Abstract: A method for manufacturing a wiring board includes preparing a core substrate having first and second surfaces, forming a first build-up structure including interlayer insulating layers and conductor layers on the first surface of the substrate, and forming a second build-up structure including interlayer insulating layers and one or more conductor layers on the second surface of the substrate. The forming of the first structure includes laminating the insulating layers and metal layers on first surface side of the substrate and forming the conductor layers from all of the metal layers on the first surface side, and the forming of the second structure includes laminating the insulating layers and metal layers on second surface side of the substrate, forming the one or more conductor layers from one or more of the metal layers on the second surface side, and entirely removing the other metal layers on the second surface side.

Abstract: A method of forming a heater assembly for use in semiconductor processing includes thermally securing a heater substrate to an application substrate; and applying a layered heater having at least one functional layer to the heater substrate after the heater substrate is secured to the application substrate. The heater substrate defines a material having a coefficient of thermal expansion that is matched to a coefficient of thermal expansion of the functional layer. The material of the functional layer is not capable of withstanding the elevated temperature of the thermal securing step.

Abstract: A method of providing a single structure multiple mode antenna is described. The antenna is preferably constructed having a first inductor coil that is electrically connected in series with a second inductor coil. The antenna is constructed having a plurality of electrical connections positioned along the first and second inductor coils. A plurality of terminals is connected to the electrical connections that facilitate numerous electrical connections and enables the antenna to be selectively tuned to various frequencies and frequency bands.

Abstract: Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.

Abstract: Methods of and devices for coupling metal woven mesh or metal woven fabric with IC components to make flexible circuits are disclosed. The flexible circuits can be used to make wearable electronic devices, such as a garment with embedded IC chip.

Abstract: In one implementation, the presently disclosed technology teaches an apparatus with a head attached to an end of a baseplate. The baseplate includes a tilted section that causes a torsion axis of the baseplate to pass near the head. In another implementation, the presently disclosed technology teaches an apparatus with a load beam attached to a baseplate. The apparatus also includes a head attached to an opposite end of the load beam from the baseplate. The baseplate includes a mass-shifted section that causes a torsion axis of the apparatus to pass through the head. In yet another implementation, the presently disclosed technology teaches a method for reducing baseplate resonance amplitude. The method includes shifting a baseplate mass on a suspension toward an adjacent disc surface to move a baseplate torsion axis to pass near a head.

Abstract: A method of fabricating a single structure multiple mode antenna is described. The antenna is preferably constructed having a first inductor coil that is electrically connected in series with a second inductor coil. The antenna is constructed having a plurality of electrical connections positioned along the first and second inductor coils. A plurality of terminals is connected to the electrical connections that facilitate numerous electrical connections and enables the antenna to be selectively tuned to various frequencies and frequency bands.

Abstract: An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.

Abstract: A method of dispersing semiconductor chips from a wafer of semiconductor chips onto a substrate while preserving the neighboring relationship of each chip to each adjacent chip is disclosed. The method includes dispersing the wafer into sequential columns of semiconductor chips with a first pitch between columns while preserving the neighboring relationship and sequentially dispersing the columns of semiconductor chips into rows of individual chips with a second pitch between rows onto a substrate while preserving the neighboring relationship.

Abstract: A method of manufacturing a flexible electronic device is described. The method comprises arranging an electronic component on a temporary carrier, providing a flexible laminate comprising an adhesive layer, pressing the temporary carrier and the flexible laminate together with the adhesive layer facing the temporary carrier such that the electronic component is pushed into the adhesive layer, and removing the temporary carrier. Further, a corresponding flexible electronic device is described.

Abstract: A method for assembling a housing for a high voltage electrical switch includes providing a tubular body having a top portion and a bottom portion opposite the top portion, wherein the tubular body is configured to receive a vacuum bottle assembly within the tubular body; sliding a first shed sleeve over an outside surface of the top portion without creating a permanent bond, wherein an interior surface of the first shed sleeve forms a dielectric interface between the outside surface of the top portion and the interior surface of the first shed sleeve; and sliding a second shed sleeve over an outside surface of the bottom portion without creating a permanent bond, wherein an interior surface of the second shed sleeve forms a dielectric interface between the outside surface of the bottom portion and the interior surface of the second shed sleeve.

Abstract: The disclosure provides a cross-linkable polymer composition, a core layer for an information carrying card comprising such cross-linked composition, resulting information carrying card, and methods of making the same. A crosslinkable polymer composition comprises a curable base polymer resin in a liquid or paste form, and a particulate thermoplastic filler. The base polymer resin is selected from the group consisting of urethane acrylate, silicone acrylate, epoxy acrylate, urethane, acrylate, silicone and epoxy. The particulate thermoplastic filler may be polyolefin, polyvinyl chloride (PVC), a copolymer of vinyl chloride and at least another monomer, or a polyester such as polyethylene terephthalate (PET), a compound or blend thereof.

Abstract: A connector-soldering aid (1) for soldering single and/or cable wires to a connector comprises a connector mount (5) with a first stand (9) and a cable mount (7) with a second stand (31). The connector mount (5) has a base body (17), which is arranged on the first stand (9) and is rotatable relative to the latter about a fixed axis of rotation (19). The connector mount (5) further comprises a replaceable attachment (21) with a connector receiver and a centring device (23) for centring the attachment (21). The centring device (23) is arranged on the base body (17) and is further formed to centre the attachment (21) such that the connector receiver is positioned centrally in relation to the axis of rotation (19) of the base body (17).

Abstract: A method comprising; transferring a holding liquid into at least one pocket of a carrier tape, the at least one pocket comprising a recess within the carrier tape configured to receive an electronic component; placing an electronic component into the at least one pocket whereby the holding liquid acts to retain the electronic component within the pocket; and applying a sealing tape over the carrier tape to close the pocket with the electronic component therein.

Abstract: A method of manufacturing a flexible electronic circuit is provided. The method may include forming a positive photoresist mold on a flexible polymer substrate having a plurality of metal traces. The method may also include applying a conformal material coating over the positive photoresist mold, the flexible polymer substrate, and the metal traces. The method may further include removing an excess of the conformal material coating by running a blade over the positive photoresist mold. The method may also include removing the positive photoresist mold to reveal a cavity defined by the conformal material coating. The method may further include dispensing an anisotropic conductive paste into the cavity and inserting a chip into the cavity and bonding the chip to the metal traces.

Abstract: A manufacturing method for a rotating electric machine, in which the distal end portions of a plurality of coil ends, which are projected from slots of a stator core of a rotating electric machine and which are arranged in the radial direction of the stator core to form a plurality of layers, are held, and the coil ends are twisted and bent while moving the distal end portions in the circumferential direction. Neutral lines for bending the coil ends are different for each layer, and the neutral lines for the bending are positioned on farther outer sides for coil ends of farther outer layers.

Abstract: To provide a method and a device for manufacturing a connection structure (1) and a wire harness (2). The connection structure connects an insulated wire (100) comprising a wire tip portion (103), an insulating covering (102) being stripped from the tip thereof, to a crimp terminal (200) comprising a closed-barrel-type crimping portion (230) allowing crimp connection with the wire tip portion (103) and has stable conductivity by crimping an aluminum core wire (101) by the crimping portion (230). The method comprises a carrier cutting step for separating crimp terminals (200) from a terminal connecting belt (300) comprising the crimp terminals (200) attached to a carrier (250) in a longitudinal direction, a wire insertion step for inserting wire tip portions (103) into the crimping portions (230) of the separated crimp terminals (200), and a crimping step for crimping the crimping portions (230) with the inserted wire tip portions (103).

Abstract: A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.

Abstract: An electronic component to be encapsulated is introduced into a mold cavity. The mold cavity includes at least first and second halves, and at least one of the halves is formed with a negative of a thermal-interface-material engaging pattern thereon. An encapsulating material, which encapsulates the electronic component and engages the negative of the thermal-interface-material engaging pattern, is introduced into the mold cavity. The encapsulating material is allowed to solidify such that a thermal-interface-material engaging surface of the encapsulant solidifies with the thermal-interface-material engaging pattern thereon. During subsequent assembly, the thermal-interface-material engaging pattern engages thermal interface material to resist lateral motion of the thermal interface material.

Abstract: A corona igniter (20) includes a metal shell (32) with a corona reducing lip (38) spaced from an insulator (26) and being free of sharp edges (40) to prevent arcing (42) in a rollover region and concentrate the electrical field at an electrode firing end (48). The corona reducing lip (38) includes lip outer surfaces (88) being round, convex, concave, or curving continuously with smooth transitions (90) therebetween. The corona reducing lip (38) includes lip outer surfaces (88) presenting spherical lip radii (rl) being at least 0.004 inches. The corona igniter (20) also includes shell inner surfaces (104) and insulator outer surfaces (75) facing one another being free of sharp edges (40).