Abstract: Techniques for recycling waste particles may include solidifying particles, which were generated by machining a crystal ingot into a wafer or by machining a semiconductor wafer, into a cake, and melting the cake, for example, into an ingot.

Abstract: A wrench includes a main shaft having a working portion provided at the top thereof; a torsion member having an elastic restoring force against torsion about the axis of the main shaft; at least one operating handle disposed so as to intersect with the middle of the main shaft; and torque display means for displaying a torque produced in accordance with the degree of twist of the torsion member with respect to the reference point of the same. The main shaft is dividable into two divided bodies in the axial direction thereof, and the two divided bodies are connected to each other. The torsion member is interposed between the divided bodies, which are turnable relative to each other about the axis of the main shaft. With this wrench, a screw can be quickly sent to its seating position and is then fastened with up to a predetermined torque.

Abstract: A polyaxial wrench can apply torque to bolts, nuts and screws in close confines where leverage perpendicular to the axis of the bolt is restricted. The wrench has one end for mounting on the bolt, a shank and a sleeve. The shank extends longitudinally from the one end. The sleeve is rotatably mounted on the shank. The sleeve has connections for coupling an impact tool in several different angular configurations in relation to the longitudinal axis of the sleeve. Therefore, the impact tool can apply force vectors, of choice and dictated by the confines, polyaxially.

Abstract: Apparatus and methods for applying torque to a socket wrench are disclosed. The apparatus comprising a handle, a ratchet head, the handle and the ratchet head pivotally joined to one another, a ratchet mechanism having a first drive spline and a rotation control, the first drive spline extending substantially orthogonal to the longitudinal axis of the ratchet head, the first drive spline selectively rotatable with respect to the ratchet head, and the first drive spline configured to apply a first given torque to the socket wrench, and a second drive spline extending substantially parallel to the longitudinal axis of the ratchet head, the second drive spline fixedly secured to the ratchet head, and the second drive spline configured to apply a second given torque to the socket wrench.

Abstract: A wrench includes a drive member for driving a fastener, a retainer securely engaged with the drive member to move therewith, and a casing having a compartment for accommodating the retainer. The casing includes a retaining section defining a retaining space for retaining the retainer in place. When a rotational force applied to the casing is smaller than an engaging force between the retaining section of the casing and a retaining device that is attached between the retaining section and the retainer, the retainer and the rod are turned to thereby turn the fastener. When a rotational force applied to the casing is greater than the engaging force, the casing slides while the retainer and the rod are not turned. The drive member is releasably engaged with the retainer, allowing the wrench to be used with various types of drive members for driving various types of fasteners.

Abstract: A tire assembling-disassembling machine includes a supporting, locking and rotating device for a wheel-rim for a vehicle tired-wheel about the axis of rotation of the wheel, at least one bead releasing assembly provided with a fixed support structure and a pair of supports extendible-retractable in a substantially radial direction with respect to the axis of rotation starting from the fixed support structure and slidingly mounted along guide structure, at least one bead releasing roller carried at one end of a respective extendible-retractable support, driving structure for moving the arms towards and away from each other, a tool for fitting a tire onto the wheel-rim, a controller for radially extending-retracting each support and controllable locking-releasing structure for each support in an extended position thereof, and additional controllable driving structure to effect an additional extension of its respective support when locked in its extended working position by the locking-releasing structure.

Abstract: A pneumatically operated screw driver driven by a compressed air to drive screws into a workpiece. A drive bit connecting portion is rotated in a right-hand direction by rotation of a pneumatic motor and is formed with a right-handed threaded hole. A drive bit is formed at one end with a right-handed male threaded screw and at the other end with an engagement tip that engages with screws that are to be screwed into the workpiece. The drive bit is engaged with the drive bit connecting portion through threading engagement of the right-handed threaded hole and the righted-handed male threaded screw. For detaching the drive bit from the drive bit connecting portion, a rotation prevention mechanism prevents free rotation of the drive bit connecting portion. In this state, the engagement tip of the drive bit is engaged with an external tool.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a membrane formed from a compressible, flexible material, such as neoprene or silicone, and having a first portion with a thickness greater than that of a second portion. The membrane can be aligned with the microelectronic substrate to bias the microelectronic substrate against a planarizing medium such that the first portion of the membrane biases the microelectronic substrate with a greater downward force than does the second portion of the membrane. Accordingly, the membrane can compensate for effects, such as varying linear velocities across the face of the substrate that would otherwise cause the substrate to planarize in a non-uniform fashion or, alternatively, the membrane can be used to selectively planarize portions of the microelectronic substrate at varying rates.

Abstract: A method of positioning a grooved grinding wheel relative to a disc-like circular workpiece for edge grinding the workpiece using the groove in the wheel includes the steps of mounting the workpiece for rotation about a first axis, mounting the grinding wheel for rotation about a second parallel axis, effecting relative movement between the workpiece and the wheel to engage the rim of the wheel within the groove and performing a preliminary grind. The position of the wheel is axially adjusted in accordance with the measurements made on the profile of the rim produced by the preliminary grind, and the rim is ground again with a second preliminary grind with the grinding wheel located at the axially shifted position. The steps of grinding and measuring the periphery of the workpiece are repeated until the rim profile possesses the desired accuracy. The final position of the grooved grinding wheel is then utilized for grinding future wafers.

Abstract: A sharpener for blades comprises a physical structure supporting at least one abrasive surface. A displaceable guiding plate having an integral linear structural feature of the support is disposed toward one side of the abrasive surface. The linear structural feature provides sliding contact with a face of the blade to establish the relative angle of the plane of the edge facet of the blade with the plane of the abrasive surface at the point of mutual contact as the facet is guided into contact with the abrasive surface.

Abstract: Planarizing solutions, and their methods of use, for removing titanium nitride from the surface of a substrate using a fixed-abrasive planarizing pad. The planarizing solutions take the form of an etchant solution or an oxidizing solution. The etchant solutions are aqueous solutions containing an etchant and a buffer. The etchant contains one or more etching agents selective to titanium nitride. The oxidizing solutions are aqueous solutions containing an oxidizer and a buffer. The oxidizer contains one or more oxidizing agents selective to titanium nitride. In either solution, i.e., etchant or oxidizing solution, the buffer contains one or more buffering agents. Titanium nitride layers planarized in accordance with the invention may be utilized in the production of integrated circuits, and various apparatus utilizing such integrated circuits.

Abstract: A method and apparatus for diamond wire cutting of metal structures, such as nuclear reactor vessels, is provided. A diamond wire saw having a plurality of diamond beads with beveled or chamfered edges is provided for sawing into the walls of the metal structure. The diamond wire is guided by a plurality of support structures allowing for a multitude of different cuts. The diamond wire is cleaned and cooled by CO2 during the cutting process to prevent breakage of the wire and provide efficient cutting. Concrete can be provided within the metal structure to enhance cutting efficiency and reduce airborne contaminants. The invention can be remotely controlled to reduce exposure of workers to radioactivity and other hazards.

Abstract: A vise apparatus for use on a drilling machine to thread together pipe to form a drill string. The vise apparatus also for use on a drilling machine to break pipe threaded together in a drill string. The vise apparatus having scissor members that open to receive various size pipe diameters and close to contact the pipe around the pipe diameter at equally distanced locations.

Abstract: A polishing pad assembly for use in a chemical-mechanical polishing apparatus comprises a polishing pad having at least a first aperture therethrough and a platen for supporting the polishing pad having a second aperture therethrough at least a portion of which is larger than the first aperture. A substantially transparent plug includes at least a first section having a first dimension for positioning substantially within the first aperture and at least a second section having a second dimension larger than the first dimension for positioning substantially within the second aperture. The optical plug is made of a polymeric material which may be press-fit through the platen into polishing pad.

Abstract: Methods and devices are disclosed for holding an optical element in an optical column with reduced stress (e.g., thermal stress) to the optical element. The devices and methods are especially useful for holding reflective optical elements in an optical column of an optical system used for extreme ultraviolet lithography. The devices allow the elements to be mounted and detached readily from the column. In an embodiment, the device includes multiple anchoring members that attach to respective locations on the optical element. The anchoring members are, in turn, mounted in a mounting frame by a releasable attachment mechanism. Each anchoring member has at least a compliant region configured to prevent transmission of stress to and from the optical element.

Abstract: An apparatus and method is provided for polishing work pieces such as semiconductor wafers. The apparatus includes a variable number of independent heads 20, platens 32 and polishing units 18. This polishing apparatus belongs to a group of polishing machines with wafers attached to the same heads 20 through all polishing steps without undesirable reloading from one head 20 to another between polishing steps. Each independent head 20 is automatically coupled to and decoupled from any of the polishing units 18 to optimize throughput and provide flexibility in accommodating different polishing processes. A head transfer subsystem 22 provides an independent means of transfer for each head 20, thus an infinite number of contemporaneous or overlapping polishing cycles can be completed on multiple wafers resulting in maximum processing throughput.

Abstract: In accordance with certain aspects of the invention, an exemplary claim can define the steps of providing a rotating mount for the initially cast prosthesis in association with a numerically or computer controlled grinding machine. The grinding wheel is rotatably supported so that the wheel can translate vertically and axially relative to the axis of the workpiece, and can pivot in a plane generally parallel to the axis of the workpiece. In one step, the stem of the workpiece is rotated as the grinding wheel is held in position substantially perpendicular to the axis of the stem. The grinding wheel is then retracted and repositioned along the length of the stem through a series of successive positions. At each position, the grinding wheel is rotated in contact with the rotating workpiece. Once the grinding wheel is positioned at the transition region, the workpiece is preferably rotated through 180° on both sides of the transition region.

Abstract: A semiconductor wafer processing apparatus, more specifically, an edge contact loadcup for locating a semiconductor workpiece or wafer into a chemical mechanical retaining ring utilizing a cone, wafer chuck and flexure. The cone aligns the wafer concentrically to the retaining ring. The wafer chuck, inside the cone, is restrained from moving laterally in respect to the cone by the flexure. The wafer, which is supported by the wafer chuck, is moved into the retaining ring by the wafer chuck after the cone has become aligned with the retaining ring. An adjustment mechanism is provided to ensure the co-planar orientation of the wafer and fixture. Other embodiments include a sensor for detecting the presence of the wafer on the chuck, and in the cone, and minimizes particulate contamination to the wafer.

Abstract: An improved ratchet or gear wrench that has a built-in, non-slip, gripping clip mechanism for retaining a nut in the tool, which can either be applied to the nut or clamped out-of-the-way. This tool allows a nut to be tightened or loosened from a bolt or threaded stud more quickly and with one hand. To attain this, the present invention essentially comprises a spring-loaded curveshaped gripping clip, mounted near the boxed-end of a ratchet wrench, which wraps around the opening of the wrench. The spring action of the gripping clip allows it to be easily pulled away from the opening of the wrench and clamped in an out-of-the-way position by means of a clamp or released into a functional gripping position by pushing downward on the clamp's release button. When released, the gripping clip presses against a nut, thereby creating pressure that secures the nut in the opening of the wrench.

Abstract: A method and apparatus for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a membrane formed from a compressible, flexible material, such as neoprene or silicone, and having a first portion with a thickness greater than that of a second portion. The membrane can be aligned with the microelectronic substrate to bias the microelectronic substrate against a planarizing medium such that the first portion of the membrane biases the microelectronic substrate with a greater downward force than does the second portion of the membrane. Accordingly, the membrane can compensate for effects, such as varying linear velocities across the face of the substrate that would otherwise cause the substrate to planarize in a non-uniform fashion or, alternatively, the membrane can be used to selectively planarize portions of the microelectronic substrate at varying rates.