylation, and the second adhesive layer is obtained by use of an adhesive (B) formed of a polymer adhesive having an aromatic ring in at least one of a main chain and a side chain and which allows passage of infrared laser light; and irradiating the laminate with infrared laser light from a second substrate side for debonding the second substrate at the interface between the first and second adhesive layers.

Abstract: A display device includes: a display module including: a display panel including a first display surface having a first side and a second side opposite the first side, a second display surface extending from the first side at an angle with respect to the first display surface, and a third display surface extending from the second side at an angle with respect to the first display surface; and an input sensing circuit on the display panel; a first adhesive member on the first display surface, the second display surface, and the third display surface, the first adhesive member including an acrylic-based material; a second adhesive member on the first adhesive member, and including at least one of a polyurethane-based material, a polyethersulfone-based material, a polyamide-based material, or an ethylene-vinyl acetate-based material; and a window member on the second adhesive member.

Abstract: The present disclosure relates to a method for transferring a target layer to a substrate. The method includes providing a stack by forming a first transfer layer over a first substrate, forming a second transfer layer on the first transfer layer, the second transfer layer being water-soluble, and forming the target layer on the second transfer layer, such that the stack has a top surface. The method also includes bonding the top surface of the stack to a second substrate, separating the first transfer layer from the second transfer layer, and dissolving the second transfer layer in water.

Abstract: A debonding support device includes a suction plate including a support region for supporting a glass assembly, the support region including at least two suction regions applying different suction forces per unit area, the suction regions including a debonding initiation portion suction region for sucking a debonding initiation portion at which debonding of the glass assembly is to be initiated, the debonding initiation portion suction region applying the strongest of the different suction forces per unit area; a vacuum pump connected to the suction plate to provide a vacuum pressure for the suction plate, and a controller.

Abstract: A method is provided for joining a pin member of a first component to a second component with a cavity, using an adhesive, to fasten the pin in a target position extending at least partially into the cavity. A distance (D) is provided between the bottom surface of the cavity and the facing end of the pin. A flexible spacer is positioned on the bottom surface of the cavity. The thickness of the spacer equals or exceeds the distance (D) between the bottom surface of the cavity and the facing end of the pin in the target position. The adhesive is filled into the cavity onto the flexible spacer, and the pin is positioned in the target position. The adhesive is cured to obtain a joint between the pin and the second component.

Abstract: A protective film removal device has a first removal station for releasing a protective film from an optical lens first surface, a lens holder which has an imaginary central axis, at least one fluid nozzle having a nozzle exit duct, and a rotary mounting between the lens holder and the fluid nozzle(s). The rotary mounting is configured such that a relative movement about the central axis is able to be carried out by the fluid nozzle(s), wherein the nozzle exit duct of the fluid nozzle(s) is in each case oriented inwards. A lifting device between the lens holder and the fluid nozzle(s) is configured in such that a relative movement in relation to the lens holder, said relative movement being oriented along the central axis, is able to be carried out by the fluid nozzle(s). A method for releasing a protective film from a lens surface is also disclosed.

Abstract: A tape removal apparatus is configured for automatically removing a tape attached to an electrode roll in order to fix the electrode roll. The tape removal apparatus includes a sensing unit configured to sense the tape attached to the electrode roll, an injection unit configured to inject air toward the tape, a support unit configured to support a non-adhesive portion of the tape, and a gripper configured to fix the non-adhesive portion of the tape together with the support unit.