Abstract: A fiber alignment device is provided that includes a curable refractive index-matching gel that exhibits self-cleaning and self-healing characteristics upon multiple cycles of insertion and removal of an optical fiber.

Abstract: A new fiber optic connector provides a smaller form factor by including two ferrule assemblies in a housing. The housing accepts a push-pull mechanism that allows for insertion and removal from a carrier as well as an adapter. The push-pull mechanism may also include a flexure member to return the push-pull mechanism. Polarity of the fiber optic connector may also be selected by use of the push-pull mechanism.

Abstract: One example system comprises a substrate and a waveguide disposed on the substrate to define an optical path on the substrate. The waveguide is configured to guide, inside the waveguide and along the optical path, a light signal toward an edge of the waveguide. The edge defines an optical interface between the waveguide and a fluidic optical medium adjacent to the edge of the waveguide. The system also includes an optical fluid and a fluid actuator configured to adjust a physical state of the optical fluid based on a control signal. The adjustment of the physical state of the optical fluid causes an adjustment of the fluidic optical medium adjacent to the edge.

Abstract: Structures for a photodetector or terminator and methods of fabricating a structure for a photodetector or terminator. The structure includes a waveguide core, a light-absorbing layer having a sidewall, and a taper positioned adjacent to the sidewall of the light-absorbing layer. The taper extends laterally from the sidewall of the light-absorbing layer to overlap with the waveguide core, and the taper has a thickness that varies with position relative to the sidewall of the light-absorbing layer. For example, the thickness of the taper may decrease with increasing distance from the sidewall of the light-absorbing layer.

Abstract: A chip-scale transceiver includes an interposer having microspring electrical contacts disposed on the interposer substrate. At least one electronic chip and at least one optoelectronic chip are electrically coupled to the interposer through the microsprings. The electronic chip includes at least one of an amplifier array and a laser driver array. First electrical contact pads arranged to make electrical contact with the first microsprings of the interposer. The optoelectronic chip includes at least one of a laser array and a photodetector array. Second electrical contact pads arranged to make electrical contact with the second microsprings of the interposer are disposed on the optoelectronic chip substrate. The transceiver has an area less than or equal to 0.17 mm2 per Gbps.

Abstract: A strip stop mechanism for a fiber stripping machine including a channel for receiving an optical fiber. The strip stop mechanism can include a lever operably mounted to the fiber stripping machine, the lever extending between a first end and a second end and being rotatable between a first position and a second position. When the lever is in the first position, the first end of the lever resides within the channel to provide an end stop for the optical fiber. When the lever is in the second position, the first end of the lever is at least partially withdrawn from the channel and the fiber stripping machine is activated. A second end of the lever can be configured to depress an activation button of the fiber stripping machine once the first end of the lever is at least partially removed from the channel.

Abstract: A semiconductor device including a singulated structure and an optical fiber assembly is provided. The singulated structure includes a photonic die, an electronic die connected to the photonic die and an optical element over the photonic die. The optical fiber assembly is disposed on a top of the singulated structure and includes a holder and an optical fiber structure. The holder keeps an air gap from the optical element. The optical fiber structure is carried by the holder and configured to be optically communicated with the photonic die through the optical element.

Abstract: A new fiber optic connector provides a smaller form factor by including two ferrule assemblies in a housing. The housing accepts a push-pull mechanism that allows for insertion and removal from a carrier as well as an adapter. The push-pull mechanism may also include a flexure member to return the push-pull mechanism. Polarity of the fiber optic connector may also be selected by use of the push-pull mechanism.

Abstract: An optical waveguide device includes a substrate on which an optical waveguide is formed, and an object that is disposed on the substrate. The optical waveguide includes a mode conversion/branching portion that converts a mode of a light wave propagating through the optical waveguide and branches the light wave, and the object is disposed to cover a part or the whole of the mode conversion/branching portion or not to cover the mode conversion/branching portion when the substrate is viewed in a plan view. In a case where the object is disposed to cover a part of the mode conversion/branching portion, the object is disposed not to consecutively cover a section over a length of a predetermined value or higher in an advancing direction of a light wave.

Abstract: A waveguide structure and a method for splitting light is described. The method may include optically coupling a first waveguide and a second waveguide, where the optical coupling may be wavelength insensitive. The widths of the first and second waveguides may be non-adiabatically varying and the optical coupling may be asymmetric between the first and second waveguides. A gap between the first and second waveguides may also be varied non-adiabatically and the gap may depend on the widths of the first and second waveguides. The optical coupling between the first and second waveguides may also occur in the approximate wavelength range of 800 nanometers to 1700 nanometers.

Abstract: Techniques disclosed herein relate to devices that each include one or more photonic integrated circuits and/or one or more electronic integrated circuits. In one embodiment, a device includes a silicon substrate, a die stack bonded (e.g., fusion-bonded) on the silicon substrate, and a printed circuit board (PCB) bonded on the silicon substrate, where the PCB is electrically coupled to the die stack. The die stack includes a photonic integrated circuit (PIC) that includes a photonic integrated circuit, and an electronic integrated circuit (EIC) die that includes an electronic integrated circuit, where the EIC die and the PIC die are bonded face-to-face (e.g., by fusion bonding or hybrid bonding) such that the photonic integrated circuit and the electronic integrated circuit face each other. In some embodiments, the device also includes a plurality of optical fibers coupled to the photonic integrated circuit.

Abstract: Techniques disclosed herein relate to devices that each include one or more photonic integrated circuits and/or one or more electronic integrated circuits. In one embodiment, a device includes a silicon substrate, a die stack bonded (e.g., fusion-bonded) on the silicon substrate, and a printed circuit board (PCB) bonded on the silicon substrate, where the PCB is electrically coupled to the die stack. The die stack includes a photonic integrated circuit (PIC) that includes a photonic integrated circuit, and an electronic integrated circuit (EIC) die that includes an electronic integrated circuit, where the EIC die and the PIC die are bonded face-to-face (e.g., by fusion bonding or hybrid bonding) such that the photonic integrated circuit and the electronic integrated circuit face each other. In some embodiments, the device also includes a plurality of optical fibers coupled to the photonic integrated circuit.

Abstract: A semiconductor device includes a photonic die and an optical die. The photonic die includes a grating coupler and an optical device. The optical device is connected to the grating coupler to receive radiation of predetermined wavelength incident on the grating coupler. The optical die is disposed over the photonic die and includes a substrate with optical nanostructures. Positions and shapes of the optical nanostructures are such to perform an optical transformation on the incident radiation of predetermined wavelength when the incident radiation passes through an area of the substrate where the optical nanostructures are located. The optical nanostructures overlie the grating coupler so that the incident radiation of predetermined wavelength crosses the optical die where the optical nanostructures are located before reaching the grating coupler.

Abstract: An undersea fiber optic cable routing architecture including a branching unit coupled to three trunk cables capable of switching individual fibers in each fiber pair within a cable to either of the other two cables. The branching unit comprises a plurality of optical switches and a controller for receiving remote command signals and configuring the optical switches in accordance with the remote command signals.

Abstract: A method of fabricating a multi-element fiber scanner includes providing a fiber optic cable having a cladding region and a fiber core and focusing a laser beam at a series of predetermined locations inside the cladding region of the fiber optic cable. The method also includes creating a plurality of damage sites at the predetermined locations, exposing the fiber optic cable to an etchant solution, and preferentially etching the plurality of damage sites to form a base having a base plane and a longitudinal axis orthogonal to the base plane, a retention collar disposed a predetermined distance along the longitudinal axis from the base, a first fiber link including the fiber core, passing through the base plane, and joined to the retention collar, and a plurality of additional links joined to the base, extending from the base to the retention collar, and joined to the retention collar.

Abstract: Optical fiber stub having a first end and a second end, and a base on an outer surface of the stub body. A receptacle cap having a tubular body with a locking end and a receiving end, wherein an inner surface of the locking end includes an inner rim for receiving and securing a clip therein. A polymer insulating insert having a first plurality of clips on a first side and a second plurality of clips on the second side, wherein the first plurality of clips are configured to clip onto and secure the polymer insulating insert to the base of the stub body, and the second plurality of clips are configured to clip onto and secure the polymer insulating insert to the inner rim within the locking end of the receptacle cap.

Abstract: An optical fiber heat exchanger includes an outer body and an inner body inserted into the outer body. The inner body includes a plurality of guide walls to guide a cooling liquid through the optical fiber heat exchanger to exchange heat from an optical fiber inserted in the optical fiber heat exchanger, a first set of parallel straight channels, extending along an inlet portion of the inner body, formed by a first subset of the plurality of guide walls, a set of U-shaped channels, extending through a transition section of the inner body, formed by a second subset of the plurality of guide walls, and a second set of parallel straight channels, extending along an outlet portion of the inner body, formed by a third subset of the plurality of guide walls.

Abstract: The present disclosure provides an optical circulator. The optical circulator includes a first integrated module, a second integrated module and a third integrated module which are sequentially connected from front to rear. The first integrated module includes a mating shell, an optical fiber ferrule received in the mating shell and a first birefringence crystal attached to a rear surface of the optical fiber ferrule; the second integrated module comprises a first tube fixed behind the mating shell, a magnetic ring received in the first tube, a Wollaston prism fixed in the magnetic ring, two Faraday rotators respectively provided to both sides of the Wollaston prism, and two collimating lenses respectively provided to both sides of the two Faraday rotators. The third integrated module includes a second tube fixed behind the first tube, a dual fiber pigtail received in the second tube, and a second birefringence crystal attached to a front surface of the dual fiber pigtail.

Abstract: Cladding removed from a portion of the optical fiber defines a window exposing the fiber core. A grating having a substantially periodic structure defining a wavelength is moveably positioned in the window, where it can interact with the evanescent field present in the window when optical power is propagating through the fiber. An adjustable positioning fixture holds the grating proximate to the window and operates to change the relative spacing of the fiber core and grating, between: a first position in which the grating is held proximate to the fiber core and substantially interacts with the evanescent field, and a second position in which the grating is held apart from the fiber core and does not substantially interact with the evanescent field.

Abstract: A system and method for providing a radiation source. In one arrangement, the radiation source includes an optical fiber that is hollow, and has an axial direction, a gas that fills the hollow of the optical fiber, and a plurality of temperature setting devices disposed at respective positions along the axial direction of the optical fiber, wherein the temperature setting devices are configured to control the temperature of the gas to locally control the density of the gas.