Abstract: A pressure sensor device includes a pressure sensor cell that includes a sensor chip having a diaphragm with piezo-resistors, an amplifying circuit, and various adjusting circuits, and a base member to which the sensor chip is joined, with the diaphragm facing a through hole of the base member. The base member and a metallic member are joined together with a joining member so that their respective through holes communicate with each other. A protective film or filler covers the joining member between the base member and the metallic pipe member. The metallic pipe member is bonded to a resin case, and a signal terminal of the resin case and the pressure sensor chip are electrically connected together by wire bonding, thus forming a pressure sensor cell. The metallic pipe member protrudes beyond an end face of the resin case to support load.

Abstract: A capacitive sensor including a housing having a hermetically sealed cavity, a plate in the cavity, a diaphragm forming a part of the cavity and spaced from the plate, a conductive layer on the first diaphragm, and a second conductive layer on the plate, the first and second conductive layers being the electrodes of a capacitor whose capacitance varies with the position of the diaphragm relative to the plate.

Abstract: A pressure sensor includes a sensor chip in which a diaphragm is provided, and a case to which the sensor chip is directly mounted by an adhesive. A groove that surrounds the diaphragm is provided on the rear surface of the sensor chip between the bonded part and the diaphragm. The groove prevents thermal stress, which occurs at the bonded part, from reaching the diaphragm through the sensor chip, and thereby the accuracy of the sensor output is highly accurate. Further, the groove may store any excessive adhesive that may be applied when the sensor chip is bonded to the case to prevent the adhesive from flowing and adhering to the diaphragm.