Abstract: A resin composition comprising a maleimide compound, a cyanate ester compound, a silane compound having a styrene skeleton and a hydrolyzable group or a hydroxy group, and an inorganic filler.

Abstract: Low density aerospace compositions and sealants are disclosed. The low density compositions and sealants are characterized by a high volume percent loading of low density microcapsules.

Abstract: Provided is a fiber-reinforced polypropylene composition having a light weight and improved mechanical strength. A carbon fiber-containing polypropylene composition contains a predetermined amount of each of polypropylene (component 1), carbon fiber (component 2), and modified polypropylene (component 3), wherein the component 2 contains a predetermined amount of each of a C—O bond, a C?O bond, an O—C?O bond, a C—C bond, and a C—N bond.

Abstract: The resin composition of the present disclosure contains a fluorene derivative represented by the following formula (1) and a polyamide-series resin: Wherein R1 represents a substituent, k denotes an integer of 0 to 8, R2a, R2b, R2c, and R2d each represent a hydrogen atom or a substituent, R3a and R3b each represent a hydrogen atom or a substituent, and X1a and X1b each represent a group defined in the following formula (X1): wherein R4 and R5 each represent a hydrogen atom or a hydrocarbon group; or R4 and R5 bend together to form a heterocyclic ring containing the nitrogen atom adjacent to R4 and R5. The resin composition has an excellent fluidity.

Abstract: Disclosed are a thermoplastic polyamide resin composition, a method for preparing the same and a molded article produced thereby. The molded article may have improved impact strength and heat resistance, produced from the thermoplastic polyamide resin composition including a nucleating agent containing an aromatic polyamide and a heat-dissipation filler, polyamide 66 and polyamide 6, thereby improving the speed of process and realize uniform crystallization.

Abstract: Methods for producing a polyamide having an optical absorber pendent from the polyamide's backbone (OAMB-polyamide) may comprise: esterifying a hydroxyl-pendent optical absorber with a halogen-terminal aliphatic acid to yield a halogen-terminal alkyl-optical absorber; and N-alkylating a polyamide with the halogen-terminal alkyl-optical absorber to yield the OAMB-polyamide. Other methods for producing an OAMB-polyamide may comprise: esterifying a carboxyl-pendent optical absorber with a halogen-terminal aliphatic alcohol to yield a halogen-terminal alkyl-optical absorber; and N-alkylating a polyamide with the modified optical absorber to yield a polyamide having the OAMB-polyamide.

Abstract: Compositions including a thermosetting polymer network and a mechanophore covalently bonded to the thermosetting polymer network are provided. Substrates including the compositions are provided. In addition, methods of making the compositions and methods of monitoring stress on a substrate comprising the compositions are provided.

Abstract: To provide a polyamide resin composition that contains a halogen-containing flame retardant, which excels in flame retardance, well suppressed from degrading the transmittance due to darkening, and such molded article. The polyamide resin composition contains a polyamide resin, 1 to 10% by mass of a halogen-containing flame retardant, and 1 to 5% by mass of antimony oxide, the polyamide resin composition having a phosphorus atom concentration of 1.50×10?2% by mass or less.

Abstract: Aspects of the invention can be directed to a boot including a sole portion, a lower portion, and a boot shaft portion. The sole portion, the lower portion and the boot shaft portion can be formed as a unitary member composed of a single compound. The wherein the single compound can include: EVA in the range of 17% to 27%, POE in the range of 6% to 16%, SEBS in the range of 10% to 20%, and rubber in the range of 19% to 29%.

Abstract: A poly(amide-imide) copolymer including an amide structural unit having an amide bond in a polymer main chain and an imide structural unit having an imide bond in a polymer main chain, wherein at least one imide structural unit includes a moiety cross-linked to an adjacent polymer main chain through an amide bond.

Abstract: A polymer material suitable for three-dimensional printing that may include at least one of polyether block amide, thermoplastic polyurethane, and thermoplastic olefin. The polymer is formed through chemical precipitation forming a precipitated pulverulent polymer which possesses increased operating window characteristics selected from the group consisting at least one of a wider than typical range between and among the melting and recrystallization temperatures, a larger enthalpy upon melting, and a low volumetric change during recrystallization.

Abstract: Thermoplastic moulding composition consisting of (A) 51 to 69.9 wt % of polyamide elastomer; (B) 15 to 38 wt % of ethylene-?-olefin copolymer; (C) 3 to 25 wt % of polyamide selected from the group consisting of: PA6, PA66, PA6/66, PA610, PA612, PA614, PA616, PA6/610, PA66/610 or mixtures thereof; (D) 0.1 to 2.0 wt % of heat stabilizers based on copper and/or iodide, organic stabilizers or a mixture thereof; (E) 0 to 5.0 wt % of additives, different from (A) to (D); where the sum of (A) to (E) makes 100 wt % of the total moulding composition, and with the proviso that the sum of (B) and (C) is in the range from 30 to 48 wt % based on the total moulding composition.

Abstract: The polymer film according to an embodiment comprises at least one polymer resin selected from the group consisting of a polyamide-based resin, a polyimide-based resin, and a polyamide-imide-based resin, and has a haze of 0.6% or less and an in-plane retardation within a specific range for each wavelength band in the visible light region. The polymer film, which has an in-plane retardation within a specific range for each wavelength band in the visible light region, is excellent in transparency and optical properties, and it can remarkably reduce the rainbow phenomenon and improve the reflection appearance.

Abstract: The present invention relates to a polymer composition (C) comprising at least one polyamide (P1), and from 1 to 50 wt. %, based on the total weight of (C), of at least one functionalized polymer (P2), wherein P2 is a poly(aryl ether sulfone) (PAES) having at least one functional group (SO3?), (Mp+)1/p in which Mp+ is a metal cation of p valence. The present invention also relates to articles incorporating the polymer composition (C) and the use of functionalized polymer (P2) as a compatibilizer in the polymer composition (C) comprising two immiscible polymers.

Abstract: A thermoplastic acrylonitrile-butadiene-styrene copolymer/lignin blend is provided, whereas the blend comprises (i) an amount of acrylonitrile-butadiene-styrene copolymer; (ii) an amount of lignin; and (iii) an amount of compatibilizing agent capable of imparting improved ductility and impact strength to the resultant blend. Methods of improving impact strength and ductility of a thermoplastic acrylonitrile-butadiene-styrene copolymer/lignin blend and articles made therefrom are also disclosed.

Abstract: The embodiments described herein generally relate to methods and chemical compositions for coating substrates with a composition. In one embodiment, a composition is provided including a first resin, a second resin different than the first resin, and a cross-linking agent.

Abstract: A novel primer composition contains aldimine and/or epoxy resins, a process of making such primer to be used in glass bonding adhesive kit.

Abstract: A polyamide resin composition having excellent low-temperature impact resistance and surface property, a polyamide resin composition for rotational molding and a rotational molded article using the same. The polyamide resin composition includes a component (A) in an amount of a parts by weight, which is an aliphatic polyamide having a relative viscosity ?r of less than 2.6 as measured according to JIS K6920 under the conditions of 96 wt % of sulfuric acid, 1 wt % of the polymer concentration, and 25° C.; a component (B) in an amount of b parts by weight, which is a modified polyolefin having a density of 0.895 g/cm3 or less as measured according to ASTM D1505; and a component (C) in an amount of c parts by weight, which is a non-modified polyolefin having an MFR value of 3.0 to 30 g/10 min as measured in a load of 2.16 kg at 190° C., and the polyamide resin composition satisfies the following equations: 50?c/(b+c)×100?70, and 10?(b+c)/(a+b+c)×100?40.

Abstract: The disclosure generally relates to filaments and in particular, filaments for use in fused filament fabrication to prepare 3D printed articles. The filaments may be prepared from a polymer composition comprising: A) 55 to 95 weight percent semi-aromatic copolyamide having a melting point; and B) 5 to 45 weight percent amorphous copolyamide having a melting point.

Abstract: A thermoplastic molding composition is disclosed. The thermoplastic molding composition includes A) from 20 to 96.9% by weight of a thermoplastic polyamide, B) from 1 to 20% by weight of an inorganic phosphinate salt, C) from 1 to 15% by weight of an organic phosphinate salt, D) from 1 to 15% by weight of melamine cyanurate, E) from 0.1 to 10% by weight of a polyvinylpyrrolidone homopolymer, and F) from 0 to 50% by weight of other additives. The total of the percentages by weight of A) to F) is 100%.