Abstract: Methods are provided for controlling voiding caused by gasses in solder joints of electronic assemblies. In various embodiments, a preform can be embedded into the solder paste prior to the component placement. The solder preform can be configured with a geometry such that it creates a standoff, or gap, between the components to be mounted in the solder paste. The method includes receiving a printed circuit board comprising a plurality of contact pads; depositing a volume of solder paste onto each of the plurality of contact pads; depositing a solder preform into each volume of solder paste; placing electronic components onto the printed circuit board such that contacts of the electronic components are aligned with corresponding contact pads of the printed circuit board; and reflow soldering the electronic components to the printed circuit board.

Abstract: A system for controlled motion of circuit components to create reconfigurable circuits comprising: a support; a substrate operatively associated with the support; actuators operatively associated with the support configured to physically move circuit components and to move the circuit components into physical and electrical contact with the substrate; the substrate comprising at least one conductive segment arranged to electrically connect circuit components when electrical contacts of circuit components are placed in contact with at least one conductive segment; and control circuitry configured to control the first and second actuators to thereby position the circuit components relative to the substrate; whereby circuit function is determined by the selection of circuit components and the location and orientation of circuit components relative to the substrate and conductive segments to create a reconfigurable circuit.

Abstract: A method of making a package for a fuel unit, a fuel unit including the package, and a hydrogen generator including one or more of the fuel units are disclosed. The package includes a package strip made by forming apertures in a nonconductive substrate strip, forming conductor sections in a conductor strip, aligning the substrate and conductor strips, bonding the conductor sections to the substrate strip to cover the apertures, and removing non-bonded portions of the conductor strip. A package enclosing a hydrogen generating reactant is formed by securing a segment of the package strip to itself, to one or more other segments and/or to one or more other package components. One or more conductor sections in the package strip are in thermal contact with one or more quantities of reactant composition so heat can be transferred thermally decompose the reactant composition and generate hydrogen gas.

Abstract: First and second measurement probes come into contact with first and second electrode pads, respectively, and third and fourth measurement probes come into contact with the first and second electrode pads, respectively. A current flows in a current path including the first and second electrode pads and a plurality of lines through the first and second measurement probes. A value of the current in the current path is measured, and a value of a voltage between the third and fourth measurement probes is measured. Conductivity between the first and second electrode pads is inspected based on the measured value of the current and the measured value of the voltage.

Abstract: A stackable variable height via package includes a substrate having a first surface and terminals thereon. The terminals include a first terminal and a second terminal. Vias are on the terminals, the vias including a first via on the first terminal and a second via on the second terminal. The first via has a height from the first surface of the substrate less than a height of the second via from the first surface of the substrate. The package further includes a package body and via apertures in the package body to expose the vias. Forming the stackable variable height via package with variable height vias readily accommodate stacking of additional packages having different types of terminals, e.g., LGA and BGA type packages, as well as variable degrees of warpage on the stackable variable height via package. Further, the vias are formed with a minimum pitch.

Abstract: A method for making thermoacoustic device includes following steps. A substrate having a first surface and second surface is provided. The first surface defines a plurality of grids. Grooves are formed on each of the plurality of grids. A first electrode and a second electrode are formed on each grid. The first electrode is spaced from the second electrode. One of the grooves is located between the first electrode and the second electrode. A number of carbon nanotube wires are applied on the first surface and electrically connected to the first electrode and the second electrode. A thermoacoustic device array is formed on the substrate by separating the carbon nanotube wires. A number of thermoacoustic device is formed by cutting the substrate according to the grids.

Abstract: Provided is a method of preparing a connection for an electrical conductor. The insulation layer of an electrical conductor is cut and the insulation is separated into a first portion and a second portion. The second portion is moved away from the first portion to at least partially expose conductor strands of the electrical conductor. A strand retainer is placed around the exposed conductor strands. The insulation second portion is removed from the electrical conductor. The exposed conductor strands are inserted into an electrical connector.

Abstract: A method produces a multilayer element with a substrate and at least one conductor structure connected in an areal manner to the substrate, which has first regions of electrically conductive material, which is present in accordance with a prescribed pattern, while electrically non-conductive second regions lie between the first regions.

Abstract: The present disclosure includes a method of assembling a power distribution box, that may include providing a circuit board and providing a first L-shaped terminal. The first L-shaped terminal may include a horizontal portion and a vertical portion. A second L-shaped terminal may include a horizontal portion and a vertical portion. In embodiments, the first terminal and/or the second terminal may be inserted into the circuit board such that the horizontal portion of the second terminal may be disposed above the horizontal portion of the first terminal with an air gap between the horizontal portion of the first terminal and the horizontal portion of the second terminal. A power distribution box cover may include a recess that may be configured to receive the first terminal and the second terminal without contacting the first terminal.

Abstract: A digital loudspeaker includes a substrate, a first stator fixed with respect to the substrate, a second stator fixed with respect to the substrate and spaced at a distance from the first stator, and a membrane between the first stator and the second stator. The membrane is displaceable between a first position in which the membrane mechanically contacts the first stator and a second position in which the membrane mechanically contacts the second stator. The first stator and the second stator are arranged to electrostatically move the membrane from a rest position spaced apart from the first position and the second position to the first position and the second position, respectively.

Abstract: The procedure for the manufacture and assembly of electronic boards includes the steps of: arranging a first electronic board (2) having a first power connector (7) of substantially elongated shape; arranging a second electronic board (10) having a through opening (14) suitable for allowing the passage of the first power connector (7); arranging a third electronic board (15) including a power circuit and having a second power connector (18) which can be connected to the first power connector (7); associating the second electronic board (10) with the first electronic board (2), wherein the step of associating includes inserting the first power connector (7) through the through opening (14); associating the third electronic board (15) with the second electronic board (10), wherein the step of associating includes connecting the second power connector (18) to the first power connector (7).

Abstract: A substrate supporting unit, a substrate processing apparatus, and a method of manufacturing the substrate supporting unit are provided. The substrate supporting unit includes a susceptor provided with heaters to heat a substrate placed on the susceptor, and including a first temperature region and a second temperature region having a higher temperature than that of the first temperature region; a heat dissipating member including a contact surface being in thermal contact with the second temperature region; and a reflecting member disposed approximately in parallel with one surface of the susceptor to reflect heat emitted from the susceptor toward the susceptor.

Abstract: An electrosurgical instrument is manufactured by presenting an electrode, and attaching a sacrificial portion to the electrode to form a first electrode assembly. An insulating material is molded over the first electrode assembly to form a second electrode assembly, and the second electrode assembly is subjected to a further process which is capable of removing the sacrificial portion without removing the insulating material. The sacrificial portion is removed to form at least one cavity within the electrosurgical instrument.

Abstract: Provided is a flexible device, which includes a flexible substrate, a plurality of electrode lines provided on the flexible substrate and configured to contact the following anisotropic conductive film and then extend to a side of the flexible substrate, an anisotropic conductive film configured to contact the electrode line and laminated on the flexible substrate, a plurality of bumps provided on the anisotropic conductive film, and a circuit board having an electronic device provided at one side thereof and configured to contact the plurality of bumps.

Abstract: Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other configurations including contact pads. A method for forming an electronic assembly includes providing a tacky layer. Then an electronic circuit component is provided having a first side and a second side, where the first side carries the electronic elements. The first side of the electronic circuit component is positioned into contact with the tacky layer. A bonding material is then deposited to a portion of the adhesive layer that is not covered by the first side of the electronic circuit component, to a depth which is sufficient to cover at least a portion of the electronic circuit component. The bonding material is then fixed or cured into a fixed or cured bonding material, and the tacky layer is removed.

Abstract: A method of making a multilayered, fusion bonded circuit structure. A first circuitry layer is attached to a first major surface of a first LCP substrate. A plurality of first recesses are formed that extend from a second major surface of the first substrate to the first circuitry layer. The first recesses are then plated to form a plurality of first conductive pillars of solid metal that substantially fill the first recesses. A plurality of second recesses are formed in a second LCP substrate corresponding to a plurality of the first conductive pillars. The second recess are plated to form a plurality of second conductive structures that extend between first and second major surfaces of the second substrate. The second major surface of the first substrate is positioned adjacent to the second major surface of the second substrate. The first conductive pillars are aligned with the second conductive structures.

Abstract: A high-frequency transmission line includes an insulator as a base material, and also includes linear conductors configured to transmit signals. Through holes are provided at positions corresponding to the positions of the linear conductors. The high-frequency transmission line is arranged on a connector in a state in which the positions of the bottom ends of the through holes are respectively aligned with the positions of signal terminals provided on the connector. A conductive bonding material provided at the top ends of the through holes is fluidized when heat is applied thereto, and flows to the bottom ends of the through holes due to surface tension or capillarity. As a result, the linear conductors are electrically connected to the signal terminals respectively.

Abstract: A system and method form charge patterns on micro objects. The system and method employ a micro object including a rectifying device. The rectifying device exhibits an asymmetric current-voltage (I-V) response curve. Further, the system and method employ a device external to the micro object to induce the flow of charge through the rectifying device.

Abstract: The present invention relates to a tantalum wire for anode lead of tantalum capacitors, characterized in that the cross section of the tantalum wire is approximate rectangular or regular rectangular. The present invention also relates to a process for manufacturing the tantalum wire, comprising the steps of: providing feedstock tantalum wire; subjecting the feedstock tantalum wire to heat treatment; subjecting the heat treated tantalum wire to surface pretreatment to form an oxide membrane on the surface-pretreated tantalum wire; rolling the surface-pretreated tantalum wire by lubricating with lubricant oil to make the cross section of the rolled tantalum wire being approximate rectangular or regular rectangular; subjecting the tantalum wire to final annealing.

Abstract: A method of forming at least one Micro-Electro-Mechanical System (MEMS) includes forming a beam structure and an electrode on an insulator layer, remote from the beam structure. The method further includes forming at least one sacrificial layer over the beam structure, and remote from the electrode. The method further includes forming a lid structure over the at least one sacrificial layer and the electrode. The method further includes providing simultaneously a vent hole through the lid structure to expose the sacrificial layer and to form a partial via over the electrode. The method further includes venting the sacrificial layer to form a cavity. The method further includes sealing the vent hole with material. The method further includes forming a final via in the lid structure to the electrode, through the partial via.