Abstract: A crop harvesting machine has a machine body and a discharge spout attached to the machine body for overloading crop via a crop stream to a trailer. And electronic spout control and a discharge spout drive arrangement displaces the discharge spout relative to the machine body based on drive commands of the electronic spout control for guiding the crop stream to a target hit point at the trailer. A first sensor arrangement generates sensor information by optically identifying a reference feature at the trailer and detecting the position of the reference feature and/or space orientation of the reference feature. The second sensor arrangement generates sensor information by detecting a space orientation of the machine body, the discharge spout or both. The electronic spout control generates its drive commands for guiding the crop stream based on the sensor information.

Abstract: A method and apparatus of embedding separated elements in a molded member wherein at least one side of the separated elements is covered by the molded member. The separated elements are interconnected by links to form a unitary member, which is disposed in a mold cavity formed by first and second mold plates. A support pin positioned on a first side of the unitary member supports the unitary member while a punch pin is extended toward a second side of the unitary member and through the link interconnecting the elements so as to sever the link. At least one of the punch pins or the support pins is retracted away from at least one side of the separated elements before injecting a molten material into the cavity so as to form the molded member.

Abstract: A leadframe loading frame with self-straightening alignment pins. A leadframe loading frame is provided with leadframe alignment pins that are made of a shape memory alloy. The pins are also superelastic. The use of the pins results in elimination of the bent alignment pin package defects that occurred when using the leadframe loading frames of the prior art. Other devices, systems and methods are also described.

Abstract: A method for manufacturing a hollow structure suitable for example as reservoir for pressurized fluids, which structure is obtained by curving over a part of its length a corrugated tube provided circumferentially in the hollow of its waves with a hardenable fiber reinforced composition, then subjecting the tube thus curved over at least a part of its length to a treatment for hardening the hardenable composition. The tube may comprise longitudinal reinforcements (braid or layers of widely spaced helical wires), the ends of the tube being possibly equipped with systems for communicating with the outside or for sealing, the final shaping being followed by a treatment for hardening said composition. The winding of the tube may be carried out about a central core or drum.

Abstract: A post mold curing apparatus for use in association with a molding line system for providing plastic encapsulated semiconductor chips mounted on leadframes is disclosed which includes a leadframe carrier having a rotary, substantially cylindrical shaped assembly for containing and moving a plurality of semiconductor chips and their associated leadframe strips into both an elevated temperature post mold curing region and into a lower temperature cool-down region. Each of the leadframe strips with their associated semiconductor chips are sequentially inserted into cavity regions located in the cylindrical assembly to assist in moving each of the plurality of leadframe strips through the elevated temperature post mold curing region, and subsequently, each of the leadframe strips with their associated semiconductor chips are removed from the cavity regions after passing through the lower temperature cool-down region.

Abstract: A molding machine comprises a mold composed of lower and upper mold sections. A recess is defined in the lower mold section to receive a lead frame or other objects. The lead frame is sandwiched between the upper and lower mold sections. A mold cavity is defined in the lower mold section below the recess so as to receive a thermosetting resin or encapsulant. A gasket groove is defined adjacent to the mold cavity to receive a gasket. The gasket is subject to plastic deformation upon application of force. An oil chamber is communicated with the gasket groove and contains hydraulic oil. The hydraulic oil is pressurized to urge the gasket against the lead frame. As a result, the gasket is so deformed as to closely contact the surface of the lead frame and seal the mold cavity. The hydraulic oil is preferably mixed with thermoplastic resin in powder form.

Abstract: A method for manufacturing a molded article having an insert incorporated therein comprises the steps of providing a first mold half having a mold core portion and a second mold half having a mold cavity portion, providing a carrier plate having a holder for an insert and a device for receiving the molded article located on the same face, positioning the carrier plate with the insert thereon between the first and second mold halves when the first and second mold halves are in an open position so that the insert is aligned with the mold core portion, transferring the insert to a position adjacent the mold core portion, withdrawing the carrier plate from between the first and second mold halves, moving the first and second mold halves together so that the mold cavity portion substantially surrounds at least a portion of the insert and defines a mold cavity space with the mold core portion, and injecting molten material into the mold cavity space so as to form the molded article.

Abstract: In a method of resin-sealing a semiconductor device having a circuit board with an IC thereon, a metal mold formed of upper and lower metal molds is prepared. The upper metal mold has a pressing member, and the lower metal mold has a cavity for mounting the circuit board therein, a pinpoint gate formed at a lower portion of the cavity and a runner section formed below the cavity and communicating with the pinpoint gate. The circuit board is positioned in the cavity of the lower metal mold, and is set such that the IC faces downward. A rear surface of the circuit board where the IC is not mounted is pressed by the pressing member, and a resin is filled in the cavity through the runner section and the pinpoint gate to thereby seal the IC mounted on the circuit board by the resin.

Abstract: A multilayer molded article made of a first member having a first core layer and a first skin material laminated on the first core layer, and a second member having a second core layer and a second skin material layer laminated on the second core layer, in which the first member is insert laminated in a part of the surface of the second skin material, and which is beautifully finished at a boundary between the first and second skin materials.

Abstract: An electronic device packaging apparatus using molding techniques is provided. This packaging apparatus includes an upper die, a lower die, and a resin injection mechanism. The lower die is designed to mate with the upper die, and includes a cavity block which has an upper block surface and a lower block surface. The upper block surface has formed therein a mold cavity for packaging an electronic device placed between the upper and lower dies with a resin material. The lower block surface has formed therein a groove communicating with the mold cavity. The resin injection mechanism is operable to inject a melted resin material into the mold cavity of the cavity block through the groove formed in the lower block surface of the cavity block.

Abstract: A male urinary catheter and method of making same. The catheter employs a condom like sheath of silicone rubber which sealingly engages the penis of the patient. A catheter stem at the distal end of the sheath couples to a urine collection system. The sheath is sealed to the penis by an adhesive which is applied to the outer surface of the sheath at the time of manufacture. A surface preparation layer is applied over the adhesive. The sheath is rolled up from the proximal end. The sheath is unrolled to apply it to the patient. During the unrolling process, the adhesive layer is removed from the outer surface and deposited on the inner surface of the sheath.

Abstract: A method for fabricating a vibration isolating housing for a data storage system is disclosed. The base of a data storage system housing includes a primary base having a first aperture, and a secondary base configured to fit within the first aperture of the primary base. The primary base and secondary base are placed in a mold of an injection molding apparatus so that a first gap is defined between the primary base and secondary base. Polymeric material is flowed into the first gap to form an integral, substantially rigid housing base upon curing of the polymeric material. The primary base may further include a second aperture for accommodating the configuration of a tertiary base, with a second gap being provided between the primary base and the tertiary base for receiving polymeric material to form an integral housing base comprising the primary, secondary, and tertiary bases.

Abstract: Insert-parts are set onto a lower die (10), and resin tablets are supplied into pots (10a) for resin mold. A press mechanism A molds the insert-parts, a mold is opened, then the lower die (10) is slid to a first position, which is located side of a molding position. At the first position, an unloading mechanism (C) and a parts-loading mechanism (D) execute to clean parting faces of the mold, and to set resin tablets and insert-parts. The lower die (10) returns to the molding position for next molding. By sliding the lower die (10), works of taking out molded products, setting insert-parts, etc. can be easier, and the molding cycle time can be shortened.

Abstract: A flexible sensor, such as a membrane switch, is molded into a plastic automotive panel by a low temperature, low pressure, method which avoids damage to the switch while insuring its placement at a desired depth below the surface of the panel. This is achieved by a process which includes a first step of spraying a mold with a rapid gelling liquid plastic to a preselected thickness. After the plastic has firmed, the sensor is placed thereon and is encapsulated by spraying with a second layer of the plastic. The resulting shell with the embedded sensor may then be provided with a backing, such as a plastic foam.

Abstract: A seal for movable structural components, like piston rods or shafts, includes a carrier body made of thermoplastic material and a sealing member locked to said carrier body and made of polytetrafluoroethylene (PTFE) material. A form-lock connection is achieved by an undercut which is formed permanently in the sealing member and filled with plastic material of the carrier body.

Abstract: A molding process includes forming a primary molded product having interlocking projections and holes in a primary mold. The product is transferred into a secondary mold having interlocking grooves and pins, and secured therein by the engagement of the projections and holes of the product with the grooves and pins, respectively, of the secondary mold. A secondary molded product containing the primary molded product as an insert is formed without having any undesirable displacement of the insert caused by the injection of a molding material at a high pressure. An appropriate molding apparatus is also disclosed.

Abstract: A method of and an apparatus for molding resin to seal electronic parts are adapted to use molding units to seal with molded resin materials electronic parts that are mounted on lead frames. Additional molding units are detachably mounted with respect to an already provided first molding unit in the molding apparatus, so that the number of the molding units can be arbitrarily adjusted. In this manner, the method and apparatus can be easily reconfigured or rearranged to be adapted to mass production or small production runs of the same or different types of molded parts. By simultaneously carrying out various process steps, the overall process time is reduced.

Abstract: A composite hockey stick shaft adapted for receiving a replacement blade. The composite shaft includes a shaft body formed of a resin material and embodying a spirally wound plurality of filaments embedded in the resin material. The present invention also relates to a process for making such a composite hockey stick shaft.

Abstract: Substrates having a wide range of thickness, and intended to be overmolded with a plastic package body, are accommodated in a common mold. The top surface of the substrate is provided with a dam structure, which may be formed as an additional layer on the substrate, and which is preferably in the form of a square ring. A groove (channel) is machined (e.g., by routing) into the surface of the dam structure. The top mold half, having a cavity for forming the package body, is provided with a sealing structure at the periphery of the cavity. The sealing structure has a ridge fitting into the channel of the dam structure. The depth of the groove in the dam structure is readily adjusted to ensure uniform clamping pressure of the top mold half on the substrate, so that liquid molding compound is contained within the cavity and so that undue pressure is not exerted on the substrate.

Abstract: The invention is to a transfer mold design utilized with conventional transfer encapsulation. The design utilizes a varying runner cross section with an intermediate varying depth well or reservoir from which a constant gate depth and gate entry angled to the mold cavities is employed. The method and apparatus of the invention is applicable to single and multi-plunger molding utilizing thermoset and thermoplastic encapsulants for semiconductors.