Patents Examined by Andrew Preston Traywick
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Patent number: 12147153Abstract: An X-ray-sensitive film includes an acid-hydrolyzed palm mesocarp, a starch, a cellulose, a synthetic polymer, a plant hydrogel, a cyanoacrylate adhesive, glycerin, and an x-ray-sensitive dye. A method of preparing the X-ray-sensitive film includes 32.5 to 45 wt % cellulose based on a total weight of the X-ray-sensitive film, a tensile modulus of 0.75 to 2.5 GPa, a tensile strength of 75 to 125 MPa/kg·m3, a water absorption of 0.00 to 0.16% measured according to ASTM D570, a carbonate content of 100 to 200 ppm, and shows no cracks when tested according to ASTM D5419.Type: GrantFiled: June 24, 2024Date of Patent: November 19, 2024Assignee: IMAM MOHAMMAD IBN SAUD ISLAMIC UNIVERSITYInventors: ABM Sharif Hossain, Mohammed Saad Aleissa, Hassan Ahmed Rudayni, Salem Ali S. Alyami, Mohammed Musa Zahrany, Nasir A. Ibrahim
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Patent number: 12135503Abstract: Organometallic photoresists suitable for use in deep ultraviolet (DUV) or extreme ultraviolet (EUV) lithography are provided. The organometallic photoresists contain an organometallic molecule having least a metal element M selected from the group consisting of Bi, Sb, and mixtures thereof, and having an oxidation state of 3+, and at least one polymerizable group R. A method of forming a patterned materials feature on a substrate utilizing the organometallic photoresist compositions is also provided.Type: GrantFiled: April 1, 2021Date of Patent: November 5, 2024Assignee: International Business Machines CorporationInventors: Gerhard Ingmar Meijer, Valery Weber, Peter Willem Jan Staar
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Patent number: 12111573Abstract: A resist composition containing a polymeric compound having a constitutional unit (a01) derived from a compound represented by General Formula (a0-1).Type: GrantFiled: December 14, 2021Date of Patent: October 8, 2024Assignee: TOKYO OHKA KOGYO CO., LTD.Inventor: Takuya Ikeda
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Patent number: 12111574Abstract: A resist composition containing a polymeric compound having a constitutional unit (a01) derived from a compound represented by General Formula (a0-1).Type: GrantFiled: December 9, 2021Date of Patent: October 8, 2024Assignee: TOKYO OHKA KOGYO CO., LTD.Inventor: Takuya Ikeda
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Patent number: 12105420Abstract: The present invention provides a coating-type composition for forming an organic film containing: a polymer having a structure shown by the following general formula (1) as a partial structure; and an organic solvent, where in the formula (1), ring structures Ar1 and Ar2 represent a benzene ring or a naphthalene ring optionally having a substituent, and W1 represents an aryl group having 6 to 30 carbon atoms and optionally having a substituent. This provides a coating-type composition for forming an organic film that can form an organic film having high pattern-curving resistance and high dry-etching resistance, the composition being excellent in solvent solubility and having a low generation of defects.Type: GrantFiled: February 24, 2021Date of Patent: October 1, 2024Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Keisuke Niida, Daisuke Kori, Yasuyuki Yamamoto, Takayoshi Nakahara, Tsutomu Ogihara
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Patent number: 12099291Abstract: An X-ray-sensitive film includes an acid-hydrolyzed palm mesocarp, a starch, a cellulose, a synthetic polymer, a plant hydrogel, a cyanoacrylate adhesive, glycerin, and an x-ray-sensitive dye. A method of preparing the X-ray-sensitive film includes 32.5 to 45 wt % cellulose based on a total weight of the X-ray-sensitive film, a tensile modulus of 0.75 to 2.5 GPa, a tensile strength of 75 to 125 MPa/kg·m3, a water absorption of 0.00 to 0.16% measured according to ASTM D570, a carbonate content of 100 to 200 ppm, and shows no cracks when tested according to ASTM D5419.Type: GrantFiled: April 18, 2024Date of Patent: September 24, 2024Assignee: IMAM MOHAMMAD IBN SAUD ISLAMIC UNIVERSITYInventors: ABM Sharif Hossain, Mohammed Saad Aleissa, Hassan Ahmed Rudayni, Salem Ali S. Alyami, Mohammed Musa Zahrany, Nasir A. Ibrahim
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Patent number: 12099297Abstract: An energy-sensitive composition including a polysilane, a base generator, and a solvent, the base generator including a compound represented by formula (b1) and a photo base generator: in which Rb1 to Rb3 each independently represents a hydrogen atom, halogen atom, hydroxyl group, mercapto group, sulfide group, silyl group, silanol group, nitro group, nitroso group, sulfonato group, phosphino group, phosphinyl group, phosphonato group or organic group; Rb4 and Rb5 each independently represent a hydrogen atom, halogen atom, hydroxyl group, mercapto group, sulfide group, silyl group, silanol group, nitro group, nitroso group, sulfino group, sulfo group, sulfonato group, phosphino group, phosphinyl group, phosphono group, phosphonato group or aliphatic group; and Rb6 represents a hydrogen atom, alkyl group or alkoxy group.Type: GrantFiled: October 26, 2021Date of Patent: September 24, 2024Assignees: TOKYO OHKA KOGYO CO., LTD., Tokyo University of Science FoundationInventors: Kunihiro Noda, Dai Shiota, Koji Arimitsu
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Patent number: 12094719Abstract: The present disclosure relates to a method of forming an etching pattern in a semiconductor manufacturing process. Unlike a conventional method of forming a four-layer structure composed of a photoresist film, an anti-reflective film, a SiON film, and an organic hard mask film on a wafer, as preparation for an etching process, the method according to the present disclosure is an innovative etching pattern forming method capable of implementing the same etching pattern as is formed by the conventional method, using a double-layer structure composed of a photoresist film and a multifunctional organic-inorganic mask film.Type: GrantFiled: March 6, 2020Date of Patent: September 17, 2024Assignee: YOUNG CHANG CHEMICAL CO., LTDInventors: Su Jin Lee, Gi Hong Kim, Seung Hun Lee, Seung Hyun Lee
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Patent number: 12072626Abstract: In the context of forming radiation patternable structures especially for EUV patterning, wafer structures are described comprising a substrate having a smooth top surface and a radiation sensitive organometallic coating having an average thickness of no more than 100 nm and no more than about 1 defect per square centimeter with a defect size of greater than 48 nm, evaluated with a 3 mm edge exclusion. Corresponding methods for forming a low defect coating comprise spin coating a purified radiation sensitive organometallic resist solution onto a wafer using a spin coater system comprising a delivery line and a delivery nozzle connected to the delivery line to form a coated wafer, and drying the coated wafer to form a radiation sensitive organometallic coating having no more than about 1 defect per square centimeter with a defect size of greater than 48 nm, evaluated with a 3 mm edge exclusion.Type: GrantFiled: February 19, 2021Date of Patent: August 27, 2024Assignee: Inpria CorporationInventors: Benjamin L. Clark, Gaetano Giordano, Shu-Hao L. Chang, Dominick Smiddy, Mark Geniza, Craig M. Gates, Jan Doise, Peter de Schepper
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Patent number: 12032291Abstract: As described herein, photosensitive composition comprises RSnL3, where R is a hydrocarbyl ligand with 1-20 carbon atoms and one or more silicon and/or germanium heteroatoms and L is an acetylide ligand (—C?CA, where A is a silyl group with 0 to 6 carbon atoms or an organo group with 1 to 10 carbon atoms). Methods are described wherein photosensitive compositions are synthesized by reacting RX, where X is a halide, and MSnL3, where M is an alkali metal, alkali earth metal or a pseudo-alkali earth metal, L is an acetylide or a dialkylamide. The radiation sensitive compositions are effective for radiation based patterning, such as with EUV light.Type: GrantFiled: February 28, 2022Date of Patent: July 9, 2024Assignee: Inpria CorporationInventors: Robert E. Jilek, Kai Jiang, Amrit K. Narasimhan
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Patent number: 12032293Abstract: A composition for forming an organic film contains a polymer having a partial structure shown by the following general formula (1A), and an organic solvent. The polymer is crosslinked by dehydrogenative coupling reaction involving hydrogen atoms located at the trityl position on the fluorene ring in each partial structure.Type: GrantFiled: April 7, 2020Date of Patent: July 9, 2024Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Daisuke Kori, Takayoshi Nakahara, Yasuyuki Yamamoto, Hironori Satoh, Tsutomu Ogihara
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Patent number: 12013635Abstract: A semiconductor photoresist composition and a method of forming patterns utilizing the same are provided. The semiconductor photoresist composition includes a condensed product produced by a condensation reaction between an organotin compound represented by Chemical Formula 1 and at least one organic acid compound selected from a substituted organic acid, an organic acid including at least two acid functional groups, and a substituted or unsubstituted sulfonic acid; and a solvent. Specific details of Chemical Formula 1 are as defined in the specification.Type: GrantFiled: November 10, 2021Date of Patent: June 18, 2024Assignee: Samsung SDI Co., Ltd.Inventors: Kyungsoo Moon, Eunmi Kang, Jaehyun Kim, Jimin Kim, Changsoo Woo, Hwansung Cheon, Seungyong Chae, Seung Han
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Patent number: 11988963Abstract: Disclosed and claimed herein are photoimageable dielectric compositions for dielectric passivation layers, dielectric protection layers as well as dielectric redistribution layers for use in the manufacture of semiconductors, semiconductor packages and circuit board constructions. More specifically it relates to photoimageable polymers containing vinyl groups capable of being crosslinked during processing and post cured at lower temperatures and shorter times than conventional dielectric materials. The processed compositions are characterized by low dielectric constants and low dissipation factors as well as low moisture uptake, chemical and thermal stability, flexibility and excellent HAST (Highly Accelerated Stress Test) and TCT (Thermal Cycling Test) results. The invention also relates to low dk/df dielectric compositions that are not photoimageable.Type: GrantFiled: November 9, 2020Date of Patent: May 21, 2024Inventors: Daniel J Nawrocki, Yasumasa Akatsuka, Katie Han
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Patent number: 11988964Abstract: Provided is a positive resist composition for EUV lithography that can form a resist film having high sensitivity to extreme ultraviolet light. The positive resist composition contains a solvent and a copolymer that includes a monomer unit (A) represented by general formula (I) and a monomer unit (B) represented by general formula (II). In the formulae, R1 indicates an organic group including 5 or more fluorine atoms, le indicates a hydrogen atom, a fluorine atom, an unsubstituted alkyl group, or a fluorine atom-substituted alkyl group, R3 indicates a hydrogen atom, an unsubstituted alkyl group, or a fluorine atom-substituted alkyl group, p and q are each an integer of 0 to 5, and p+q=5.Type: GrantFiled: April 17, 2019Date of Patent: May 21, 2024Assignee: ZEON CORPORATIONInventor: Manabu Hoshino
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Patent number: 11982940Abstract: Disclosed are a photoacid generator, a photoresist composition including the same, and a method of preparing the photoacid generator. The photoacid generator may include a compound represented by Formula 1: wherein, in Formula 1, CY, A1, A2, and B are respectively described in the specification.Type: GrantFiled: May 8, 2023Date of Patent: May 14, 2024Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Eunkyung Lee, Sumin Kim, Hyunwoo Kim, Juhyeon Park, Giyoung Song, Sukkoo Hong, Yoonhyun Kwak, Youngmin Nam, Byunghee Sohn, Sunyoung Lee, Aram Jeon, Sungwon Choi
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Patent number: 11965101Abstract: A three-dimensional dye, a manufacturing method of the three-dimensional dye, and a photoresist mixture are disclosed. A non-planar three-dimensional dye molecular structure is constructed by adding a three-dimensional structure group into a dye molecule, thereby breaking the strong attraction force between the planar conjugation of the dye molecule. Aggregation of dye molecules are prevented, influence of dye molecules on optical paths is eliminated, and thus optical properties and color rendering properties of color filters made by a photoresist liquid are improved.Type: GrantFiled: September 3, 2020Date of Patent: April 23, 2024Assignee: TCL China Star Optoelectronics Technology Co., Ltd.Inventors: Lin Ai, Hong Meng
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Patent number: 11892773Abstract: A photosensitive resin composition, a patterning process performed using the photosensitive resin composition, a cured film formed by curing the pattern, and an electronic component having the cured film. The photosensitive resin composition includes a resin, a photosensitizer, a surfactant containing a structural unit represented by formula (1), and a solvent, where Y1 and Y2 each independently represent a hydrogen atom, a methyl group, a phenyl group, or a group represented by formula (2), at least one of Y1 and Y2 is a group represented by formula (2), R1 to R6 are monovalent hydrocarbon groups that may be the same or different and optionally contain a heteroatom, having 1 to 20 carbon atoms, “1” and “n” are each independently integers of 1 to 100, and “m” is an integer of 0 to 100.Type: GrantFiled: September 8, 2021Date of Patent: February 6, 2024Assignee: SHIN-ETSU CHEMICAL CO., LTD.Inventors: Hiroyuki Urano, Masashi Iio, Katsuya Takemura
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Patent number: 11886117Abstract: An adhesion promoter as shown in Formula (I) and a photosensitive resin composition containing the adhesion promoter are disclosed: where R1, R2 and R3 each refer to a hydrogen atom, an optionally substituted C1-C20 alkyl, an optionally substituted C2-C20 alkenyl, an optionally substituted C2-C20 alkynyl, an optionally substituted phenyl, or other optionally substituted carbon atom; A refers to an optionally substituted C1-C20 alkyl, an optionally substituted C2-C20 alkenyl, an optionally substituted C2-C20 alkynyl, an optionally substituted phenyl, or other an optionally substituted carbon atom substituents; and the carbon in the alkyl, the alkenyl, the alkynyl, the phenyl, or the carbon atom substituents is optionally substituted with one or more of N, O and S; and X refers to an optionally substituted aromatic heterocyclic group. The adhesion promoter and the photosensitive resin composition can be used for manufacturing a semiconductor integrated circuit (IC), a LED and a flat-panel display.Type: GrantFiled: July 2, 2019Date of Patent: January 30, 2024Assignee: SHANDONG SHENGQUAN NEW MATERIALS CO LTD.Inventors: Diyuan Tang, Zhifang Li, Ke Bai, Bin Liu, Chuanming Sun
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Patent number: 11860536Abstract: The inventive concept relates to a three-dimensional crosslinker composition and a method of manufacturing an electronic device using the same. According to the inventive concept, the three-dimensional crosslinker composition may be represented by Formula 1 below.Type: GrantFiled: May 13, 2021Date of Patent: January 2, 2024Assignee: UNIST (ULSAN NATIONAL INSTITUTE OF SCIENCE AND TECHNOLOGY)Inventors: BongSoo Kim, Myeong Jae Lee
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Patent number: 11840503Abstract: A salt represented by formula (I), a generator and a resist composition: wherein R1 and R2 each independently represent an iodine atom, a fluorine atom or an alkyl fluoride group having 1 to 6 carbon atoms; R4, R5, R7 and R8 each independently represent a halogen atom, a hydroxy group, a haloalkyl group having 1 to 12 carbon atoms or an alkyl group having 1 to 12 carbon atoms, —CH2— included in the haloalkyl group and the alkyl group may be replaced by —O—, —CO—, —S— or —SO2—; X1 and X2 each independently represent an oxygen atom or a sulfur atom; m1 represents 1 to 5, m2 and m8 represent 0 to 5, and m4, m5 and m7 represent an integer of 0 to 4, in which 1?m1+m7?5, 0?m2+m8?5; and AI? represents an organic anion.Type: GrantFiled: May 3, 2021Date of Patent: December 12, 2023Assignee: SUMITOMO CHEMICAL COMPANY, LIMITEDInventors: Katsuhiro Komuro, Koji Ichikawa