Patents Examined by Andrez Munoz
  • Method of reducing residual contamination in singulated semiconductor die
    Patent number: 9472458
    Abstract: In one embodiment, semiconductor die are singulated from a semiconductor wafer by placing the semiconductor wafer onto a carrier tape, forming singulation lines through the semiconductor wafer, and reducing the presence of residual contaminates on the semiconductor wafer.
    Type: Grant
    Filed: February 3, 2015
    Date of Patent: October 18, 2016
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Jason Michael Doub, Gordon M. Grivna