Abstract: The present invention provides flip-chip packaging for optically interactive devices such as image sensors and methods of assembly. In a first embodiment of the invention, conductive traces are formed directly on the second surface of a transparent substrate and an image sensor chip is bonded to the conductive traces. Discrete conductive elements are attached to the conductive traces and extend below a back surface of the image sensor chip. In a second embodiment, a secondary substrate having conductive traces formed thereon is secured to the transparent substrate. In a third embodiment, a backing cap having a full array of attachment pads is attached to the transparent substrate of the first embodiment or the secondary substrate of the second embodiment. In a fourth embodiment, the secondary substrate is a flex circuit having a mounting portion secured to the second surface of the transparent substrate and a backing portion bent over adjacent to the back surface of the image sensor chip.

Abstract: A semiconductor device includes a substrate, an external connection terminal, a penetrating outer moat in a doughnut form, a first interconnection, a second interconnection and a conductor. The outer moat is formed in a portion of the substrate which surrounds the external connection terminal. The first interconnection is provided on one-surface side of the substrate which is surrounded by the outer moat and electrically connected to the external connection terminal. The second interconnection is provided on one-surface side of the semiconductor chip which lies outside the outer moat and electrically connected to an internal circuit. The conductor has a bent portion and electrically connects the first and second interconnections to each other.