Abstract: The present invention relates to aminoarylsulfonic acid-phenol-formaldehyde condensate and concrete admixture comprising the same for incorporation in cementing compositions, for example, mortar, cement paste and the like, for improving slumping characteristics.

Abstract: In a method for manufacturing semiconductor devices, to a case main body are bonded leads each having an inner end on the inner side of a side edge of the case main body and an outer end on the outer side of the side edge. A semiconductor chip is electrically connected to the inner ends of the leads on the case main body. Subsequently, a lid is adhesively bonded to the case main body. Accordingly, it is possible to reduce the total time period required to manufacture each semiconductor device and to enhance the reliability and yield of semiconductor devices.

Abstract: The invention relates to the combination of a support and a semiconductor body and to a method of manufacturing same, in which a deformable metal layer is disposed between the semiconductor body and the support.The semiconductor body is connected to the support by pressing the semiconductor body and the support against each other under pressure after heating the metal layer. The semiconductor body is then provided at its surface facing the support with at least one projecting part, which is embedded in the metal layer.

Abstract: A method is disclosed for fabricating ohmic contacts on semiconducting diamond. A carbide forming metal is deposited over a surface of the semiconducting diamond. In some applications, one or more layers of an intermediate metal are deposited over the carbide forming metal. A corrosion resistant metal is then deposited over the intermediate metal, if present, or the carbide forming metal. The semiconducting diamond and metals are heated in an inert environment at a temperature anywhere from 350 to 1200 degrees Celsius.

Abstract: A method for assembling and interconnecting large, high-density circuits from separately fabricated components, where conventional preassembly device testing, and conventional production techniques, can be employed in an uncomplicated process. A plurality of semiconductor chips are applied connection-side down to a temporary soluble substrate and then encapsulated. The temporary soluble substrate is then dissolved, exposing the connection side of the chips, to which electrical connections can then be made.

Abstract: The invention relates to a hydraulic cement composition comprising, as a carbonation inhibitor of the cement composition, at least one compound of the formula (I):A--(Y.sub.n --H).sub.lwherein A is a polyamine residue containing 2-10 carbon atoms,Y is --C.sub.3 H.sub.6 --O--,l is a number equal to 1-8,n is a number equal to 1-4,the product of n.times.l is equal to 13-20,the active hydrogen(s) involved in the amino groups in the polyamine residue being partly or wholly substituted with the residue(s) of propylene oxide.

Abstract: Crystalline silicon carbide wherein at least 90 weight percent of the silicon carbide is formed from a plurality of hexagonal crystal lattices wherein at least 80 weight percent of the crystals formed from the lattices contain at least a portion of opposing parallel base faces separated by a distance of from 0.5 to 20 microns. The crystals may be in the form of separate particles, e.g. separate platelets, or may comprise an intergrown structure. The crystalline silicon carbide of the invention is produced by heating a porous alpha silicon carbide precursor composition comprising silicon and carbon in intimate contact to a temperature of from 2100.degree. C. to 2500.degree. C. in a non-reactive atmosphere. The materials are high performance materials finding use in reinforcing, high temperature thermal insulating, improvement of thermal shock resistance, and modification of electrical properties.

Abstract: A method of manufacturing a semiconductor device having a package structure including a lead base and a cap includes the steps of fixing a semiconductor chip to a lead base, and placing a fixation pellet in a cap, the fixation pellet being made of a material which melts and is subsequently hardened by a rise in temperature. The lead base carrying the semiconductor chip upside-down on the fixation pellet is placed in the cap. The fixation pellet between the cap and the lead base carrying the semiconductor chip is then heated to melt the fication pellet and subsequently harden the melted fixation pellet. Thus, the lead base carrying the semiconductor chip is fixed to the cap to form a package structure.

Abstract: A solution containing polymerizable monomers and volatile solvents can be used to disperse ceramic particles along with ceramic whiskers and remain pourable even with high solids. Using this dispersion, a high solids ceramic article can be molded, polymerized in situ and fired with a good binder burnout.

Abstract: The invention relates to a thixotropic self-curing refractory material based on zirconium silicate, and a process and an apparatus for lining metallurgical vessels, in particluar ladles in steel plants, with this material which is compacted by means of a vibration method.

Abstract: The present invention relates to a bioactive composition having a controlled, sustained release delivery pattern when contacted with a suitable surrounding media. The composition comprises a pharmaceutically, insecticidally, herbicidally or fertilizing bioactive material core, soluble in a given surrounding media, the core present in an amount at least sufficient for a total dosage during a specified treatment period; a first coating enveloping the bioactive material core comprising a polymer or a blend of polymers, said polymer or blend of polymers being swellable upon penetration by the surrounding media; and a second coating enveloping the first coating, the second coating comprising a polymer or a blend of polymers being water-insoluble and forming a semi-permeable barrier to the inward diffusion of the surrounding media and the outward diffusion of the bioactive material dissolved in the surrounding media.