Abstract: In a method of fabricating semiconductor integrated circuits, the effects of mobile ion contamination in a dielectric layer which has been subjected to a source of mobile ion contamination, e.g., reactive ion etching, is substantially eliminated by removing substantially only the topmost portion of the dielectric layer, e.g., 10-15 nm of an 800 nm layer, promptly after performing the step which produced the source of contamination.
Type:
Grant
Filed:
February 23, 1990
Date of Patent:
December 25, 1990
Assignee:
AT&T Bell Laboratories
Inventors:
Alain S. Harrus, Graham W. Hills, Cris W. Lawrence, Morgan J. Thoma
Abstract: Disclosed is a rust preventive composition for steel reinforcements for concrete, which comprises 100 parts by weight of Portland cement, 0.3 to 3 parts of a hydroxycarboxylic acid, 0.3 to 3 parts of a saccharide, 2 to 10 parts as a solid content of a polymer latex, 0 to 5 parts of an optional additive and 30 to 45 parts of water, all parts being by weight. In this composition, an excellent synergistic effect is attained by the combined use of the hydroxycarboxylic acid and saccharide. That is, hydration is almost completely suppressed in this composition under ordinary rust preventing treatment conditions, but hydration is effectively promoted under high-temperature high-pressure hydrothermal curing conditions. Gluconic acid and sorbitol are especially preferred as the hydroxycarboxylic acid and saccharide, respectively.