Patents Examined by Antonio B Grite
  • Patent number: 11569419
    Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a semiconductor substrate, active devices and transparent conductive patterns. The active devices are formed on the semiconductor substrate. The transparent conductive patterns are formed over the active devices and electrically connected to the active devices. The transparent conductive patterns are made of a metal oxide material. The metal oxide material has a first crystalline phase with a prefer growth plane rich in oxygen vacancy, and has a second crystalline phase with a prefer growth plane poor in oxygen vacancy.
    Type: Grant
    Filed: October 30, 2020
    Date of Patent: January 31, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-En Yen, Ming-Da Cheng, Mirng-Ji Lii, Wen-Hsiung Lu, Cheng-Jen Lin, Chin-Wei Kang, Chang-Jung Hsueh
  • Patent number: 11443994
    Abstract: The present application provides an electronic package having an optoelectronic component and a laser component disposed on a packaging unit, with the optoelectronic component and the laser component being separated from each other. Since the laser component and the optoelectronic component are separated from each other, the electronic package has a reduced fabrication difficulty and a high yield rate. A method for fabricating the electronic package and an electronic packaging module having the electronic package are also provided.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: September 13, 2022
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Jin-Wei You, Cheng-Kai Chang
  • Patent number: 11424226
    Abstract: The invention relates to a light emitting device comprising: a support, at least two light-emitting elements at a top side of the support, first connection locations and a single second connection location at a bottom side of the support, wherein each light-emitting element comprises a first contact location and a second contact location at a side facing away from the support, each first contact location is connected to one of the first connection locations via a first connection, all of the second contact locations are connected to the second connection location via a second connection, the first connections run along an outer surface of the support, and the second connection runs through the support.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: August 23, 2022
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Seong Tak Koay, Adelene Geok Ling Ng, Chui Wai Chong, Teng Hai Chuah
  • Patent number: 11417808
    Abstract: A light emitting device includes: a resin package including first and second leads, and a resin part defining a recess defined by a lateral wall and an upward-facing surface, which includes an upper surface of a portion of each of the first lead, the second lead, and the resin part; and a light emitting element on the first lead. The resin part includes a holding resin portion between the first and second leads at the upward-facing surface, and a covering resin portion that covers a portion of the upper surface of the holding resin portion and a portion of an upper surface of at least one of the first and second leads. A portion of an upper surface of the holding resin portion is exposed from the covering resin portion, and is located on the same plane as the upper surfaces of the first and second leads.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: August 16, 2022
    Assignee: NICHIA CORPORATION
    Inventors: Kiyoshi Kayama, Shohei Mori, Akinobu Maeda
  • Patent number: 11355685
    Abstract: A light emitting diode including a lead frame unit and a light source unit disposed on the lead frame unit, in which the lead frame unit includes a body portion having a first surface contacting the light source unit and a second surface opposite to the first surface, at least one solder hole recessed from the second surface of the body portion, a first conductive layer disposed on the first surface of the body portion and including a circular portion having a substantially circular shape and an elongated portion provided integrally with the circular portion and elongating in one direction from the circular portion, a second conductive layer disposed on the second surface of the body portion, and a connection portion disposed between the first conductive layer and the second conductive layer and penetrating through the body portion.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: June 7, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Seung Li Choi, Se Min Bang, Se Won Tae
  • Patent number: 11327587
    Abstract: In various embodiments, bilayers are formed in electronic devices at least in part by anodization of metal-alloy base layers.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: May 10, 2022
    Assignee: H.C. STARCK INC.
    Inventors: Helia Jalili, Francois Dary, Barbara Cox
  • Patent number: 11329204
    Abstract: A micro light emitting diode (LED), including a first semiconductor layer doped with an n-type dopant; a second semiconductor layer doped with a p-type dopant; an active layer arranged between the first semiconductor layer and the second semiconductor layer, and configured to provide light; a first side surface including a vertical side surface of the first semiconductor layer; a second side surface tilted with respect to the first side surface, and including a first tilted side surface of the active layer and a second tilted side surface of the second semiconductor layer; an insulating layer arranged to surround the first side surface and the second side surface; and a reflective layer arranged to partially surround the insulating layer in an area of the insulating layer corresponding to the second side surface.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: May 10, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shunsuke Kimura, Sungtae Kim
  • Patent number: 11315902
    Abstract: Multi-semiconductor chip modules that have a substrate with a substrate surface, one or more first substrate connections, and one or more second substrate connections. One or more first semiconductor chips (chips) has one or more larger first chip connections and one or more smaller first chip connections on a first chip bottom surface. One or more of the larger first chip connections physically and electrically connected to a respective first substrate connection. One or more second chips has one or more larger second chip connections and one or more smaller second chip connections on a second chip bottom surface. One or more of the larger second chip connections physically and electrically connected to a respective second substrate connection. A bridge has a bridge thickness, a bridge surface, and one or more bridge connections on the bridge surface. A first part of the bridge surface is under the first chip bottom surface and a second part of the bridge surface is under the second chip bottom surface.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: April 26, 2022
    Assignee: International Business Machines Corporation
    Inventor: John Knickerbocker
  • Patent number: 11309469
    Abstract: A light emitting diode including a lead frame unit and a light source unit disposed on the lead frame unit, in which the lead frame unit includes a body portion having a first surface contacting the light source unit and a second surface opposite to the first surface, at least one solder hole recessed from the second surface of the body portion, a first conductive layer disposed on the first surface of the body portion and including a circular portion having a substantially circular shape and an elongated portion provided integrally with the circular portion and elongating in one direction from the circular portion, a second conductive layer disposed on the second surface of the body portion, and a connection portion disposed between the first conductive layer and the second conductive layer and penetrating through the body portion.
    Type: Grant
    Filed: August 30, 2019
    Date of Patent: April 19, 2022
    Assignee: Seoul Semiconductor Co., Ltd.
    Inventors: Seung Li Choi, Se Min Bang, Se Won Tae
  • Patent number: 11239402
    Abstract: An optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component are disclosed.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: February 1, 2022
    Assignee: OSRAM OLED GMBH
    Inventors: Simeon Katz, Markus Maute
  • Patent number: 11164754
    Abstract: Embodiments include forming an interposer having reinforcing structures disposed in a core layer of the interposer. The interposer may be attached to a package device by electrical connectors. The reinforcing structures provide rigidity and thermal dissipation for the package device. Some embodiments may include an interposer with an opening in an upper core layer of the interposer to a recessed bond pad. Some embodiments may also use connectors between the interposer and the package device where a solder material connected to the interposer surrounds a metal pillar connected to the package device.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: November 2, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Po-Hao Tsai, Ming-Chih Yew, Chia-Kuei Hsu, Shin-Puu Jeng, Po-Yao Chuang, Meng-Liang Lin, Shih-Ting Hung, Po-Yao Lin