Abstract: A system and method to read and write data in magnetic random access memories are disclosed. In a particular embodiment, a device includes a spin transfer torque magnetic tunnel junction (STT-MTJ) element and a transistor with a first gate and a second gate coupled to the STT-MTJ element.

Abstract: A semiconductor memory device includes a memory cell array having a plurality of memory cells which are set into low-resistance states/high-resistance states according to “0” data/“1” data. An allocation of the “0” data/“1” data and the low-resistance state/high-resistance state is switched when a power source is turned on.

Abstract: A phase change memory cell may be read by driving a current through the cell higher than its threshold current. A voltage derived from the selected column may be utilized to read a selected bit of a phase change memory. The read window or margin may be improved in some embodiments. A refresh cycle may be included at periodic intervals.

Abstract: Provided is a method of operating a nonvolatile memory device to perform an erase operation. The method includes applying a composite pulse including a direct current (DC) pulse and a DC perturbation pulse to the nonvolatile memory device to perform the erase operation.

Abstract: Methods for programming and sensing in a memory device, a data cache, and a memory device are disclosed. In one such method, all of the bit lines of a memory block are programmed or sensed during the same program or sense operation by alternately multiplexing the odd or even page bit lines to the dynamic data cache. The dynamic data cache is comprised of dual SDC, PDC, DDC1, and DDC2 circuits such that one set of circuits is coupled to the odd page bit lines and the other set of circuits is coupled to the even page bit lines.

Abstract: A voltage pump circuit includes a pumping unit configured to include a plurality of pumps and perform voltage pumping and a pumping control unit configured to generate control signals for selectively driving the pumps in response to a mode determination signal.

Abstract: A semiconductor memory device includes a memory cell array and a sense amp circuit. The memory cell array includes bit lines connected to memory cells operative to store first logic data and second logic data smaller in cell current than the first logic. The sense amp circuit has a clamp transistor operative to clamp a bit line voltage. The sense amp circuit is operative to detect data in a selected memory cell via the clamp transistor and the bit line. The sense amp circuit is operative to read data from the selected memory cell in at least the two of first and second read cycles while a control voltage is applied to a gate of the clamp transistor. Different control voltages are applied to the gate of the clamp transistor in the first and second read cycles.

Abstract: A semiconductor memory of an aspect of the present invention including a main bit line, a first and second sub-bit line, a first resistive memory element which has a first terminal being connected with the main bit line, a first select transistor which has one end of a first current path being connected with the second terminal of the first resistive memory element and the other end of the first current path being connected with the first sub-bit line, a second resistive memory element which has a third terminal being connected with the main bit line, and a second select transistor which has one end of a second current path being connected with the fourth terminal of the second resistive memory element and the other end of the second current path being connected with the second sub-bit line.

Abstract: A non-volatile memory cell with a programmable unipolar switching element, and a method of programming the memory element are disclosed. In some embodiments, the memory cell comprises a programmable bipolar resistive sense memory element connected in series with a programmable unipolar resistive sense switching element. The memory element is programmed to a selected resistance state by application of a selected write current in a selected direction through the cell, wherein a first resistance level is programmed by passage of a write current in a first direction and wherein a second resistance level is programmed by passage of a write current in an opposing second direction. The switching element is programmed to a selected resistance level to facilitate access to the selected resistance state of the memory element.

Abstract: A semiconductor memory device is capable of transferring address signals at high speed and improving the operation reliability even though an input rate of an address signal increases, and thus a degradation of an operation speed caused by applying a bus inversion scheme can be prevented and power consumption can be reduced. The semiconductor memory device includes a bus inversion decoding block configured to determine whether a plurality of address signals are inverted or not by decoding an indication control signal, and an address buffer block configured to receive two address signals per one cycle of an external clock, align the received address signals for parallel processing, and transfer the address signals or inverted address signals according to an output of the bus inversion decoding block.

Abstract: The invention provides a voltage applying structure having a reduced area penalty with respect to a data line. A wiring forming a global data line and a local data line formed in a p-type well region are connected via a select transistor. Two select lines are formed on a gate electrode of the select transistor. One select line is electrically connected to the gate electrode of the select transistor, however, the other select line is not connected to the select transistor. That is, an insulator film is formed between the select line and the gate electrode. As mentioned above, two select lines shorter than a gate length are provided on one select transistor. The select line is structured such as to be connected to the other select transistor.

Abstract: Methods of generating a program voltage for programming a non-volatile memory device include generating an initial voltage and generating a first ramping voltage in response to the initial voltage. The first ramping voltage has a ramping speed slower than the ramping speed of the initial voltage. A second ramping voltage is generated in response to the first ramping voltage. The second ramping voltage has a lower ripple than the first ramping voltage. The second ramping voltage is output as a program voltage for programming a non-volatile memory device. A program voltage generating circuit includes a program voltage generating unit configured to generate an initial voltage, a ramping circuit configured to generate a first ramping voltage responsive to the initial voltage, and a voltage controlling unit configured to generate a second ramping voltage having relatively low ripple and to output the first ramping voltage or the second ramping voltage responsive to a voltage level of the first ramping voltage.

Abstract: A semiconductor integrated circuit device includes a first chip that is directly accessible from outside, a second chip that transmits and receives data to and from the first chip, the second chip being not directly accessible from outside, and a through circuit that is provided in the first chip and transmits first and second test signals input from an external device to the second chip, wherein the through circuit includes a first signal transmission path to generate a first signal by synchronizing the first test signal to a clock signal input from the external device and to output it to the second chip and a second signal transmission path to generate a second signal by synchronizing the second test signal to a test clock signal input from the external device and to output it to the second chip.

Abstract: A method for driving a nonvolatile semiconductor memory device is provided. The nonvolatile semiconductor memory device has source/drain diffusion layers spaced from each other in a surface portion of a semiconductor substrate, a laminated insulating film formed on a channel between the source/drain diffusion layers and including a charge storage layer, and a gate electrode formed on the laminated insulating film, the nonvolatile semiconductor memory device changing its data memory state by injection of charges into the charge storage layer. The method includes, before injecting charges to change the data memory state into the charge storage layer: injecting charges having a polarity identical to that of the charges to be injected; and further injecting charges having a polarity opposite to that of the injected charges.

Abstract: A semiconductor integrated circuit includes a sense amplifier for sensing input data and a sense amplifier controller for blocking a signal path between the sense amplifier and a memory cell when a test mode signal is activated.

Abstract: A semiconductor device is described. A channel area is arranged in a semiconductor substrate between a first contact area and a second contact area. A first programmable structure includes a first control structure. The first programmable structure is arranged such that a conductivity of a first section of the channel area depends on a voltage applicable to the first control structure of the first programmable structure and on an information value stored in the first programmable structure. A second programmable structure includes a second control structure. The second programmable structure is arranged such that a conductivity of a second section of the channel area depends on a voltage applicable to the second control structure of the second programmable structure and on an information value stored in the second programmable structure. The first section and the second section of the channel area are electrically connected in series between the first contact area and the second contact area.

Abstract: A page of non-volatile multi-level memory cells on a word line is sensed in parallel by sense amps via bit lines. A predetermined input sensing voltage as an increasing function of time applied to the word line allows scanning of the entire range of thresholds of the memory cell in one sweep. Sensing of the thresholds of individual cells is then reduced to a time-domain sensing by noting the times the individual cells become conducting. Each conducting time, adjusted for delays in the word line and the bit line, can be used to derive the sensing voltage level that developed at the word line local to the cell when the cell became conducting. The locally developed sensing voltage level yields the threshold of the cell. This time-domain sensing is relative insensitive to the number of levels of a multi-level memory and therefore resolve many levels rapidly in one sweep.

Abstract: A method is described for programming memory cells, in particular of the Flash type. In accordance with the method, a verification is performed with a first parallelism (M) in which a reading is carried out for determining the state of a group of memory cells, a determination is performed of a programming parallelism (np), based on the results of the verification, and a real programming of the memory cells carried out with the programming parallelism (np). An architecture is also described for programming memory cells in particular of the Flash type.

Abstract: Writing to non-volatile memory during a volatile memory refresh cycle is described. In one example, a write command is received and data is received to write into a memory cell. The data is temporarily stored in response to the write command. A refresh command is received and the temporarily stored data is written into the memory cell in response to the refresh command.

Abstract: Subject matter disclosed herein relates to non-volatile flash memory, and more particularly to a method of reducing stress induced leakage current.