Patents Examined by Anh H Vuong
  • Patent number: 12260541
    Abstract: A soldering quality inspection method and a soldering quality inspection apparatus are provided. The soldering quality inspection method includes: acquiring an inspection image; calculating, by a processing device, a dyed area percentage of an area of a part of a soldering region in the inspection image that is dyed by a dye ink relative to an area of the soldering region, and determining whether the dyed area percentage is greater than a predetermined dyed percentage. When the dyed area percentage is determined to be equal to or less than the predetermined dyed percentage, a position under inspection is determined to be of good soldering quality, and a corresponding inspection result information is generated. When the dyed area percentage is determined to be greater than the predetermined dyed percentage, the position under inspection is determined to be of poor soldering quality, and the corresponding inspection result information is generated.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: March 25, 2025
    Assignee: MATERIALS ANALYSIS TECHNOLOGY INC.
    Inventors: Shang-En Wu, Keng-Chi Liang, Kuang-Tse Ho, Hung-Jen Chen