Abstract: By treating the silicon-oxide insulating layer of a semiconductor device with an aqueous metal-salt solution of a metal of an ion radius of less than 0.110 nm, for example, Sc, La or Zr, before a platinum electrode layer is provided on the insulating layer, the platinum layer shows excellent adhesive properties.
Type:
Grant
Filed:
September 8, 1994
Date of Patent:
October 19, 1999
Assignee:
U.S. Philips Corporation
Inventors:
Rudolf P. Tijburg, Karel M. Van Der Waarde