Abstract: An actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin having a polarity that increases by an action of an acid, (B) a photoacid generator, and an anion (P) which is one or more anions selected from the group consisting of NO3?, SO42?, Cl?, and Br?, in which a content of the anion (P) is from 0.01 ppb to 100 ppm with respect to a total mass of the actinic ray-sensitive or radiation-sensitive resin composition, an actinic ray-sensitive or radiation-sensitive film formed from the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method, and a method for manufacturing an electronic device.

Abstract: A method for producing an actinic ray-sensitive or radiation-sensitive resin composition, comprising: preparing an intermediate solution which includes a photoacid generator and a solvent; and mixing the intermediate solution with at least a resin to prepare an actinic ray-sensitive or radiation-sensitive resin composition having a viscosity of 10 mPa·s or more.

Abstract: A method for forming a semiconductor device includes forming a photoresist layer over a substrate, exposing the photoresist layer to radiation to form a pattern therein, and selectively removing portions of the photoresist layer that are not exposed to the radiation to form a patterned photoresist layer. The photoresist layer comprises a fluorine-containing polymer, a crosslinker and a photoactive compound.

Abstract: A carboxylate represented by formula (I), a resin comprising a structural unit derived from the carboxylate represented by formula (I), a resit composition comprising the carboxylate represented by formula (I) or a resin comprising a structural unit derived from the carboxylate represented by formula (I).

Abstract: A compound represented by Chemical Formula 1: a photoresist fluorescent resin composition containing the compound of the Chemical Formula 1, a binder resin and a polymerizable compound including an ethylenically unsaturated bond, a color conversion film manufactured using the photoresist fluorescent resin composition, a backlight unit comprising the color conversion film, and a display apparatus comprising the backlight unit.

Abstract: A resist underlayer film having a particularly high dry etching rate; a resist underlayer film-forming composition; a resist pattern forming method; and a semiconductor device production method. The resist underlayer film-forming composition contains a solvent and an epoxy adduct obtained by reacting a compound represented by formula (1) and an epoxy adduct-forming compound. The epoxy adduct-forming compound is one or more compounds selected from the group made of carboxylic acid-containing compounds, carboxylic anhydride-containing compounds, hydroxy group-containing compounds, thiol group-containing compounds, amino group-containing compounds, and imide group-containing compounds.

Abstract: A resin composition includes a coloring material, a resin, and a solvent. The resin includes a graft polymer which has a main chain including a molecular chain having a structure derived from a compound having an ethylenically unsaturated bond-containing group and a graft chain, and the graft chain includes a repeating unit p1 having an oxetane group. The resin composition may be employed in a film formed of the resin composition; an optical filter; a solid-state imaging element; and an image display device.

Abstract: A photosensitive resin composition contains: a polymer (A) having a terminal group represented by Formula (a1) and a repeating structural unit represented by Formula (a2); a crosslinking agent (B); and a photocation generator (C). Y represents a reactive group that reacts with the crosslinking agent (B) by action of a cation generated from the photocation generator (C) upon light irradiation; each X independently represents an oxygen atom, a sulfur atom, an ester bond, an amide bond, or —SO2—; R1 represents a divalent hydrocarbon group or a divalent group in which a functional group other than the reactive group and heterocycles is introduced into the divalent hydrocarbon group; and R2 represents a divalent hydrocarbon group, a divalent group in which a functional group other than the reactive group and heterocycles is introduced into the divalent hydrocarbon group, or a heterocycle-containing group that does not have the reactive group.

Abstract: The functional photoresist for patterning a nanoparticle thin film including nanoparticles on a substate includes: a photoactive compound (PAC); and a functional ligand that is bound to surfaces of the nanoparticles and controls physical properties of the nanoparticles.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition containing: a resin (P) of which a solubility in a developer changes by an action of an acid; a compound (A) that has a group (a) having a polarity which changes through decomposition by an action of an acid, and generates an acid (ac1) upon irradiation with actinic rays or radiation; a compound (B) that generates an acid (ac2) having a higher pKa than the acid (ac1) generated from the compound (A), upon irradiation with actinic rays or radiation; and a basic compound (C).

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition contains (A) a resin having a polarity that increases by an action of an acid, (B) a photoacid generator, (P) an amine oxide, and (D) an acid diffusion control agent provided that acid diffusion control agents corresponding to the amine oxide are excluded, in which a content of the amine oxide (P) is from 0.01 ppm to 1,000 ppm with respect to a total mass of the actinic ray-sensitive or radiation-sensitive resin composition, and a mass ratio of the acid diffusion control agent (D) to the amine oxide (P) is more than 1 and 10,000 or less.

Abstract: A core-shell dye, a photosensitive resin composition including the same, and a color filter manufactured using the photosensitive resin composition, the core-shell dye including a core represented by Chemical Formula 1; and a shell represented by Chemical Formula 2, the shell surrounding the core,

Abstract: A composition for forming a pattern for imprinting, which contains a polymerizable compound, a photopolymerization initiator, and an organic halogen compound containing at least one atom selected from the group consisting of a chlorine atom, a bromine atom, and an iodine atom, in which the organic halogen compound is a compound which is stable to light of a mercury lamp, and a content of the organic halogen compound is 0.001% to 1.0% by mass with respect to a total solid content in the composition for forming a pattern; a kit including the composition for forming a pattern; a pattern producing method; a pattern; and a method for manufacturing a semiconductor element.

Abstract: A salt capable of producing a resist pattern with satisfactory CD uniformity (CDU) represented by formula (I), an acid generator and a resist composition including the same: wherein R4, R5, R7 and R8 each represent a halogen atom, a haloalkyl group, etc., A1 and A2 each represent a hydrocarbon group, the group may have a substituent, —CH2— in the group may be replaced by —O—, —CO—, —S—, —SO2—, etc., X3 and X4 each represent —O— or —S—, m1 present an integer of 1 to 5, m2 and m8 represent an integer of 0 to 5, m4 and m5 represent an integer of 0 to 3, m7 represent an integer of 0 to 4, 1?m1+m7?5, 0?m2+m8?5, and AI? represents an organic anion.

Abstract: An actinic ray-sensitive or radiation-sensitive resin composition includes a resin X including a repeating unit derived from a compound including two or more structural moieties consisting of an anionic moiety and a cationic moiety, and a polymerizable group, in which the compound generates an acid including an acidic moiety derived from the anionic moiety in the two or more structural moieties by irradiation with actinic rays or radiation.

Abstract: A photosensitive resin composition contains at least one compound selected from the group consisting of compound (C1) represented by formula (C1), compound (C2) represented by formula (C2), and a multimer of the compound (C2). Z each independently represents an oxygen atom or a sulfur atom. R31 each independently represents a monovalent hydrocarbon group or a group obtained by substituting at least one hydrogen atom in the monovalent hydrocarbon group with a mercapto group, and at least one R31 is a group obtained by substituting at least one hydrogen atom in the monovalent hydrocarbon group with a mercapto group when p is 1 and when p is an integer of 2 or more and all of Z is an oxygen atom. R32 and R33 each independently represent a divalent hydrocarbon group, and R34 represents a glycoluril ring structure or an isocyanul ring structure.

Abstract: A matte-like cured coating film of a curable resin composition is provided on a substrate such as a wiring board, in which scratches are unnoticeable. The cured coating film satisfies Gs (20°)?5 and Gs (85°)?35 and has a ratio R represented by the formula R={Gs (85°)/Gs (60°}/{Gs (60°)/Gs (20°)} ranging from 0.35 to 4.0, where Gs (20°), Gs (60°), and Gs (85°) are 20° gloss, 60° gloss, and 85° gloss on a surface of the cured coating film measured according to JIS Z 8741-1997, respectively.

Abstract: A method of forming a photoresist pattern includes forming a protective layer over a photoresist layer formed on a substrate, and selectively exposing the protective layer and the photoresist layer to actinic radiation. The protective layer and the photoresist layer are developed to form a pattern in the photoresist layer, and the protective layer is removed. The protective layer includes a polymer having pendant fluorocarbon groups and pendant acid leaving groups.

Abstract: A compound represented by Chemical Formula 1: Ar1-L1-Ar2-L2-X—R1,??[Chemical Formula 1] in which Ar1 and Ar2 are aromatic rings or heterocyclic aromatic rings that each include at least one iodine atom and Ar1 also includes at least one hydroxyl group, L1 and L2 are each a divalent linking group, X is —C(?O)O— or —S(?O)2—O—, and R1 is an acid-labile protecting group. Photoresist compositions that include the compound, and methods of manufacturing an integrated circuit device by using the photoresist composition.

Abstract: A core-shell dye including a core having a compound represented by Chemical Formula 1 and a shell surrounding the core and represented by Chemical Formula 2 or Chemical Formula 3, a photosensitive resin composition including the same, and a color filter manufactured using the photosensitive resin composition. (In Chemical Formulae 1 to 3, each substituent is the same as defined in the specification.