Abstract: A Rogowski coil assembly (1) for measurement of high frequency electrical currents includes coil segments (3) disposed in series with retrospective impedance influence reduction coupling.

Abstract: Devices (10) support a use of investigation signals for investigating cable systems comprising cables (101) and loads (111). The loads (111) comprise rectifier circuits (201) coupled to storage circuits (202). The devices (10) comprise charger circuits (1) for producing charging signals for charging the storage circuits (202) such that they have reduced impacts on performances of the investigation signals. The devices (10) may further comprise discharger circuits (2) for discharging signaling circuits (121) after being charged by the charger circuits (1). The devices (10) may further comprise investigation circuits (3) for producing the investigation signals and controller circuits (4) for controlling the other circuits (1-3) and reception circuits (5) for receiving responses to the investigation signals and analysis circuits (6) for analyzing the responses in view of the investigation signals and for in response to analysis results defining a problem (102-104) and/or a location of a problem (102-104).

Abstract: An integrated circuit capable of on-chip jitter tolerance measurement includes a jitter generator circuit to produce a controlled amount of jitter that is injected into at least one clock signal, and a receive circuit to sample an input signal according to the at least one clock signal. The sampled data values output from the receiver are used to evaluate the integrated circuit's jitter tolerance.

Abstract: A magnetic-field sensor includes: a chip including a substrate having a first surface and an insulating layer covering the first surface; first and second magnetoresistors each extending into the insulating layer and having a main axis of magnetization and a secondary axis of magnetization; a first magnetic-field generator configured to generate a first magnetic field having field lines along the main axis of magnetization of the first magnetoresistor; a second magnetic-field generator configured to generate a second magnetic field having field lines along the main axis of magnetization of the second magnetoresistor. The main axes of magnetization extending transversely to each other and the secondary axes of magnetization extending transversely to each other. The first and second magnetoresistors extend into the insulating layer at a first distance and a second distance, respectively, that differ from one another, from the first surface.

Abstract: Disclosed herein is a test socket for camera modules, which enables automated inspection of camera modules. The test socket for camera modules includes a base plate provided with a loading unit on which a camera module to be tested is placed; a slider formed on the base plate and horizontally movable thereon; an upper plate formed on the slider to move up or down thereon, and including a cover corresponding to an upper portion of the camera module; a vertical cylinder allowing the upper plate to vertically reciprocate with respect to the slider; and a pin block formed on the loading unit or the cover and connected to a contact point of the camera module.

Abstract: A method includes coupling an electrical cable, including multiple wires, to circuitry including a resistor bank connected to the wires. A gain of the circuitry is measured including the cable. Based on the measured gain, one or more of the wires in the cable that are defective are identified. An indication of the defective wires is output.

Abstract: The invention relates to an arrangement for identifying a switching position of a switch (on an internal combustion engine in a handheld work apparatus. An energy source for supplying power to an inductive electrical load is provided, it being possible to connect the load to the energy source in order to be switched on and off via a controller. The switch is arranged in a voltage branch which is connected in parallel with the inductive load and in which a zener diode is also connected. The zener diode is activated or inactivated via the switch as a function of the switching position of the switch. The amplitude of the switch-off voltage, which is induced when the inductive load is disconnected, is limited by the zener diode, so that it is possible to read from the magnitude of the amplitude whether the switch is closed or open.

Abstract: A magnetic field sensor has a circular vertical Hall (CVH) sensing element with a plurality of vertical Hall elements disposed over a common implant region in a substrate. The plurality of vertical Hall elements is disposed in an x-y plane. The magnetic field sensor is responsive to a magnetic field generated by a multi-pole magnet having a plurality of north poles and also a plurality of south poles arranged in a plane parallel to the x-y plane, and, in some embodiments, arranged in the x-y plane. A corresponding method is also described.

Abstract: A cable measuring device for measuring a cable of a predetermined LAN cable category wherein the cable has at least one twisted conductive pair and jacket covering the same includes a computer based device which removes tail up effect on the impedance/return loss measurement and which addresses the effects of jacket removed on the reflection test results of LAN cables.

Abstract: An apparatus for calibrating a three-dimensional thermography fault isolation tool, includes: a substrate having two or more pins; a first semiconductor die coupled to the substrate; a first heat generating test component at the first semiconductor die; and a second heat generating test component, wherein the first heat generating test component and the second heat generating test component are located at different respective heights; wherein the first heat generating test component is configured to produce a first temperature change in response to a voltage applied by the three-dimensional thermography fault isolation tool to the two or more pins; and wherein the second heat generating test component is configured to produce a second temperature change in response to the voltage or another voltage applied by the three-dimensional thermography fault isolation tool.

Abstract: A diagnostic Electrochemical Impedance Spectroscopy (EIS) procedure is applied to measure values of impedance-related parameters for one or more sensing electrodes. The parameters may include real impedance, imaginary impedance, impedance magnitude, and/or phase angle. The measured values of the impedance-related parameters are then used in performing sensor diagnostics, calculating a highly-reliable fused sensor glucose value based on signals from a plurality of redundant sensing electrodes, calibrating sensors, detecting interferents within close proximity of one or more sensing electrodes, and testing surface area characteristics of electroplated electrodes. Advantageously, impedance-related parameters can be defined that are substantially glucose-independent over specific ranges of frequencies. An Application Specific Integrated Circuit (ASIC) enables implementation of the EIS-based diagnostics, fusion algorithms, and other processes based on measurement of EIS-based parameters.

Abstract: An electromagnetic induction position detection sensor includes a plurality of loop coils, each being an N-turn loop coil formed by winding a conductor N times (N is an integer equal to or greater than 2), and each coil turn having long side portions that are separated by a predetermined width and that are parallel to each other. The loop coils are arranged at predetermined intervals in a predetermined direction intersecting the long side portions of the loop coils. The width of at least one of the N turns of the Mth loop coil from the edge portion of the sensor in the predetermined direction (M is an integer equal to or greater than 2) is larger than the predetermined width, with the long side portion of this turn of the Mth loop coil arranged more outward than the long side portions of the other turns of the Mth loop coil.

Abstract: A testing jig includes a substrate, a carrier provided on the substrate, two conductive members made of a conductive material, and a compensation member made of a conductive material. The substrate has a signal circuit and a grounding circuit thereon. The carrier has a base board made of an insulating material and a conductive circuit made of a conductive material provided thereon. The base board has a signal perforation aligning with the signal circuit, a grounding perforation aligning with the grounding circuit, and multiple compensation holes. The conductive members both have an end exposed out of the carrier, and are respectively fitted in the signal perforation and the grounding perforation to make another end thereof contact the signal circuit or the grounding circuit. The compensation member is fitted in one of the compensation holes to be electrically connected to the conductive member in the grounding perforation through the conductive circuit.

Abstract: A test system is provided for performing radio-frequency tests on an electronic device under test (DUT) having multiple antennas. The test system may include a test unit for generating radio-frequency test signals, a test enclosure, and a test antenna fixture. The test fixture may include tunable antenna circuitry, antenna tuning elements, a test sensor, a microcontroller, a battery, and a solar cell that charges the battery, each of which is mounted on a test fixture within the test enclosure. The test sensor may be used to detect stimuli issued by the DUT. In response to detecting the stimuli, the microcontroller may send control signals to the antenna tuning elements to configure the antenna circuitry in different modes. Each of the different modes may be optimized to test a selected one of the multiple antennas in the DUT when operating using different radio access technologies and at different frequencies.

Abstract: An electric current-spin current conversion device according to the invention performs conversion between electric current and spin current utilizing the spin Hall effect or the inverse spin Hall effect of a 5d transition metal. A spin accumulation apparatus according to the invention includes a non-magnetic body in which injected spins are accumulated and an injection unit that injects spins into the non-magnetic body, wherein said injection unit comprises said electric current-spin current conversion device provided on said non-magnetic body, and an electric power source that supplies an electric current to said electric current-spin current conversion device in such a way that a spin current flowing toward said non-magnetic body is generated by the spin Hall effect.

Abstract: A semiconductor test system includes test head pins; per-pin resources which are connectable to the test head pins on a one-to-one basis; shared resources, each of which is connectable to one of the test head pins; a tester controller for controlling the per-pin resources and the shared resources; and a tabular-form test plan including: a first column for specifying a measurement function that uses at least one of the per-pin resources and the shared resources; and at least one second column for specifying input and output parameters of the measurement function, the tabular-form test plan further including program rows, the tabular-form test plan being executed by the tester controller, the tabular-form test plan further including a third column for specifying how rows that are executed by asynchronous parallel execution are to be grouped.

Abstract: An electromagnetic probe for non-destructive inspection of a twisted tube of a twisted tube heat exchanger comprising a probe body having a sensing section being configured to allow circulation of the probe body within the length of circular tube and the length of helical oval tube and to allow displacement of the electromagnetic sensor(s) from a radially inward contracted position to a radially outward expanded position in close proximity to an interior surface of a crest of the oval tube; a conduit attached to a proximal end of the probe body, the at least one conductor extending within the conduit to a remote end of the electromagnetic probe.

Abstract: Methods and apparatus for measuring the cleanliness of molten metals. Direct current is passed between electrodes through molten metal advancing through a passage in an electrically resistive wall. A voltage signal is analyzed for the presence of solid generally non-metallic inclusions in the metal. Direct current is supplied by one or more ultra-capacitors and the decay in discharge voltage of the capacitor(s) is compensated for by passing the current from each capacitor through a resistor ladder network circuit having resistors connected in parallel. Individual resistors are switched on or off in a sequence effective to change the resistance of the circuit and maintain the current within a predetermined range. Heat generation and noise pick-up are minimized by maintaining a low discharge voltage and measurement current while using FETs only in the fully ON or OFF conditions to switch the resistors into or out of the circuits.

Abstract: An electromagnetic device may include a magnetic flux core and an opening through the magnetic flux core. A conductor winding may be received in the opening and extend through the magnetic flux core. An electrical current flowing through the conductor winding generates a magnetic field about the conductor winding and a magnetic flux flow about the opening in the magnetic flux core. The electromagnetic device may also include a core flux sensor arrangement to detect a magnetic flux level in the magnetic flux core. The electromagnetic device may additionally include a core flux control system configured to adjust the electrical current flowing through the conductor winding to control the magnetic flux level in the magnetic flux core.

Abstract: A gate driver unit includes an input stage, an output stage, a read/write interface, and a monitoring stage. The input stage is configured to receive control signals and forward the control signals to the output stage and the monitoring stage. The read/write interface is configured to receive configuration data and forward the configuration data to the monitoring stage. The monitoring stage is configured to capture and evaluate signals of a power switch connected to the gate driver unit and synchronize the evaluation of the signals of the power switch to the control signals. The evaluation of the signals and the synchronization of the evaluation are based on the configuration data.