Patents Examined by Andrew E. Wessman
  • Lead-free zinc-containing solder paste
    Patent number: 6440228
    Abstract: A solder paste having a powder of a Zn-containing solder alloy such as an Sn—Zn based alloy in admixture with a soldering flux such as a rosin flux is improved by adding from 0.1% to 5.0% by weight of a glycidyl ether compound such as alkyl, alkenyl, or aryl glycidyl ether. The improved solder paste has increased resistance to aging and to concomitant deterioration in solderability caused by reaction of Zn in the solder alloy with ingredients in the flux and has a substantially extended shelf life.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: August 27, 2002
    Assignees: Senju Metal Industry Co., Ltd., Matsushita Electric Industrial Co., Ltd.
    Inventors: Toshihiko Taguchi, Kunihito Takaura, Masahiko Hirata, Hisahiko Yoshida, Takashi Nagashima