Abstract: An electronic device includes a component carrier with a component carrier body, an electrically conductive layer, and an adhesive structure. The electronic device further includes an electronic component which is arranged within the component carrier body. The adhesive structure is formed between a surface of the electronic component and the electrically conductive layer and covers only a part of the surface of the electronic component. A remaining part of the surface of the electronic component is covered with the component carrier body.
Type:
Grant
Filed:
September 1, 2016
Date of Patent:
February 18, 2020
Assignee:
AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
Inventors:
Christian Galler, Gerhard Stubenberger, Markus Leitgeb, Wolfgang Schrittwieser