Abstract: This device for locking in a rack the front face (2) of a drawer (1) for electronic board(s) comprises a bolt (9) mounted so as to slide on the front face between a position locking it in a strike plate (11) carried by the rack and an unlocking position, and a pivoted lever (10) adapted to displace the bolt (9) between the locking and unlocking positions when it is turned respectively between a position in which it is substantially folded down along the front face (2) and a gripping position in which it projects with respect to the front face. The lever (10) is pivoted on the bolt (9) and is movable in translation together with the latter, and the lever (10) and the front face (2) have complementary members which cooperate to displace the bolt (9) and the lever (10) in translation when the lever is turned between the folded-down position and the gripping position.

Abstract: A surface mountable molded electronic component (100) is made from formed wire having a main portion (202) and end portions (102 and 104) connected to the main portion (202). The electronic component (100) includes a first and second recess areas (108 and 110) in molded section (114) for allowing the end portions (102 and 104) to lie inside and provide for the component (100) to be surfaced mounted onto a printed circuit board.

Abstract: A semiconductor package comprises a ceramic base component, a plurality of bonding pads of an electrically conductive metallic material, first and second electrically conductive buses, a signal shielding component which contains first and second electrically conductive plates electrically insulated from each other by a high temperature dielectric material wherein the shielding component is bonded to the base component outward of the bonding pad and the buses. A layer of a dielectric material covers the surface of the shielding component and a glass frit is bonded to the layer of dielectric material. The frit has the leads that extend from a metallic lead frame embedded in its outer surface. The leads, the dielectric layer and the signal shielding component are in substantial alignment The leads are electrically connected to the bonding pad and the first and second electrically conductive layers are connected to the first and second electrically conductive buses.

Abstract: To reduce the electro-magnetic interference (EMI) of a digital computer, the EMI contact of this invention is snapped into place in the chassis of the computer and the cover for the computer is then placed over the chassis with the contact surfaces of the EMI contact firmly engaging the cover to provide grounding between the cover and the chassis, thereby reducing EMI.

Abstract: An underwater cable has a flexible, elongated core surrounded by a flexible, elongated jacket. A distributed jacket includes a helically displaced phase shifter to decouple the cable from strumming produced by shedding of von Karman vortex streets from the cable.

Abstract: A package for electronic components and especially hybrid components comprises a base, an enclosure formed by lateral walls and a lid having the function of hermetically sealing the package while bearing on a top end of the lateral walls. At least one lateral wall having through-holes for conductors which serve to establish a connection between the interior of the package and the exterior is provided with at least one longitudinal groove in an upper portion located between the through-holes and the top end of the wall.

Abstract: The exposed portions of the leads of a semiconductor chip package are first bent in a forming process so that the ends of the leads are in proper positions to be attached to and electrically connected to contacts on a printed circuit board. Intermediate portions of the leads between the distal ends and the package body for connection to the printed circuit board and the package body are enclosed and fixed in position by a carrier body to hold the leads in position and to reduce the effects of any bending in destroying the coplanarity of the distal lead ends of the package. The package with the carrier body may be mounted onto the printed circuit board without first removing the carrier body. After the distal ends of the leads have been soldered to the printed circuit board, the carrier body is then removed.

Abstract: The winding support comprises a first cylindrical portion (1) which comprises a winding space for a coil winding which is situated between a first wire fastening units (7) and a wire guide (5), and a second portion (3) which is situated in the prolongation thereof and which is shaped as a semi-cylinder with a flat supporting face (17) for mounting an electronic component (23) which comprises contact pads (25, 27). The component (23) is mounted in a recess (19) at the area of the lacking cylinder half, which recess is axially bounded by the wire guide (5) on the one side and by a second wire fastening units (21) on the other side. Lead-out wires (31, 41) of the coil winding are guided, by way of the wire guide (5), across the contact pads (25, 27) to the second wire fastening units (21) whereto they are fastened. Subsequently, soldered or welded joints (43, 45) are formed between the lead-out wires (31, 41) and the contact pads (25, 27) by way of a thermal treatment.

Abstract: A structure for fixing a shielding window so as to cover an opening formed in a cover of an electronic equipment comprising: a cover having a bonnet and a metallic shielding plate connected to a reverse side of the bonnet, the cover being entirely coated with an insulating layer, the reverse surface of the cover being further coated with a conductive layer; a shielding window with a conductive member embedded therein being mechanically fixed to the cover with an adhesive provided in a plurality of fixing holes formed on the outer peripheral flange surface of the shielding window; and a plurality of holes penetrating through the flange surface of said shielding window, conductive layer, and insulating layer to the shielding plate, and being filled with a conductive adhesive so as to electrically connect the conductive member of the shielding window with the shielding plate.

Abstract: A ferrite composition comprising ferrite, borosilicate glass, and optionally boron oxide can be fired at a relatively low temperature of up to 950.degree. C. into a sintered body having improved mechanical strength and electromagnetic properties. The sintered ferrite body is used to form a chip inductor. The inductor is combined with a capacitor to form a composite LC part.

Abstract: An EMI shielding gasket made of springy electrically conductive material. The gasket includes a pair of generally parallel laterally spaced apart U-shaped channel members each with its channel entrance facing away from the other member. A pair of ends oriented transversely of the U-shaped channel members connect the members together at their end regions. The ends are resiliently deformable to allow the U-shaped channel members to be moved more closely together to facilitate mounting the gasket.

Abstract: A seal for blocking propagation of electromagnetic energy through a gap between bodies having conductive surfaces at least adjacent the gap includes an elongated core element defining a resiliently compressible cross section which can be molded, extruded or otherwise formed. At least one elongated conductive sheath portion is attached to the core element at a surface of the core element exposed to the conductive surfaces of the bodies. The conductive sheath portion extends only part way around said cross section and defines ends which are spaced on the core element and are non-overlapping. Preferably, at least one additional sheath portion is attached to the core element and extends between the ends of the conductive sheath portions. The conductive sheath can include metal fibers or metallized resin fibers, woven or nonwoven. Preferably, the conductive sheath portion is a metallized fabric and the additional sheath portion is a nonconductive resin suitable for making an environmental seal.

Abstract: A superconducting wire is formed by twisting a bundle of a plurality of superconducting material filaments in which one material filament is arranged in a central portion of the filament bundle and a plurality of other material filaments arranged outside the central material filament so as to surround the central one. The filament bundle is twisted in that the central material filament is substituted with another one of outer material filaments one by one in order periodically during a twisting process along an axial direction of the filament bundle.

Abstract: An electromagnet insert for a data coupler comprises a dielectric member defining positions for at least one electromagnet with mating faces of the electromagnet exposed in one direction along a common planar surface. The member includes a pair of wire-receiving arcuate channels coursing from one side to an opposite side of the member defining pathways on each side of a central leg of the electromagnet. The arcuate channels are shaped to match the optimum-shaped loop of a twisted pair cable of a data bus.

Abstract: A lead wire array for a leadless chip carrier which functions to mount and electrically interconnect a leadless chip carrier to a printed wiring board. The array is formed from a length of bare wire which is appropriately folded and bent to provide interconnections between the contact pads on the leadless chip carrier and contact pads on the printed wiring board, which are then separated by removing portions of the lead wire array after its attachment to the leadless chip carrier.