Abstract: An electronic equipment enclosure includes a frame structure at least partially enclosed by a plurality of panels defining a compartment in which one or more electronic components are mounted and an exhaust air duct that is adapted to segregate hot air being exhausted from the compartment from cool air entering the compartment, thereby improving thermal management of the enclosure. The exhaust duct includes a lower duct section extending upward from the top panel of the compartment and an upper duct section telescoping upward from an upper end of the lower duct section. Each duct section includes four panels connected together by hinged corner fittings such that the section is collapsible. The upper duct section includes an outwardly flared portion.

Abstract: An electric compressor includes a cover. The cover is reinforced by forming straight ribs, ring ribs, connection ribs, or hexagonal ribs having a honeycomb structure. The straight ribs, rings ribs, connection ribs, or hexagonal ribs are formed on the inner side or the outer side of a body of the cover on a side of an inverter.

Abstract: An electronic device includes a housing including a first plate, a second plate, and a side member a first band detachably mounted to the side member, and shaped to wrap around a wrist of a user; a display exposed through the first plate; a processor a memory and a mounting structure configured to connect the first band to the side member.

Abstract: A device including a first semiconductor package that includes a semiconductor chip, an encapsulation material at least partly covering the semiconductor chip, and a contact element electrically coupled to the semiconductor chip and protruding out of the encapsulation material. In addition, the device includes a printed circuit board (PCB), wherein the first semiconductor package is mounted on the PCB and the contact element of the first semiconductor package is electrically coupled to the PCB. The device further includes a first metal workpiece mounted on the printed circuit board and electrically coupled to the contact element of the first semiconductor package.

Abstract: A heat dissipation module being disposed in an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, a magnetic field generator and a plurality of magnetic powder. The heat source is heat conducting to the evaporator. The pipe is connected to the evaporator to form a loop therewith, and a working fluid is filled in the loop. The magnetic field generator is disposed outside of the evaporator. The magnetic powder is movably disposed in the evaporator. A magnetic field generated by the magnetic field generator drives the magnetic powder to form a channel in the evaporator where the working fluid passes through. The heat generated by the heat source is transmitted to the evaporator, and the working fluid in liquid phase absorbs the heat and is phase-transited to vapor phase and flows from the evaporator towards the pipe.

Abstract: A server rack configured to provide electrical connections with data storage modules upon contact includes a shell and a slide rail module slidably installed on the shell. The shell includes a power supply module. The slide rail module itself is electrically conductive and provided with a cable at each end. The cables are connected with the power supply module and the data storage module, and the data storage module is electrically connected with the power supply module.

Abstract: A wall mount system for mounting a plurality of monitors on a wall. The system has a plurality of wall mount assemblies, a plurality of monitor interfaces adapted to receive an electronic display respectively, and a depth adjustment feature operably coupling each monitor interface to one of the wall mount assemblies and enabling the monitors to be positioned and adjusted to account for recesses or raised portions of the wall and present a continuous, planar monitor display surface.

Abstract: Provided is an electronic circuit board assembly. The electronic circuit board assembly includes an electronic circuit board, a plurality of electronic circuit devices disposed on the electronic circuit board, an electromagnetic interference (EMI) shielding structure configured to shield an electromagnetic wave generated from the plurality of electronic circuit devices, and a thermal pad configured to dissipate heat generated from the plurality of electronic circuit devices. The EMI shielding structure covers the plurality of electronic circuit devices and is attached to the electronic circuit board, and the thermal pad is disposed between the plurality of electronic circuit devices and the EMI shielding structure, contacts the plurality of electronic circuit devices and the EMI shielding structure, and thereby can transfers the heat generated from the plurality of electronic circuit devices to the EMI shielding structure.

Abstract: A power circuit module is provided. The encapsulated power circuit module comprises: a pressure plate comprising a protrusion body; a frame; and a substrate bearing a power circuit, the power circuit comprising at least a power switching device; the frame is provided between the substrate and the pressure plate, the frame supports the pressure plate, and a substantially closed space is formed by the substrate, the pressure plate and the frame; and when an external force is applied on the pressure plate, the protrusion body press against the substrate and is in insulation contact with the substrate, and the external force is transmitted evenly on the substrate.

Abstract: An electronic device includes a first unit (100) and a second unit detachable from each other. The second unit includes an input unit, a socket, and a hinge. The socket has a first wall and a second wall. In the first wall and the second wall, a length (L1) of a portion to support both ends of the longitudinal side of the first unit is greater than a length (L2) of a portion to support the region other than both ends of the longitudinal side of the first unit. The lengths (L1) and (L2) are perpendicular to the longitudinal side of the first unit. The portion to support the region other than both ends of the longitudinal side of the first unit has a linear opening-side end parallel to the longitudinal side of the first unit when the first and second walls are seen vertically.

Abstract: A fixing mechanism and a computer chassis are provided. The fixing mechanism includes a main member and a first locking member. The first locking member includes a fixing portion, a support portion and a stop portion. The fixing portion includes a first part and a second part, and two ends of the first part are respectively connected to the main member and the second part. The support portion is connected to the fix portion, and the second part and the support portion are respectively located on two opposite surfaces of the first part. The stop portion is connected to the support portion, and located on a bottom surface of the support portion. An electronic device is assembled in the main member, and the first locking member is locked to a circuit board of a computer chassis to fix the fixing mechanism in a casing of the computer chassis.

Abstract: In one aspect, a cooling system is provided for use in computing devices, such as laptops, cell phones, and tablet computers. The cooling system includes a heat spreader coupled to a radiator via a heat pipe having a midline. The heat pipe includes a first end portion longitudinally extending along the midline, a second end portion longitudinally extending along the midline, and a mid-portion longitudinally extending along the midline. The mid-portion is located between the first end portion and the second end portion and it has a thickness that is greater than the thicknesses of both the first portion and the second portion thereby reducing the overall thermal resistance of the heat pipe.

Abstract: The exemplary embodiments herein provide a figure eight closed loop of circulating gas pathways wrapping around an electronic display. One or more open loop ambient air pathways may pass through the figure eight but do not allow the circulating gas and the ambient air to mix. In some embodiments, the open loop ambient air pathway travels along a rear surface of the electronic display. In some embodiments, the circulating gas pathways contain a front channel placed in front of the electronic display, a rear channel placed behind the electronic display, and a center channel placed between the front and rear channels. Pass-through apertures may be placed within the path of the circulating gas and/or the ambient air to allow the paths of the two gaseous matters to cross without allowing them to mix with one another.

Abstract: The present disclosure relates to the field of display devices and discloses a foldable display device comprising: a main body structure and a flexible screen provided on a surface of the main body structure; the main body structure includes two flat plate areas and a bending area connecting the two flat plates and making the two flat plate areas have an opening and closing angle of 0 degrees to at least 180 degrees between; the bending area having a minimum bending radius at the time of bending so that the flexible screen attached to the surface of the bending area also has a minimum bending radius, which is greater than a critical bending radius of the flexible screen. The present disclosure allows the flexible screen to have a minimum bending radius when the screen is folded, preventing the flexible screen from being damaged by excessive bending.

Abstract: An information handling system having rotationally coupled housing portions supports a flexible display disposed across the housing portions with a hinge structure that manages flexible display curve radius in a folded configuration. A dual axis synchronized hinge defines the flexible display bend radius by the distance between the hinge axes and by a shape memory alloy planar support fixed in position relative to the hinge. A ramp structure engages a flexible display frame during rotation to an open position to maintain the display frame in a planar configuration.

Abstract: An information handling system having rotationally coupled housing portions supports a flexible display disposed across the housing portions with a hinge structure that manages flexible display curve radius in a folded configuration. The hinge includes plural hinge elements having an arc face, arc cavity interior and mounts that couple with hinge coupling elements. The mounts align the hinge coupling element rotational axis out of the cavity to aid in maintaining the hinge elements having no gaps during rotation of the information handling system housing portions. The hinge coupling element integrates friction plates disposed normal the rotation axis to generate torque for managing housing rotational movement.

Abstract: A system and method for heat dissipation and vibration damping of electronic devices in which an assembly is formed by one or more surfaces comprised of at least one material that is a thermally conductive plastic that combines to partially or completely enclose one or more electronic devices as a physical and thermal intermediary between the electronic devices and supporting structures.

Abstract: An electronic device of the present disclosure is configured to detachably include a first unit and a second unit. The second unit includes a socket. The socket includes a socket main body, and an operating member for performing a releasing operation of engagement through a lock mechanism that makes the first unit and the second unit detachable. The socket main body includes a first wall and a second wall. The operating member includes a first operating portion disposed on an exterior of the first wall, and a second operating portion disposed on an exterior of the second wall.

Abstract: An apparatus for mating computing device structures. The apparatus comprises a first bracket coupled to a pluggable electronic device. The first bracket comprises a first set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. The apparatus further comprises a second bracket coupled to the pluggable electronic device. The second bracket comprises a second set of one or more attachment features that are capable of coupling to corresponding receiving features of a supporting structure. In another aspect, the apparatus further comprises one or more guide tubes coupled to the pluggable electronic device.

Abstract: A system and method of controlling a cooling fan in an information handling system is disclosed. A fan request signal is received from a component of an information handling system and a determination is made regarding whether the component is configured to operate with a cooling fan. If the component is configured to operate with the cooling fan, the fan request signal is transmitted to the cooling fan. If, on the other hand, the component is not configured to operate with the cooling fan, a revised fan request signal is generated and transmitted to the cooling fan.