Abstract: Aspects of the present disclosure provide an intentional leak from a rear volume of an ear cup to the atmosphere. The leak is created via a vent in the driver plate acoustic assembly. The vent reduces an acoustic load the ear cup cover creates on a rear cavity of an electroacoustic transducer contained within the driver plate acoustic assembly of a headset. Additionally, the vent is hidden on an assembled ear cup of a headset. Due to the placement of the vent, ear cup cover may have a smooth, seamless surface.
Type:
Grant
Filed:
October 13, 2017
Date of Patent:
November 19, 2019
Assignee:
BOSE CORPORATION
Inventors:
Johnpaul P. Barrieau, Richard L. Pyatt, Jonathan D. Turner, Daniel P. Baker