Patents Examined by B. S. Everhart
  • Semiconductor device metallization process
    Patent number: 4837183
    Abstract: A metallization process for semiconductor devices wherein the metal deposition steps are performed at higher wafer temperatures than subsequent processing steps. The correlation between wafer temperature and maximum grain width is prevalent in many metals used for semiconductor device metallization such as aluminum. Therefore, by measuring and controlling the maximum grain width of the deposited metal during metal deposition steps, it is possible to control and adjust the wafer temperature.
    Type: Grant
    Filed: May 2, 1988
    Date of Patent: June 6, 1989
    Assignee: Motorola Inc.
    Inventors: Anthony Polito, Irenee M. Pages