Patents Examined by Amir H Etesam
  • Patent number: 11902734
    Abstract: The present disclosure provides an open earphone comprising: a sound producer including a transducer and a housing accommodating the transducer; and an ear hook, the ear hook including a first portion and a second portion; wherein the ear hook and the sound producer form a first projection on a first plane, the first projection including an outer contour, a first end contour, an inner contour and a second end contour, and the outer contour, the first end contour, the second end contour and a tangent segment connecting the first end contour and the second end contour jointly define a first closed curve.
    Type: Grant
    Filed: August 7, 2023
    Date of Patent: February 13, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Jiang Xu, Haofeng Zhang, Zeying Zheng
  • Patent number: 11902731
    Abstract: Disclosed is an open earphone, comprising a sound production component and an ear hook. The ear hook may include a first portion and a second portion connected in sequence. The first portion may be hung between the auricle of a user and the head of the user, the second portion may extend toward a front outer side of the auricle and connect the sound production component, and the sound production component may be located close to the ear canal but not block the opening of the ear canal; wherein the sound production component and the auricle may have a first projection and a second projection on a sagittal plane, respectively, a centroid of the first projection may have a first distance from a highest point of the second projection in a vertical axis direction, a ratio of the first distance to a height of the second projection in the vertical axis direction may be within a range of 0.25-0.
    Type: Grant
    Filed: July 9, 2023
    Date of Patent: February 13, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Peigeng Tong, Guolin Xie, Yongjian Li, Jiang Xu, Tao Zhao, Duoduo Wu, Ao Ji, Xin Qi
  • Patent number: 11889670
    Abstract: An assembly is provided which includes a package and a printed circuit board. The package includes a housing bounding a region and an acoustic sensor within the region. The housing includes a base with a first hole. The sensor is configured to generate signals indicative of sound received by the sensor through the first hole. The printed circuit board is in mechanical communication with the base and includes a second hole aligned with the first hole such that sound received by the second hole propagates through the first hole to the sensor. The printed circuit board further includes an electrically conductive layer, at least a portion of which extends across the second hole and is configured to allow the sound to propagate through the second hole and to at least partially shield the region containing the sensor from electromagnetic interference.
    Type: Grant
    Filed: April 1, 2020
    Date of Patent: January 30, 2024
    Assignee: Cochlear Limited
    Inventors: Tom Meeusen, Koen Erik Van den Heuvel, Jan Vermeiren, Stijn Eeckhoudt
  • Patent number: 11889247
    Abstract: A transcutaneous bone-anchored hearing aid device for a recipient patient is described.
    Type: Grant
    Filed: January 25, 2023
    Date of Patent: January 30, 2024
    Assignee: Oticon Medical A/S
    Inventors: Erik Holgersson, Tomas Johansson
  • Patent number: 11889253
    Abstract: Various implementations include earphone cushions and related headsets. In particular aspects, an earphone cushion includes: a body including a front surface configured to engage or surround an ear of a user, an outer side surface, an inner side surface opposing the outer side surface, and a rear surface opposing the front surface; a cover over a portion of the body, the cover including an outside radiating surface for contacting at least a portion of the user's head, wherein the cover includes a set of ports along at least one of (i) the inner side surface, (ii) the rear surface, or (iii) a junction between the inner side surface and the rear surface; and an acoustic mesh covering at least one port in the set of ports.
    Type: Grant
    Filed: January 10, 2022
    Date of Patent: January 30, 2024
    Assignee: Bose Corporation
    Inventors: Johnpaul Philias Barrieau, Masanori Honda
  • Patent number: 11882410
    Abstract: A hearing-aid device, in particular in the form of a conventional hearing aid, includes a signal processing apparatus for processing input signals and for outputting output signals. A loudspeaker unit has a loudspeaker and a conductor connection through which the loudspeaker is electrically conductively connected to the signal processing apparatus. A transmitter and reception unit has a coupling element. A coupling is formed over at least one galvanic isolation point between the coupling element and the conductor connection in such a way that at least a part of the loudspeaker unit is used as antenna structure in transmission and reception operation.
    Type: Grant
    Filed: January 12, 2022
    Date of Patent: January 23, 2024
    Assignee: Sivantos Ptd. Ltd.
    Inventor: Fenghan Lin
  • Patent number: 11877111
    Abstract: The present disclosure provides an earphone including a sound production component, an ear hook, and a microphone assembly. The microphone assembly includes a first microphone and a second microphone. The sound production component or ear hook includes a first sound hole and a second sound hole corresponding to the first microphone and second microphone, respectively. An extension line of a line connecting a projection of the first sound hole on a sagittal plane of the user and a projection of the second sound hole on the sagittal plane has an intersection point with a projection of an antihelix, a ratio of a first distance between the projection of the first sound hole on the sagittal plane and the projection of the second acoustic hole on the sagittal plane to a second distance between the projection of the second acoustic hole on the sagittal plane and the intersection point is 1.8-4.4.
    Type: Grant
    Filed: July 5, 2023
    Date of Patent: January 16, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Peigeng Tong, Guolin Xie, Yongjian Li, Jiang Xu, Tao Zhao, Duoduo Wu, Ao Ji, Xin Qi
  • Patent number: 11877114
    Abstract: A speaker securement assembly for headwear comprising a body member, a first speaker arm and a second speaker arm. One end of each of the speaker arms are inserted within the body member. The position of the speaker arms can be adjustable with respect to the body member. The non-insertion ends of the first and second speaker arms can be provided with speaker connectors, which in one embodiment can be an opening, for snugly received an associated Speaker. Preferably, two Clasps can be provided at or near the outer ends of the body member for removably securing the body member to the headwear to be worn by the user. With the body member secured to the headwear and the headwear worn by the user, the Speakers received within connectors at the ends of the speaker arm can be positioned at or near to the wearer's ears.
    Type: Grant
    Filed: May 3, 2022
    Date of Patent: January 16, 2024
    Inventor: Ben Edward Johnson
  • Patent number: 11871185
    Abstract: A retention tether for a pair of in-ear devices includes a flexible tether having at least one central fixed weight secured thereto and a plurality of slidable weights thereon. The tether includes fixed or adjustable end loops for securing in-ear devices.
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: January 9, 2024
    Assignee: Sheenah Sling LLC
    Inventor: Sheenah Hankin Wessler
  • Patent number: 11871171
    Abstract: The present disclosure relates to an open earphone. The open earphone may include a sound production device and an ear hook including a first part and a second part connected in sequence. The first part may be hooked and arranged between an auricle and a head of a user. The second part may extend to a front lateral surface of the auricle and may be connected to the sound production device. The sound production device may be worn at a position that is near an ear canal without blocking an earhole of the user. The sound production device may be at least partially inserted into an auricular concha cavity of the user. An overlap ratio of a projection area of the sound production device on a sagittal plane to a projection area of the auricular concha cavity on the sagittal plane may be not less than 44.01%.
    Type: Grant
    Filed: July 12, 2023
    Date of Patent: January 9, 2024
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Peigeng Tong, Guolin Xie, Yongjian Li, Jiang Xu, Tao Zhao, Duoduo Wu, Ao Ji, Xin Qi
  • Patent number: 11871168
    Abstract: A hearing device and related methods are disclosed. The hearing device comprises a housing comprising a wall, a microphone inlet comprising a through-going opening, a microphone arranged within the housing for receiving audio via the microphone inlet, a first filter device comprising a first filter material, the first filter device being arranged at the microphone, and a second filter device substantially having the shape of a torus or a hollow cylinder and comprising a second filter material, the second filter device being arranged at the wall, wherein the first filter device is arranged between the microphone and the second filter device, and wherein the through-going opening comprises an outer recess in an outer surface of the wall, wherein the second filter device is arranged in the outer recess.
    Type: Grant
    Filed: February 10, 2023
    Date of Patent: January 9, 2024
    Assignee: GN HEARING A/S
    Inventors: Andreas Tiefenau, Timea Denisa Merca, Anders Hjermø Michaelsen
  • Patent number: 11849287
    Abstract: A hearing system is disclosed comprising a support unit, and at least one abutment unit, wherein the support unit supports the at least one abutment unit. The at least one abutment unit has a contact surface. The support unit is configured to be placed at a user's head such that the contact surface of the at least one abutment unit contacts the user's head in an area surrounding one of the user's ears, in particular, in an area of one of the user's mastoid bones. The at least one abutment unit comprises a contact element, the contact element being configured to transmit vibrations generated by a vibration generating unit towards the contact surface. The contact element is made of a fiber-reinforced plastic material.
    Type: Grant
    Filed: February 6, 2023
    Date of Patent: December 19, 2023
    Assignee: Oticon Medical A/S
    Inventors: Morten Brandt Karlsen, Adis Bjelosevic, David Ginty, Maja Thorning-Schmidt
  • Patent number: 11838705
    Abstract: The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.
    Type: Grant
    Filed: December 2, 2021
    Date of Patent: December 5, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Zeying Zheng, Jiang Xu, Yonggen Wang, Haofeng Zhang, Gan Lai, Chong Wang, Liwei Wang, Ruixin Han, Lei Zhang, Junjiang Fu
  • Patent number: 11832046
    Abstract: Occlusion devices, earpiece devices and methods of forming occlusion devices are provided. An occlusion device is configured to occlude an ear canal. The occlusion device includes an insertion element and at least one expandable element disposed on the insertion element. The expandable element is configured to receive a medium via the insertion element and is configured to expand, responsive to the medium, to contact the ear canal. Physical parameters of the occlusion device are selected to produce a predetermined sound attenuation characteristic over a frequency band, such that sound is attenuated more in a first frequency range of the frequency band than in a second frequency range of the frequency band.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: November 28, 2023
    Assignee: Staton Techiya LLC
    Inventor: Steven W. Goldstein
  • Patent number: 11822382
    Abstract: A flat-panel display device described herein includes a display screen; a display backplate; a chassis slidably arranged on the display backplate; a fixing support, a motion module arranged on the chassis, wherein the motion module includes a first telescopic assembly and a second telescopic assembly arranged on the fixing support; a first speaker arranged on the chassis; and a second speaker connected to the second telescopic assembly. The first telescopic assembly is matched with the display backplate and configured to drive the chassis, the first speaker, the second speaker and the second telescopic assembly to move back and forth in a first direction relative to the display backplate. The second telescopic assembly is configured to drive the second speaker to move back and forth in a second direction relative to the display backplate and the first speaker.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: November 21, 2023
    Assignee: OnePlus Technology (Shenzhen) Co., Ltd.
    Inventors: Yong Zhang, Jin Hu, Xiaodong Huang, Yong Yang, Yajun Yu, Shunming Huang
  • Patent number: 11825259
    Abstract: The present disclosure relates to a speaker device including a circuit housing, an ear hook, a rear hook, and a speaker assembly. The speaker assembly may include a headphone core and a housing for accommodating the headphone core, the housing may include a housing panel facing a human body and a housing back opposite to the housing panel, and the headphone core may cause the housing panel and the housing back to vibrate. An absolute value of a difference between a first phase of a vibration of the housing panel and a second phase of a vibration of the housing back may be less than 60 degrees when a frequency of each of the vibration of the housing panel and the vibration of the housing back is between 2000 Hz and 3000 Hz.
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: November 21, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Lei Zhang, Yongjian Li, Wenbing Zhou, Jinbo Zheng, Zhuyang Jiang, Xin Qi, Fengyun Liao
  • Patent number: 11825273
    Abstract: The invention relates to a vibration module for placing on an eardrum, which vibration module has a flat sound transducer and an eardrum contact mold for contacting the eardrum.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: November 21, 2023
    Assignee: Vibrosonic GmbH
    Inventors: Tobias Fritzsche, Daniela Wildenstein
  • Patent number: 11818533
    Abstract: The embodiments of present disclosure disclose a loudspeaker. The loudspeaker may include an ear hook including a first plug end and a second plug end. The ear hook may be surrounded by a protection sleeve, and the protection sleeve may be made of an elastic waterproof material. The loudspeaker may include an earphone core housing configured to accommodate the earphone core, and the earphone core housing may be fixed to the first plug end through plugging, and may be elastically abutted against the protection sleeve elastically. The loudspeaker may include a circuit housing configured to accommodate a control circuit or a battery. The circuit housing may be fixed to the second plug end through plugging.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: November 14, 2023
    Assignee: SHENZHEN SHOKZ CO., LTD.
    Inventors: Chaowu Li, Yongjian Li
  • Patent number: 11805348
    Abstract: A damping system for an ear cup headphone design. The damping system introduces a completely enclosed inner acoustic volume in the rear volume of the ear cup by way of supporting a baffle damper spaced apart from the driver of the ear cup, wherein the density of the baffle damper diffuses acoustic wave rearwardly emanating from the driver. Additional damper masses of different relative densities may occupy the rear volume rearward of baffle damper.
    Type: Grant
    Filed: February 28, 2022
    Date of Patent: October 31, 2023
    Inventor: Zachary Arthur Mehrbach
  • Patent number: 11800274
    Abstract: An earphone with a circuit board module includes a casing, a speaker, and a circuit board module. The casing includes a back cover and has an accommodation space inside. The speaker is disposed in the accommodation space, and a first chamber is defined between the speaker and the back cover. The circuit board module is disposed in the first chamber and includes a first circuit board having a first surface, a second circuit board having a second surface, and a first flexible connector. The first surface faces and is spaced apart from the second surface of the second circuit board. The first flexible connector includes a first end connected to the first circuit board, a second end which is opposite to the first end and connected to the second circuit board, and a connection segment which connects the first and second ends and is shaped as a letter U.
    Type: Grant
    Filed: March 31, 2022
    Date of Patent: October 24, 2023
    Assignee: Merry Electronics(Shenzhen) Co., Ltd.
    Inventor: Keng-Yi Chu