Abstract: A heat dissipation structure includes a heat dissipation member and a fixed member. The fixed member has a first surface and a second surface oppositely. The heat dissipation member is disposed on the first surface, and one part of the second surface corresponds to one side of at least one heat generating source and is disposed adjacent to the one side of the heat generating source. The first surface has a first zone surrounded by a second zone. The heat dissipation member is disposed on the first zone corresponding to the heat generating source. The second zone has at least one groove arranged around one part of the first zone. A distance between one side of the groove adjacent to the first zone and the first zone is less than 1.0 mm, and a volume ratio of the groove to the heat dissipation member is 0.9 to 1.6.

Abstract: A cable fixing accessory includes: a cylinder segment having a surface with a predefined radius of curvature. The surface of the cylinder segment bends a cable having an electrically conductive core at least partially around the surface of the cylinder segment. The radius of curvature of a portion of the surface of the cylinder segment, which has direct contact with the cable, is greater than or equal to six times a diameter of the electrically conductive core of the cable.

Abstract: A chassis device adapted for an expansion device is provided and includes a case, a base and a latch. The case includes an avoiding portion. The base is disposed on the case. At least one accommodating portion is formed on the base. The latch includes at least one pivoting portion, a first abutting portion and a second abutting portion. The at least one pivoting portion is movably disposed through the at least one accommodating portion. The latch is slidable between a locking position and a non-locking position. The first abutting portion and the second abutting portion respectively abut against the case and the expansion device when the latch is located at the locking position, and the avoiding portion allows the latch to pivot when the latch is located at the non-locking position. Besides, a server including the aforementioned chassis device is provided.

Abstract: The invention relates to an electrical assembly, in particular for a vehicle, comprising a casing (13), at least one electrical module (11) having at least one electrical component to be cooled, a cooling module (12) comprising at least two fluid orifices (122), at least one cooling duct provided in said cooling module (12), configured to form a portion of a cooling circuit and to provide a fluidic connection between said fluid orifices (122), said at least one electrical module (11) being connected to said cooling module (12) in order for the electrical module (11) to be cooled, said casing (13) being connected to said cooling module (12) so as to define a free volume, said free volume accommodating said at least one electrical module (11) so as to form an independent module configured to be connected to a frame of an item of electrical equipment.

Abstract: A heat dissipation tooth piece and a preparation method therefor, a heat dissipation apparatus and an electronic device are disclosed. The heat dissipation tooth piece including a first heat dissipation assembly and a second heat dissipation assembly which are oppositely arranged, the first heat dissipation assembly includes a first heat dissipation part, and the second heat dissipation assembly includes a second heat dissipation part; the first heat dissipation part and the second heat dissipation part are oppositely arranged and define a first pipeline, the first heat dissipation assembly further includes a first connection part, the second heat dissipation assembly further includes a second connection part, the first connection part and the second connection part are connected and define a second pipeline, and the second pipeline is communicated with the first pipeline.

Abstract: A data center cooling system, including a support structure having a lower portion and an upper portion, one or more fans supported by the support structure at a height that is equal to or greater than a height of the electronics cabinets, and a heat exchanger having one or more cooling coils supported at the upper portion of the support structure. In some embodiments, the cooling coils can be supported by the upper portion of the support structure so as to be above the top of and/or over one or more of the electronics cabinets. The fans can be configured to draw air from the one or two rows of electronics cabinets and to cause the air to be passed through the heat exchanger to cool the warmer air from the electronics cabinets.

Abstract: A hinge mechanism is provided, including a connecting unit, a hinge unit, and a locking element. The connecting unit has a connecting member and a tubular member. The tubular member is disposed on the connecting member. The hinge unit has a first member, a second member, a shaft, and a rod. The shaft pivotally connects the first member to the second member. The rod is affixed to the second member. The rod extends into the tubular member and has a slot. The locking element is fastened through the tubular member and joined in the slot.

Abstract: A portable information handling system having a portable housing with first and second housing portions rotationally coupled by a hinge having an adjustable torque and a sensor disposed at a front corner of a housing portion reduces torque provided by the hinge when in a closed position and an indication is sensed of an end user opening the housing portions. Reducing torque of the hinge that resists housing rotation from the closed position aids an end user in a single handed rotation of the housing to an open position by allowing the weight of the housing to be sufficient to hold the housing in place on a support surface while the housing rotates open.

Abstract: A display device includes a display screen, connection members and a driving apparatus. The display screen includes a flexible display panel and a plurality of supports. The plurality of supports include a first support and a second support that are adjacently arranged. The first support includes a connection portion. A connection member in the connection members is disposed on the second support. The driving apparatus is configured such that the driving apparatus drives the connection member to be connected to or disconnected from the connection portion.

Abstract: A swivel bracket assembly and a method for installing an electrical component to a riser bracket assembly are disclosed. The swivel bracket assembly includes a baseplate; a swivel bracket rotatably attached to the baseplate, the swivel bracket being rotatable between an open position and a closed position; and pads attached to the swivel bracket, at least one of the pads being configured to contact and support the electrical component attached to the riser bracket assembly when the swivel bracket is in the closed position. A method for installing an electrical component to a riser bracket assembly includes receiving the electrical component into a slot of a riser circuit board and pivoting a swivel bracket rotatable coupled to a baseplate from an open position to a closed position to support the electrical component secured to the riser bracket assembly.

Abstract: Particular embodiments described herein provide for an electronic device, such as a notebook computer or laptop, that includes a circuit board coupled to a plurality of electronic components (which includes any type of components, elements, circuitry, etc.). The electronic device may also include a base portion and a lid portion coupled to the base portion at a hinge configured such that the base portion and the lid portion can rotate between an open configuration of the electronic device and a closed configuration of the electronic device. The lid portion can include at least one segment that is to raise at least a portion of the base portion in response to a rotation toward the open configuration (e.g., opening the lid portion to access a touchpad or a keyboard of the electronic device, or to see a display of the electronic device).

Abstract: Embodiments of the disclosure relate to apparatuses for enhanced thermal management of a planar inductor assembly. In one embodiment, a cooling package for an inductor assembly includes a cold plate and a heat-spreading bracket mechanically coupled to the cold plate at a first end of the heat-spreading bracket. The cold plate has a slotted recess for mounting a first inductor core along a first end thereof. The heat-spreading bracket is configured to apply a clamping force to a second inductor core at a second end opposite to the first end of the heat-spreading bracket.

Abstract: Multiple systems and methods for providing combined liquid and air cooling for IT units are disclosed. The system includes a dry cooling section with at least one dry cooler and a liquid loop interface with at least one liquid heat exchange device. A primary loop includes at least one dry cooler of the dry cooler section, and a secondary loop includes the at least one liquid heat exchange device of the liquid loop interface that provides liquid cooling to one or more IT units. The system may include an air/liquid exchange section with at least one air/liquid exchange device that provides air cooling to the one or more IT units. The at least one air-liquid heat exchange device is part of the primary loop.

Abstract: A device of drawing out surface heat of an electronic component includes a housing, a liquid inlet port, a liquid outlet port, a partition wall and flow guiding walls. The housing includes opposite a contact wall and a heat dissipating wall, and a side wall respectively connected to the contact wall and the heat dissipating wall. The liquid inlet port and the liquid outlet port are formed on the side wall. The partition wall is formed in the housing, and connected to inner surfaces of the contact wall, the heat dissipating wall and the side wall, to divide an interior of the housing into an inflow channel and an outflow channel. The flow guiding walls are respectively formed in the inflow channel and the out flow channel, and connected to the inner surface of the contact wall.

Abstract: The invention relates to a module housing made of plastic, in particular a thermosetting polymer, with an embedded cooling element and at least one screw sleeve, which has a collar with an exposed mounting surface with which the module housing can be mounted on a support functioning as an external heat sink. The cooling element and the at least one screw sleeve form a monolithic element with which heat can be conducted from the cooling element to the support via at least the mounting surface.

Abstract: A foldable device may include a foldable layer and a hinge mechanism. The hinge mechanism may include a plurality of hinge segments, arranged in a plurality of rows, and with adjacent hinge segments being movably coupled so as to guide a folding and an unfolding motion of the foldable layer.

Abstract: A waterproof electronic device including a body, a one-way valve, and a cover is provided. The body has a first hole, which penetrates the body and communicates with an external environment, and a chamber. The one-way valve disposed on an inner surface of the body communicates with the first hole. The one-way valve has a main runner, multiple shunt runners, and multiple stopper blocks. Each stopper block is located between the main runner and a corresponding shunt runner. The cover disposed on the one-way valve has a second hole communicated with the one-way valve and the chamber. When a fluid enters the one-way valve from the second hole, the fluid is discharged from the body through the first hole. When the fluid enters the one-way valve from the first hole, the fluid generates a resistance in the one-way valve.

Abstract: The present disclosure relates to an inverter module which can be coupled to another inverter module, the inverter module comprising: a main PCB having a main substrate on which a plurality of circuits are printed; a plurality of sub-PCBs coupled to the main PCB and each having one end exposed through the main PCB; and a case for receiving the main PCB and the sub-PCBs, wherein when the inverter module is coupled to another inverter module, the ends of the sub-PCBs exposed to the outside of the case are coupled to the another adjacent inverter module. According to the present disclosure, a plurality of inverter modules can be connected and used as one inverter system, and thus an inverter system having a required capacity can be easily implemented.

Abstract: Examples of hybrid cooling System for datacenters are disclosed. In an example, the hybrid cooling system includes a chiller plant to provide supply of coolant, an air-cooling unit (ACU), and a coolant distribution line. The coolant distribution line comprises a first portion, a second portion, and a third portion in series fluid communication. The ACU receives supply of the coolant from the chiller plant via the first portion. The hybrid cooling system further includes a coolant distribution unit (CDU) coupled to an electronic component in the data hall. The ACU and the CDU are in series fluid communication via the second portion of the coolant distribution line and the coolant egressing the ACU passes through the second portion to be fed back to the CDU. The hybrid cooling system includes a heat exchanger in series fluid communication with the CDU via the third portion of the coolant distribution line.

Abstract: A fluid cooling device includes a bottom plate, an adhesive layer and a spray cooling cover. The bottom plate includes a substrate and a chip, and the spray cooling cover is fixed on the bottom plate by an adhesive layer. In addition, the spray cooling cover includes a fluid inlet and a plurality of fluid outlets to utilize a working fluid to cool the chip directly.